JPH0395636U - - Google Patents
Info
- Publication number
- JPH0395636U JPH0395636U JP1990001680U JP168090U JPH0395636U JP H0395636 U JPH0395636 U JP H0395636U JP 1990001680 U JP1990001680 U JP 1990001680U JP 168090 U JP168090 U JP 168090U JP H0395636 U JPH0395636 U JP H0395636U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- barrier metal
- metal layer
- layer
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
- H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990001680U JPH0395636U (enExample) | 1990-01-16 | 1990-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990001680U JPH0395636U (enExample) | 1990-01-16 | 1990-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395636U true JPH0395636U (enExample) | 1991-09-30 |
Family
ID=31505574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990001680U Pending JPH0395636U (enExample) | 1990-01-16 | 1990-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395636U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (en) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Soldering member for printed wiring boards |
| JP2002299381A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Special Metals Co Ltd | はんだめっきボールおよびそれを用いた半導体接続構造の製造方法 |
-
1990
- 1990-01-16 JP JP1990001680U patent/JPH0395636U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (en) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Soldering member for printed wiring boards |
| JP2002299381A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Special Metals Co Ltd | はんだめっきボールおよびそれを用いた半導体接続構造の製造方法 |