JPH0390464U - - Google Patents
Info
- Publication number
- JPH0390464U JPH0390464U JP1989153196U JP15319689U JPH0390464U JP H0390464 U JPH0390464 U JP H0390464U JP 1989153196 U JP1989153196 U JP 1989153196U JP 15319689 U JP15319689 U JP 15319689U JP H0390464 U JPH0390464 U JP H0390464U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- luminescent color
- different
- multicolor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989153196U JPH0390464U (en:Method) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989153196U JPH0390464U (en:Method) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390464U true JPH0390464U (en:Method) | 1991-09-13 |
Family
ID=31699418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989153196U Pending JPH0390464U (en:Method) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390464U (en:Method) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5018174B1 (en:Method) * | 1969-06-30 | 1975-06-26 | ||
| JPS6049653B2 (ja) * | 1981-04-18 | 1985-11-02 | 橋本フオ−ミング工業株式会社 | 合成樹脂成形品の製造方法 |
-
1989
- 1989-12-27 JP JP1989153196U patent/JPH0390464U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5018174B1 (en:Method) * | 1969-06-30 | 1975-06-26 | ||
| JPS6049653B2 (ja) * | 1981-04-18 | 1985-11-02 | 橋本フオ−ミング工業株式会社 | 合成樹脂成形品の製造方法 |