JPH0390450U - - Google Patents
Info
- Publication number
- JPH0390450U JPH0390450U JP15258889U JP15258889U JPH0390450U JP H0390450 U JPH0390450 U JP H0390450U JP 15258889 U JP15258889 U JP 15258889U JP 15258889 U JP15258889 U JP 15258889U JP H0390450 U JPH0390450 U JP H0390450U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor module
- base plate
- metal base
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15258889U JPH0390450U (th) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15258889U JPH0390450U (th) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390450U true JPH0390450U (th) | 1991-09-13 |
Family
ID=31698843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15258889U Pending JPH0390450U (th) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390450U (th) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63211656A (ja) * | 1987-02-26 | 1988-09-02 | Mitsubishi Electric Corp | 半導体装置の取付け構造 |
-
1989
- 1989-12-28 JP JP15258889U patent/JPH0390450U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63211656A (ja) * | 1987-02-26 | 1988-09-02 | Mitsubishi Electric Corp | 半導体装置の取付け構造 |