JPH0392039U - - Google Patents
Info
- Publication number
- JPH0392039U JPH0392039U JP15170289U JP15170289U JPH0392039U JP H0392039 U JPH0392039 U JP H0392039U JP 15170289 U JP15170289 U JP 15170289U JP 15170289 U JP15170289 U JP 15170289U JP H0392039 U JPH0392039 U JP H0392039U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- sealant
- electrode
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000565 sealant Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170289U JPH0392039U (hu) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170289U JPH0392039U (hu) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392039U true JPH0392039U (hu) | 1991-09-19 |
Family
ID=31697989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15170289U Pending JPH0392039U (hu) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392039U (hu) |
-
1989
- 1989-12-29 JP JP15170289U patent/JPH0392039U/ja active Pending