JPH0396038U - - Google Patents

Info

Publication number
JPH0396038U
JPH0396038U JP408190U JP408190U JPH0396038U JP H0396038 U JPH0396038 U JP H0396038U JP 408190 U JP408190 U JP 408190U JP 408190 U JP408190 U JP 408190U JP H0396038 U JPH0396038 U JP H0396038U
Authority
JP
Japan
Prior art keywords
semiconductor element
tapered surface
contact type
die bonding
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP408190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP408190U priority Critical patent/JPH0396038U/ja
Publication of JPH0396038U publication Critical patent/JPH0396038U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP408190U 1990-01-18 1990-01-18 Pending JPH0396038U (US20030220297A1-20031127-C00033.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP408190U JPH0396038U (US20030220297A1-20031127-C00033.png) 1990-01-18 1990-01-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP408190U JPH0396038U (US20030220297A1-20031127-C00033.png) 1990-01-18 1990-01-18

Publications (1)

Publication Number Publication Date
JPH0396038U true JPH0396038U (US20030220297A1-20031127-C00033.png) 1991-10-01

Family

ID=31507844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP408190U Pending JPH0396038U (US20030220297A1-20031127-C00033.png) 1990-01-18 1990-01-18

Country Status (1)

Country Link
JP (1) JPH0396038U (US20030220297A1-20031127-C00033.png)

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