JPH0390472U - - Google Patents

Info

Publication number

JPH0390472U

JPH0390472U JP15082589U JP15082589U JPH0390472U JP H0390472 U JPH0390472 U JP H0390472U JP 15082589 U JP15082589 U JP 15082589U JP 15082589 U JP15082589 U JP 15082589U JP H0390472 U JPH0390472 U JP H0390472U

Authority

JP

Japan

Prior art keywords

solder

chip

chip component

wiring board

printed wiring

Prior art date

1989-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 13
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 238000005476 soldering Methods 0.000 claims 1
• 230000000873 masking effect Effects 0.000 description 2

Cited By (2)