JPH0390582A - Method for plating solid wax - Google Patents
Method for plating solid waxInfo
- Publication number
- JPH0390582A JPH0390582A JP22769089A JP22769089A JPH0390582A JP H0390582 A JPH0390582 A JP H0390582A JP 22769089 A JP22769089 A JP 22769089A JP 22769089 A JP22769089 A JP 22769089A JP H0390582 A JPH0390582 A JP H0390582A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- plating
- solid wax
- solution containing
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 239000007787 solid Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 36
- 238000005530 etching Methods 0.000 claims abstract description 24
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 230000003750 conditioning effect Effects 0.000 claims abstract description 11
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims abstract description 8
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- 230000001476 alcoholic effect Effects 0.000 claims abstract 3
- 239000000243 solution Substances 0.000 claims description 43
- 238000011282 treatment Methods 0.000 claims description 29
- -1 amine compound Chemical class 0.000 claims description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- 239000003945 anionic surfactant Substances 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003093 cationic surfactant Substances 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 claims description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 claims description 4
- 150000003973 alkyl amines Chemical class 0.000 claims description 4
- 239000002280 amphoteric surfactant Substances 0.000 claims description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- FQYVVSNFPLKMNU-UHFFFAOYSA-N 1,2-dipentylbenzene Chemical compound CCCCCC1=CC=CC=C1CCCCC FQYVVSNFPLKMNU-UHFFFAOYSA-N 0.000 claims description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 2
- 235000011187 glycerol Nutrition 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 21
- 238000007772 electroless plating Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 230000001143 conditioned effect Effects 0.000 abstract 2
- 239000003513 alkali Substances 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 239000001993 wax Substances 0.000 description 32
- 238000005406 washing Methods 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 229920000298 Cellophane Polymers 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- ANRCSZILOHNONR-UHFFFAOYSA-N acetic acid;hexadecan-1-amine Chemical compound CC([O-])=O.CCCCCCCCCCCCCCCC[NH3+] ANRCSZILOHNONR-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000012164 animal wax Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- HBRNMIYLJIXXEE-UHFFFAOYSA-N dodecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCN HBRNMIYLJIXXEE-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 210000000744 eyelid Anatomy 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012184 mineral wax Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- UPHWVVKYDQHTCF-UHFFFAOYSA-N octadecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCCCCCCCN UPHWVVKYDQHTCF-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- SDVHRXOTTYYKRY-UHFFFAOYSA-J tetrasodium;dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)P([O-])([O-])=O SDVHRXOTTYYKRY-UHFFFAOYSA-J 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000012178 vegetable wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、固形ワックスへのめっき処理方法に関する。[Detailed description of the invention] Industrial applications The present invention relates to a method for plating solid wax.
ワックスは電気特性、特に電気絶縁性が極めて優れてい
る。従って固形ワックスにめっきすることによりプリン
ト配線板として用いることが可能である。また、固形ワ
ックス上に緻密で密着性良好なめっき皮膜を無電解また
は電解法によって形成させ後にワックス部分のみ溶解除
去させ、残っためっき皮膜を用いることによって電気、
電子部品として使用される。Wax has extremely good electrical properties, especially electrical insulation. Therefore, by plating solid wax, it can be used as a printed wiring board. In addition, by forming a dense plating film with good adhesion on solid wax using electroless or electrolytic methods, and then melting and removing only the wax portion, the remaining plating film can be used to generate electricity.
Used as an electronic component.
固形ワックス等の非電導体上へのめっき処理方法として
は、乾式法及び湿式法が知られている。Dry methods and wet methods are known as methods for plating on non-conductive materials such as solid wax.
乾式法としては、スパッタリング法、真空蒸着法、イオ
ンブレーティング法、ホットスタンピング法等があり、
これらの方法の利点としては前処理における設備を要す
ることなく、簡単に金属化できるという点があるが、欠
点としては、設備面でのコストが高く、また被めっき物
と金属との密着性が乏しいという点がある。Dry methods include sputtering method, vacuum evaporation method, ion blating method, hot stamping method, etc.
The advantage of these methods is that they can be easily metallized without requiring any equipment for pretreatment, but the disadvantages are that the equipment costs are high and the adhesion between the object to be plated and the metal is poor. There is a point of scarcity.
一方、湿式法は、（１）洗浄処理、（２）表面粗化処理
、（３）触媒付与処理、（４）無電解めっき処理、（５
）電気めっき処理の各工程を順次繰ることによって、被
処理物にめっき皮膜を形成する方法であり、複雑な処理
工程を要するものの、高価な設備等を必要としないので
、非電導体上へのめっき方法として広〈実施されている
。湿式法における表面粗化処理工程では、ＡＢＳ樹脂等
の熱可塑性樹脂に対しては、通常、クロム酸塩、重クロ
ム酸塩等のクロム酸化合物と、硫酸、リン酸等の酸との
混合溶液が用いられているが、このようなりロム酸化合
物を含む混合溶液で固形ワックスを処理する場合には、
ワックスの表面層が溶解して、クロム酸との変質層が形
成され、触媒付与工程で表面層に付着した触媒核となる
パラジウムを不活性化し、正常なめっき析出が困難とな
る。On the other hand, the wet method includes (1) cleaning treatment, (2) surface roughening treatment, (3) catalyst application treatment, (4) electroless plating treatment, (5)
) This is a method of forming a plating film on the object to be treated by repeating each step of the electroplating process sequentially.Although it requires a complicated process, it does not require expensive equipment, so it is suitable for use on non-conducting materials. It is widely practiced as a plating method. In the surface roughening treatment process using the wet method, for thermoplastic resins such as ABS resin, a mixed solution of a chromic acid compound such as chromate or dichromate and an acid such as sulfuric acid or phosphoric acid is usually used. However, when treating solid wax with a mixed solution containing romic acid compounds,
The surface layer of the wax melts and forms an altered layer with chromic acid, which inactivates the palladium that serves as the catalyst nucleus that adhered to the surface layer during the catalyst application process, making normal plating deposition difficult.
問題点を解決するための手段
本発明者は、上記した如き問題点に鑑みて、固形ワック
ス上に、密着性の優れた均一な金属めっき皮膜を形成し
得る方法を見出すべく鋭意研究を重ねてきた。その結果
、芳香族炭化水素を含有するアルコール溶液でエツチン
グ処理した後、アミン化合物及び界面活性剤を含有する
コンディショニング溶液で処理を行ない、その後触媒付
与、及び無電解めっきを順次行なうことによって、固形
ワックス上に良好なめっき皮膜を形成できることを見出
し、ここに本発明を完成するに至った。Means for Solving the Problems In view of the above-mentioned problems, the present inventor has conducted extensive research in order to find a method for forming a uniform metal plating film with excellent adhesion on solid wax. Ta. As a result, after etching with an alcohol solution containing aromatic hydrocarbons, treatment with a conditioning solution containing an amine compound and a surfactant, followed by catalyst application and electroless plating, solid wax It was discovered that a good plating film could be formed thereon, and the present invention was thus completed.
即ち、本発明は固形ワックスを、芳香族炭化水素を含む
アルコール溶液からなるエツチング溶液に浸漬した後、
アミン化合物及び界面活性剤を含む水溶液からなるコン
ディショニング溶液に浸漬し、次いで、触媒付与処理、
及び無電解めっき処理を順次行なうことを特徴とする固
形ワックスへのめっき処理方法に係る。That is, in the present invention, after immersing solid wax in an etching solution consisting of an alcohol solution containing an aromatic hydrocarbon,
Immersion in a conditioning solution consisting of an aqueous solution containing an amine compound and a surfactant, followed by catalyst application treatment,
The present invention relates to a method for plating solid wax, characterized by sequentially performing electroless plating.
本発明で用いるワックス、は、前処理工程及びめっき処
理工程において、固形を維持できるものであればよく、
例えば、植物系ワックス、動物系ワックス、鉱物系ワッ
クス、石油ワックス等の天然ワックス、合成炭化水素ワ
ックス、変性ワックス、水素化ワックス等の合成ワック
スをいずれも用いることができる。The wax used in the present invention may be any wax that can maintain its solid state during the pretreatment process and the plating process.
For example, natural waxes such as vegetable waxes, animal waxes, mineral waxes, and petroleum waxes, and synthetic waxes such as synthetic hydrocarbon waxes, modified waxes, and hydrogenated waxes can all be used.
本発明方法では、まず、固形ワックスに対して、常法に
従って、アルカリ溶液等の洗浄液で洗浄処理を行なった
後、エツチング処理を行なう。In the method of the present invention, first, solid wax is washed with a washing liquid such as an alkaline solution in accordance with a conventional method, and then etched.
エツチング液としては、芳香族炭化水素を２５０〜９０
０ｍＱ／Ｑ含有するアルコール溶液を用いる。アルコー
ルとしては、メタノール、エタノール、プロパツール等
の炭素数１〜１０のアルキル基を有する１価低級アルコ
ール、エチレングリコール、ジエチレングリコール、プ
ロピレングリコール、ジプロピレングリコール、グリセ
リン等が好ましく、これらを単独又は混合して用いるこ
とができる。As the etching liquid, use aromatic hydrocarbons with a concentration of 250 to 90%.
An alcohol solution containing 0 mQ/Q is used. As the alcohol, monohydric lower alcohols having an alkyl group having 1 to 10 carbon atoms such as methanol, ethanol, propatool, etc., ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, etc. are preferable, and these may be used alone or in combination. It can be used as
芳香族炭化水素としては、ベンゼン、トルエン、キシレ
ン、エチルベンゼン、ジエチルベンゼン、イソプロピル
ベンゼン、アミルベンゼン、ジアミルベンゼン等が好ま
しく、これらを単独又は混合して用いることができる。Preferred aromatic hydrocarbons include benzene, toluene, xylene, ethylbenzene, diethylbenzene, isopropylbenzene, amylbenzene, diamylbenzene, and the like, and these can be used alone or in combination.
エツチング液には、さらに、アニオン性界面活性剤を添
加することによって、エツチング効果を向上させること
ができる。アニオン性界面活性剤としては、特に限定は
ないが、例えば、アルキル硫酸エステル塩、アルキルス
ルホコハク酸塩、アルキルベンゼンスルホン酸塩、アル
キルフェニルエーテルスルホン酸塩等を好ましく用いる
ことができる。アニオン性界面活性剤の添加量は、５０
ｇ／Ｑ程度以下とすればよく、０．０５〜５０ｇ／Ｑ程
度とすることが好ましい。The etching effect can be improved by further adding an anionic surfactant to the etching solution. The anionic surfactant is not particularly limited, but for example, alkyl sulfate salts, alkyl sulfosuccinates, alkylbenzene sulfonates, alkylphenyl ether sulfonates, and the like can be preferably used. The amount of anionic surfactant added is 50
It may be about g/Q or less, and preferably about 0.05 to 50 g/Q.
エツチング処理条件は、使用する被めっき物の種類、エ
ツチング溶液の濃度等によって異なるが、通常、２０〜
５０℃程度のエツチング液中に、被めっき物を１〜２０
分間程度浸漬すればよい。Etching conditions vary depending on the type of material to be plated, the concentration of the etching solution, etc., but are usually
1 to 20 pieces of the object to be plated are placed in an etching solution at about 50°C.
Just soak it for about a minute.
エツチング処理後水洗を行ない、次いでコンディショニ
ング処理を行なう。コンディショニング処理液としては
、アミン化合物及び界面活性剤を含有する水溶液を用い
る。アミン化合物としては、メチルアミン、ジメチルア
ミン、トリメチルアミン、モノエチルアミン、ジエチル
アミン、トリエチルアミン等のアルキルアミン、モノエ
タノールアミン、トリエタノールアミン、エチレンジア
ミン等が好ましく、これらを単独又は混合して用いるこ
とができる。アミン化合物の添加量は５〜５００ｇ／Ｑ
程度とすることが好ましい。界面活性剤としては、アニ
オン性、カチオン性、両性、ノニオン性界面活性剤をい
ずれも用いることができ、単独又は混合して用いればよ
い。これらのうちで、例えば、ドデシルアミン酢酸塩、
オクタデシルアミン酢酸塩、ヘキサデシルアミン酢酸塩
等のアルキルアミン酢酸塩類、ドデシルトリメチルアン
モニウムクロライド、オクタデシルトリメチルアンモニ
ウムクロライド、ヘキサデシルトリメチルアンモニウム
クロライド等のアルキルトリメチルアンモニウムクロラ
イド類、ポリオキシエチレンドデシルアミン、ポリオキ
シエチレンオクタデシルアミン、ポリオキシエチレンヘ
キサデシルアミン等のポリオキシエチレンアルキルアミ
ン類等のカチオン性界面活性剤、ジメチルアルキルベタ
イン類等の両性界面活性剤が好ましい。界面活性剤の添
加量は、０．０１〜５０ ｇ／Ｑ程度とすることが適当
である。After the etching process, washing with water is performed, and then a conditioning process is performed. As the conditioning treatment liquid, an aqueous solution containing an amine compound and a surfactant is used. As the amine compound, alkylamines such as methylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, and triethylamine, monoethanolamine, triethanolamine, and ethylenediamine are preferable, and these can be used alone or in combination. The amount of amine compound added is 5 to 500g/Q
It is preferable to set it as approximately. As the surfactant, any of anionic, cationic, amphoteric, and nonionic surfactants can be used, and they may be used alone or in combination. Among these, for example, dodecylamine acetate,
Alkylamine acetates such as octadecylamine acetate and hexadecylamine acetate, alkyltrimethylammonium chlorides such as dodecyltrimethylammonium chloride, octadecyltrimethylammonium chloride and hexadecyltrimethylammonium chloride, polyoxyethylene dodecylamine, polyoxyethylene octadecyl Cationic surfactants such as amines, polyoxyethylene alkylamines such as polyoxyethylene hexadecylamine, and amphoteric surfactants such as dimethylalkyl betaines are preferred. It is appropriate that the amount of surfactant added is about 0.01 to 50 g/Q.
コンディショニング処理としては、通常２０〜５０℃程
度のコンディショニング溶液中に１〜１０分間程度被め
っき物を浸漬すればよい。コンディショニング処理によ
り、触媒付与工程において、触媒核となるパラジウムを
均一に付与することが可能となる。As a conditioning treatment, the object to be plated is usually immersed in a conditioning solution at about 20 to 50° C. for about 1 to 10 minutes. The conditioning treatment makes it possible to uniformly apply palladium, which will serve as catalyst nuclei, in the catalyst application step.
コンディショニング処理後、水洗を行ない、次いで触媒
付与処理を行なう。触媒付与処理は常法に従えばよく、
例えば、キャタリスト／アクセレーター法、センシタイ
ジング／アンチベーター法等の公知の方法をそのまま採
用できる。好ましくは、パラジウム溶液浸漬（感受性化
処理）／還元処理（活性化処理）を行なえばよい。After the conditioning treatment, washing with water is performed, and then a catalyst application treatment is performed. Catalyst application treatment can be carried out according to conventional methods.
For example, known methods such as the catalyst/accelerator method and the sensitizing/anti-beta method can be used as they are. Preferably, palladium solution immersion (sensitization treatment)/reduction treatment (activation treatment) may be performed.
触媒付与後、水洗を行ない、次いで無電解めっきを行な
う。無電解めっき液としては、公知の無電解銅めっき液
、無電解ニッケルめっき液をいずれも用いることができ
、処理条件は常法に従えばよい。無電解めっき皮膜の厚
さは特に限定はなく、目的に応じて適宜決定すればよい
が、通常０． ５〜２０μｍ程度の範囲とすればよい。After applying the catalyst, washing with water is performed, and then electroless plating is performed. As the electroless plating solution, any known electroless copper plating solution or electroless nickel plating solution can be used, and the processing conditions may be according to conventional methods. The thickness of the electroless plating film is not particularly limited and may be determined as appropriate depending on the purpose, but it is usually 0. The thickness may be in the range of about 5 to 20 μm.
無電解めっき処理を行なった後、必要に応じて、電気め
っきを行なうことが可能であり、目的に応じて、各種の
電気めっきを行なうことができる。After performing the electroless plating treatment, electroplating can be performed if necessary, and various electroplating can be performed depending on the purpose.
発明の効果
本発明方法によれば、従来めっき処理が困難であった固
形ワックス上に均−且つ密着性の優れためっき皮膜を形
成することができる。Effects of the Invention According to the method of the present invention, a uniform plating film with excellent adhesion can be formed on solid wax, which has conventionally been difficult to plate.
実施例 以下実施例を示して本発明を更に詳細に説明する。Example EXAMPLES The present invention will be explained in more detail below with reference to Examples.
実施例１
天然ワックスの平板（２０Ｘ３０Ｘ３ｍｍ）をトルエン
５００１Ｔｌ１２／９及びアニオン性界面活性剤（ペレ
ックス０Ｔ−Ｐ、ジアルキルスルホコハク酸ナトリウム
、花王アトラス■製） １０ｇ／Ｑを含有するメタノー
ル溶液からなるエツチング液に２５℃で１０分間浸漬し
た。水洗後、トリエタノールアミン３００ｇ／Ｑ及びカ
チオン性界面活性剤（ナイミーンＳ−２１５、ポリオキ
シエチレンアルキルアミン、日本油脂■製）０．５ｇ／
Ｑを含有する水溶液に４０℃で５分間浸漬した。水洗後
、塩化パラジウム０．５ｇ／Ｑ及びクエン酸３ｇ／Ｑを
含む水溶液からなる触媒溶液に４０℃、５分間浸漬し、
水洗後次亜リン酸ナトリウム２０ｇ／Ｑの水溶液で４０
℃、５分間還元処理を行なった。水洗後、硫酸銅１２
ｇ／Ｑ 、ロッセル塩２２ｇ／Ｑ、水酸化ナトリウム１
５ ｇ／Ｑ 、α、αジピリジル５ｍｇ／Ｌパラホルム
アルデヒド１５ｇ／Ｑの水溶液からなる無電解銅めっき
液に２５℃、１５分間浸漬した。Example 1 A flat plate of natural wax (20 x 30 x 3 mm) was placed in an etching solution consisting of a methanol solution containing toluene 5001Tl 12/9 and an anionic surfactant (Perex 0T-P, sodium dialkyl sulfosuccinate, manufactured by Kao Atlas ■) 10 g/Q. It was immersed for 10 minutes at 25°C. After washing with water, triethanolamine 300g/Q and cationic surfactant (Nimeen S-215, polyoxyethylene alkylamine, manufactured by NOF ■) 0.5g/Q
It was immersed in an aqueous solution containing Q at 40°C for 5 minutes. After washing with water, immersed in a catalyst solution consisting of an aqueous solution containing 0.5 g/Q of palladium chloride and 3 g/Q of citric acid at 40°C for 5 minutes,
After washing with water, use an aqueous solution of 20g/Q of sodium hypophosphite.
Reduction treatment was performed at ℃ for 5 minutes. After washing with water, copper sulfate 12
g/Q, Rosselle salt 22g/Q, sodium hydroxide 1
It was immersed for 15 minutes at 25°C in an electroless copper plating solution consisting of an aqueous solution of 5 g/Q, α, α dipyridyl 5 mg/L paraformaldehyde 15 g/Q.
得られためっき物について、外観を評価しセロテープ剥
離法による密着性試験を行なった。結果を第１表に示す
。The appearance of the obtained plated product was evaluated, and an adhesion test was conducted using cellophane tape peeling method. The results are shown in Table 1.
実施例２
実施例１と同じワックスをベンゼン７００１１１ｉ２／
Ｑ及びアニオン性界面活性剤（ペレックスＯＴ−Ｐ）５
０ｇ／９を含有するエタノール溶液からなるエツチング
液で３０℃、５分間処理した。水洗後還元処理までは実
施例１と同様に処理し、硫酸ニッケル２５ ｇ／Ｑ 、
クエン酸２０ｇ／Ｑ、次亜リンク酸ナトリウム１５ｇ／
Ｑ、塩化アンモニウム５ｇ／１２の水溶液からなるｐ）
（ｓ、５〜９．５の無電解ニッケルめっき液に４０℃、
１０分間浸漬した。めっき後の外観とセロテープ剥離試
験結果を第１表に示す。Example 2 The same wax as in Example 1 was mixed with benzene 700111i2/
Q and anionic surfactant (Perex OT-P) 5
It was treated with an etching solution consisting of an ethanol solution containing 0 g/9 at 30° C. for 5 minutes. The process was carried out in the same manner as in Example 1 until the reduction treatment after washing with water, and 25 g/Q of nickel sulfate was added.
Citric acid 20g/Q, sodium hypophosphate 15g/
Q, p) consisting of an aqueous solution of ammonium chloride 5 g/12
(S, 40℃ in 5-9.5 electroless nickel plating solution,
Soaked for 10 minutes. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例３
合成ワックス（変性ワックス、２０Ｘ３０Ｘ３１］ＩＩ
ＩＩ）をトルエン２００ｍＱ／１２及びアニオン性界面
活性剤（ペレックスＯＴ−Ｐ）１０ｇ／９を含有するエ
チレングリコール溶液からなるエツチング液で２５℃、
２０分処理した。水洗後、実施例１と同様に処理した。Example 3 Synthetic wax (modified wax, 20X30X31) II
II) at 25°C with an etching solution consisting of an ethylene glycol solution containing 200 mQ/12 of toluene and 10 g/9 of an anionic surfactant (Perex OT-P).
Processed for 20 minutes. After washing with water, the same treatment as in Example 1 was carried out.
めっき後の外観とセロテープ剥離試験結果を第１表に示
す。Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例４
実施例３と同じワックスをキシレン８００ｍＱ／Ｑ及び
アニオン性界面活性剤（ペレックス０Ｔ−Ｐ） １ｇ／
Ｑを含有するプロピレングリコール溶液からなるエツチ
ング液で４０°０１１０分処理した。水洗後、実施例２
と同様に処理した。めっき後の外観とセロテープ剥離試
験結果を第１表に示す。Example 4 The same wax as in Example 3 was mixed with xylene 800 mQ/Q and anionic surfactant (Perex 0T-P) 1 g/
It was treated with an etching solution consisting of a propylene glycol solution containing Q at 40°C for 10 minutes. After washing with water, Example 2
processed in the same way. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例５
実施例３と同じワックスをトルエン５００ｍ１２／Ｑ１
ベンゼン４００ｍＱ／Ｑ及びアニオン性界面活性剤（ペ
レックスＯＴ−Ｐ）Ｉｇ／１２を含有するエタノール溶
液からなるエツチング液で４０℃、１０分処理した。水
洗後、メチルアミン１００ｇ／Ｑ及び両性界面活性剤（
アノンＢＦ、ジメチルアルキルベタイン、日本油脂■製
）Ｉｇ／Ｑを含有する水溶液で３０℃、５分間処理した
。水洗後実施例１と同様に処理した。めっき後の外観と
セロテープ剥離試験結果を第１表に示す。Example 5 The same wax as Example 3 was mixed with toluene 500m12/Q1
It was treated with an etching solution consisting of an ethanol solution containing 400 mQ/Q of benzene and an anionic surfactant (Perex OT-P) Ig/12 at 40°C for 10 minutes. After washing with water, 100g/Q of methylamine and an amphoteric surfactant (
The sample was treated with an aqueous solution containing Anon BF, dimethylalkyl betaine, Ig/Q (manufactured by NOF ■) at 30°C for 5 minutes. After washing with water, the same treatment as in Example 1 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例６
実施例１と同じ′ワックスをキシレン１００ｍ（２／Ｑ
１ トルエン２００ｍＱ／Ｑ、エチレングリコール５０
０ｍＱ／Ｑ及びアニオン性界面活性剤（ペレックスＯＴ
−Ｐ）５ｇ／９を含有するメタノール溶液からなるエツ
チング液で３５℃、５分処理した。Example 6 The same wax as in Example 1 was mixed with 100 m of xylene (2/Q
1 Toluene 200mQ/Q, ethylene glycol 50
0mQ/Q and anionic surfactant (Perex OT
-P) was treated with an etching solution consisting of a methanol solution containing 5 g/9 at 35°C for 5 minutes.
水洗後実施例２と同様に処理した。めっき後の外観とセ
ロテープ剥離試験結果を第１表に示す。After washing with water, the same treatment as in Example 2 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例７
実施例１と同じワックスをベンゼン３００ｍ１２／Ｑ１
エチレングリコール２００ｍＱ／Ｑ及びアニオン性界面
活性剤（ペレックスＯＴ−Ｐ）Ｌｏｇ／Ｑを含有するプ
ロピレングリコール溶液からなるエツチング液で４０℃
、１０分処理した。水洗後エチレンジアミン５０ｇ／Ｑ
、及びカチオン性界面活性剤（ナイミーンＳ−２１５）
１ｇ／Ｑを含有する水溶液で３０℃、３分処理した。Example 7 The same wax as in Example 1 was mixed with benzene 300m12/Q1
At 40°C with an etching solution consisting of a propylene glycol solution containing 200 mQ/Q of ethylene glycol and an anionic surfactant (Perex OT-P) Log/Q.
, treated for 10 minutes. Ethylenediamine 50g/Q after washing with water
, and cationic surfactant (Nymeen S-215)
It was treated with an aqueous solution containing 1 g/Q at 30°C for 3 minutes.
水洗練実施例１と同様に処理した。めっき後の外観とセ
ロテープ剥離試験結果を第１表に示す。Water refinement The same procedure as in Example 1 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
実施例８
実施例３と同じワックスをエチルベンゼン５００ＷＩ／
Ｑ、キシレン１００ｍＱ／Ｑ、及びアニオン性界面活性
剤（ペレックス０Ｔ−Ｐ）Ｏ，Ｉｇ／Ｑを含有するメタ
ノール溶液からなるエツチング液で２５℃、５分処理し
た。水洗後、実施例１と同様に処理した。めっき後の外
観とセロテープ剥離試験結果を第１表に示す。Example 8 The same wax as in Example 3 was mixed with ethylbenzene 500WI/
The film was treated with an etching solution consisting of a methanol solution containing Q, 100 mQ/Q of xylene, and an anionic surfactant (Pellex 0T-P) O, Ig/Q at 25°C for 5 minutes. After washing with water, the same treatment as in Example 1 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
比較例１
天然ワックスをＡＢＳ樹脂の表面処理で使用される無水
クロム酸４００ｇ／Ｑ及び９８％硫酸４００ｇ／Ｑを含
有する水溶液からなるエツチング液で５０℃、１０分間
処理した。水洗後、実施例１と同様に処理した。めっき
後の外観とセロテープ剥離試験結果を第１表に示す。Comparative Example 1 Natural wax was treated at 50° C. for 10 minutes with an etching solution consisting of an aqueous solution containing 400 g/Q of chromic anhydride and 400 g/Q of 98% sulfuric acid used in surface treatment of ABS resin. After washing with water, the same treatment as in Example 1 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
比較例２
天然ワックスをポリカーボネート樹脂の表面処理で使用
される重クロム酸カリ２５ｇ／［９８％硫酸４００ｇ／
Ｑ及び８９％リン酸１００ｒｒｌ／Ｑを含有する水溶液
からなるエツチング液で４０℃、１０分間処理した。水
洗後、実施例２と同様に処理した。めっき後の外観とセ
ロテープ剥離試験結果を第１表に示す。Comparative Example 2 25g of potassium dichromate/[400g of 98% sulfuric acid/400g of 98% sulfuric acid/
It was treated with an etching solution consisting of an aqueous solution containing Q and 100 rrl/Q of 89% phosphoric acid at 40° C. for 10 minutes. After washing with water, the same treatment as in Example 2 was carried out. Table 1 shows the appearance after plating and the cellophane tape peeling test results.
比較例３
合成ワックスをノリル樹脂の表面処理で使用される無水
クロム酸２００ｇ／９及び９８％硫酸５００ｇ／Ｑを含
有する水溶液からなるエツチング液で５０℃、１０分処
理した。水洗後、実施例１と同様に処理した。めっき後
の外観とセロテープ剥離試験結果を１表に示す。Comparative Example 3 Synthetic wax was treated at 50° C. for 10 minutes with an etching solution consisting of an aqueous solution containing 200 g/9 of chromic anhydride and 500 g/Q of 98% sulfuric acid used in the surface treatment of Noryl resin. After washing with water, the same treatment as in Example 1 was carried out. Table 1 shows the appearance after plating and the cellophane tape peel test results.
第
表
（注） セロテープ剥離試験法：無電解めっき後、めっ
き表面の１ ｃｍ２の部分に基盤目状に１ｍｍ角に切り
目を入れ粘着テープを貼り付けた後、テープを垂直に剥
離して１ｍｍ角の１００個のめつぎ皮膜のうち剥離され
た数を求めた。Table (Note) Cellotape peeling test method: After electroless plating, make a 1 mm square cut in a 1 cm2 area on the plating surface in the shape of a substrate pattern and apply adhesive tape, then peel the tape vertically to cut a 1 mm square piece. The number of peeled out of the 100 eyelid films was determined.
Claims (4)
ール溶液からなるエッチング溶液に浸漬した後、アミン
化合物及び界面活性剤を含む水溶液からなるコンディシ
ョニング溶液に浸漬し、次いで、触媒付与処理、及び無
電解めっき処理を順次行なうことを特徴とする固形ワッ
クスへのめっき処理方法。(1) Solid wax is immersed in an etching solution consisting of an alcoholic solution containing aromatic hydrocarbons, then immersed in a conditioning solution consisting of an aqueous solution containing an amine compound and a surfactant, and then subjected to catalyst application treatment and electroless treatment. A method for plating solid wax, characterized by sequentially performing plating treatments.
ゼン、トルエン、キシレン、エチルベンゼン、ジエチル
ベンゼン、イソプロピルベンゼン、アミルベンゼン及び
ジアミルベンゼンから選ばれた少なくとも１種であり、
アルコールが１価低級アルコール、エチレングリコール
、ジエチレングリコール、プロピレングリコール、ジプ
ロピレングリコール及びグリセリンから選ばれた少なく
とも１種である請求項１に記載の固形ワックスへのめっ
き処理方法。(2) the aromatic hydrocarbon in the etching solution is at least one selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, isopropylbenzene, amylbenzene and diamylbenzene,
2. The method for plating solid wax according to claim 1, wherein the alcohol is at least one selected from monovalent lower alcohols, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, and glycerin.
有するアルコール溶液をエッチング溶液として使用する
請求項１又は２に記載の固形ワックスへのめっき処理方
法。(3) The method for plating solid wax according to claim 1 or 2, wherein an alcohol solution containing an aromatic hydrocarbon and an anionic surfactant is used as the etching solution.
がアルキルアミン、モノエタノールアミン、トリエタノ
ールアミン及びエチレンジアミンの少なくとも１種であ
り、界面活性剤がカチオン性界面活性剤及び両性界面活
性剤の少なくとも１種である請求項１〜３のいずれかに
記載の固形ワックスへのめっき処理方法。(4) A claim in which the amine compound in the conditioning solution is at least one of alkylamine, monoethanolamine, triethanolamine, and ethylenediamine, and the surfactant is at least one of cationic surfactants and amphoteric surfactants. 4. The method for plating solid wax according to any one of 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22769089A JPH0390582A (en) | 1989-09-01 | 1989-09-01 | Method for plating solid wax |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22769089A JPH0390582A (en) | 1989-09-01 | 1989-09-01 | Method for plating solid wax |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390582A true JPH0390582A (en) | 1991-04-16 |
| JPH0348270B2 JPH0348270B2 (en) | 1991-07-23 |
Family
ID=16864817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22769089A Granted JPH0390582A (en) | 1989-09-01 | 1989-09-01 | Method for plating solid wax |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390582A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3339472A3 (en) * | 2016-12-22 | 2018-07-18 | Rohm and Haas Electronic Materials LLC | Electroless plating method |
| WO2021024599A1 (en) * | 2019-08-02 | 2021-02-11 | 上村工業株式会社 | Pretreatment method for electroless plating, and pretreatment solution for electroless plating |
-
1989
- 1989-09-01 JP JP22769089A patent/JPH0390582A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3339472A3 (en) * | 2016-12-22 | 2018-07-18 | Rohm and Haas Electronic Materials LLC | Electroless plating method |
| WO2021024599A1 (en) * | 2019-08-02 | 2021-02-11 | 上村工業株式会社 | Pretreatment method for electroless plating, and pretreatment solution for electroless plating |
| JP2021025077A (en) * | 2019-08-02 | 2021-02-22 | 上村工業株式会社 | Electroless plating pretreatment method and electroless plating pretreatment liquid |
| US20220275516A1 (en) * | 2019-08-02 | 2022-09-01 | Tetsuji Ishida | Pretreatment Method for Electroless Plating, and Pretreatment Solution for Electroless Plating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0348270B2 (en) | 1991-07-23 |
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