JPH0395636U - - Google Patents

Info

Publication number
JPH0395636U
JPH0395636U JP1990001680U JP168090U JPH0395636U JP H0395636 U JPH0395636 U JP H0395636U JP 1990001680 U JP1990001680 U JP 1990001680U JP 168090 U JP168090 U JP 168090U JP H0395636 U JPH0395636 U JP H0395636U
Authority
JP
Japan
Prior art keywords
melting point
barrier metal
metal layer
layer
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990001680U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990001680U priority Critical patent/JPH0395636U/ja
Publication of JPH0395636U publication Critical patent/JPH0395636U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/01225—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1990001680U 1990-01-16 1990-01-16 Pending JPH0395636U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990001680U JPH0395636U (cg-RX-API-DMAC10.html) 1990-01-16 1990-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990001680U JPH0395636U (cg-RX-API-DMAC10.html) 1990-01-16 1990-01-16

Publications (1)

Publication Number Publication Date
JPH0395636U true JPH0395636U (cg-RX-API-DMAC10.html) 1991-09-30

Family

ID=31505574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990001680U Pending JPH0395636U (cg-RX-API-DMAC10.html) 1990-01-16 1990-01-16

Country Status (1)

Country Link
JP (1) JPH0395636U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056217A1 (en) * 1997-06-04 1998-12-10 Ibiden Co., Ltd. Soldering member for printed wiring boards
JP2002299381A (ja) * 2001-03-30 2002-10-11 Sumitomo Special Metals Co Ltd はんだめっきボールおよびそれを用いた半導体接続構造の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056217A1 (en) * 1997-06-04 1998-12-10 Ibiden Co., Ltd. Soldering member for printed wiring boards
JP2002299381A (ja) * 2001-03-30 2002-10-11 Sumitomo Special Metals Co Ltd はんだめっきボールおよびそれを用いた半導体接続構造の製造方法

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