JPH0395186U - - Google Patents
Info
- Publication number
- JPH0395186U JPH0395186U JP1990004713U JP471390U JPH0395186U JP H0395186 U JPH0395186 U JP H0395186U JP 1990004713 U JP1990004713 U JP 1990004713U JP 471390 U JP471390 U JP 471390U JP H0395186 U JPH0395186 U JP H0395186U
- Authority
- JP
- Japan
- Prior art keywords
- processing
- dimensional laser
- nozzle
- processing device
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Description
第１図、第２図は、この考案の一実施例による
３次元レーザ加工装置の加工ヘツド保護用加工ノ
ズルの構造を示す正面図及び配線図、第３図はこ
の考案の一実施例による装置を用いた作用を示す
断面側面図、第４図は一般的な３次元レーザ加工
装置の構成を示す斜視図である。
図において、１……ノズルＢ、２……ノズルＡ
、３……加工ヘツド、５……板Ａ、６……板Ｂ、
７……板Ｃ、９……Ａ−Ｂ間短絡板、１０……Ｃ
−Ｄ間短絡板、１１……絶縁リング、１６……Ｂ
−Ｃ間短絡線である。なお、図中、同一符号は同
一、又は相当部分を示す。
1 and 2 are a front view and a wiring diagram showing the structure of a processing nozzle for protecting the processing head of a three-dimensional laser processing device according to an embodiment of this invention, and FIG. 3 is an apparatus according to an embodiment of this invention. FIG. 4 is a cross-sectional side view showing the effect of using the laser beam, and FIG. 4 is a perspective view showing the configuration of a general three-dimensional laser processing device. In the figure, 1... nozzle B, 2... nozzle A
, 3... Processing head, 5... Board A, 6... Board B,
7...Plate C, 9...A-B shorting plate, 10...C
-D short-circuit plate, 11...Insulation ring, 16...B
This is a short-circuit wire between -C. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
着剤を用いて固定した加工ノズルをもつ３次元レ
ーザ加工装置の加工ヘツド保護用加工ノズル。 A processing nozzle for protecting the processing head of a three-dimensional laser processing device, which has a processing nozzle fixed to the tip of the processing head of the three-dimensional laser processing device using an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004713U JPH0395186U (en) | 1990-01-23 | 1990-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004713U JPH0395186U (en) | 1990-01-23 | 1990-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395186U true JPH0395186U (en) | 1991-09-27 |
Family
ID=31508448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990004713U Pending JPH0395186U (en) | 1990-01-23 | 1990-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395186U (en) |
-
1990
- 1990-01-23 JP JP1990004713U patent/JPH0395186U/ja active Pending