JPH0395636U - - Google Patents
Info
- Publication number
- JPH0395636U JPH0395636U JP168090U JP168090U JPH0395636U JP H0395636 U JPH0395636 U JP H0395636U JP 168090 U JP168090 U JP 168090U JP 168090 U JP168090 U JP 168090U JP H0395636 U JPH0395636 U JP H0395636U
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- barrier metal
- metal layer
- layer
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP168090U JPH0395636U (de) | 1990-01-16 | 1990-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP168090U JPH0395636U (de) | 1990-01-16 | 1990-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395636U true JPH0395636U (de) | 1991-09-30 |
Family
ID=31505574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP168090U Pending JPH0395636U (de) | 1990-01-16 | 1990-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395636U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (fr) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Element de brasage tendre pour cartes a circuit imprime |
| JP2002299381A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Special Metals Co Ltd | はんだめっきボールおよびそれを用いた半導体接続構造の製造方法 |
-
1990
- 1990-01-16 JP JP168090U patent/JPH0395636U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (fr) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Element de brasage tendre pour cartes a circuit imprime |
| JP2002299381A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Special Metals Co Ltd | はんだめっきボールおよびそれを用いた半導体接続構造の製造方法 |
| JP4488642B2 (ja) * | 2001-03-30 | 2010-06-23 | 株式会社Ｎｅｏｍａｘマテリアル | はんだめっきボールおよびそれを用いた半導体接続構造の製造方法 |