JPH0390454U - - Google Patents

Info

Publication number
JPH0390454U
JPH0390454U JP13087189U JP13087189U JPH0390454U JP H0390454 U JPH0390454 U JP H0390454U JP 13087189 U JP13087189 U JP 13087189U JP 13087189 U JP13087189 U JP 13087189U JP H0390454 U JPH0390454 U JP H0390454U
Authority
JP
Japan
Prior art keywords
tie bar
lead frame
integrated circuit
semiconductor integrated
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13087189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13087189U priority Critical patent/JPH0390454U/ja
Publication of JPH0390454U publication Critical patent/JPH0390454U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP13087189U 1989-11-08 1989-11-08 Pending JPH0390454U (US20070167544A1-20070719-C00007.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13087189U JPH0390454U (US20070167544A1-20070719-C00007.png) 1989-11-08 1989-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13087189U JPH0390454U (US20070167544A1-20070719-C00007.png) 1989-11-08 1989-11-08

Publications (1)

Publication Number Publication Date
JPH0390454U true JPH0390454U (US20070167544A1-20070719-C00007.png) 1991-09-13

Family

ID=31678415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13087189U Pending JPH0390454U (US20070167544A1-20070719-C00007.png) 1989-11-08 1989-11-08

Country Status (1)

Country Link
JP (1) JPH0390454U (US20070167544A1-20070719-C00007.png)

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