JPH0392045U - - Google Patents

Info

Publication number
JPH0392045U
JPH0392045U JP1990013052U JP1305290U JPH0392045U JP H0392045 U JPH0392045 U JP H0392045U JP 1990013052 U JP1990013052 U JP 1990013052U JP 1305290 U JP1305290 U JP 1305290U JP H0392045 U JPH0392045 U JP H0392045U
Authority
JP
Japan
Prior art keywords
semiconductor chip
sealing structure
hollow covering
structure according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990013052U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990013052U priority Critical patent/JPH0392045U/ja
Publication of JPH0392045U publication Critical patent/JPH0392045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884—

Landscapes

  • Die Bonding (AREA)
JP1990013052U 1989-10-31 1990-02-15 Pending JPH0392045U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990013052U JPH0392045U (cg-RX-API-DMAC10.html) 1989-10-31 1990-02-15

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12663789 1989-10-31
JP1990013052U JPH0392045U (cg-RX-API-DMAC10.html) 1989-10-31 1990-02-15

Publications (1)

Publication Number Publication Date
JPH0392045U true JPH0392045U (cg-RX-API-DMAC10.html) 1991-09-19

Family

ID=31889815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990013052U Pending JPH0392045U (cg-RX-API-DMAC10.html) 1989-10-31 1990-02-15

Country Status (1)

Country Link
JP (1) JPH0392045U (cg-RX-API-DMAC10.html)

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