JPH0390422U - - Google Patents
Info
- Publication number
- JPH0390422U JPH0390422U JP15234189U JP15234189U JPH0390422U JP H0390422 U JPH0390422 U JP H0390422U JP 15234189 U JP15234189 U JP 15234189U JP 15234189 U JP15234189 U JP 15234189U JP H0390422 U JPH0390422 U JP H0390422U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- bonded portion
- capacitor elements
- ceramic
- dielectric ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案の一実施例に係る表面実装形積
層セラミツクコンデンサを示す斜視図、第２図は
従来の表面実装形積層セラミツクコンデンサを示
す斜視図である。
１……コンデンサ素子、２……外部電極、３…
…隙間。
FIG. 1 is a perspective view showing a surface mount type multilayer ceramic capacitor according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional surface mount type multilayer ceramic capacitor. 1... Capacitor element, 2... External electrode, 3...
…gap.
Claims (1)
触する少なくとも２個以上の電極とからなるコン
デンサ素子を複数個使用し、これら複数個のコン
デンサ素子同士を貼り合わせてなる積層セラミツ
クコンデンサにおいて、 前記コンデンサ素子同士の貼り合わせ部に、０
．２ｍｍ以上の離間距離を有する隙間を設け、且
つ貼り合わせ部の接着面積を貼り合わせ部の平面
積の１０％〜５０％としたことを特徴とする表面
実装形積層セラミツクコンデンサ。[Claim for Utility Model Registration] A laminated ceramic product made by using a plurality of capacitor elements each consisting of a dielectric ceramic and at least two or more electrodes in contact with the dielectric ceramic, and bonding these plural capacitor elements together. In the capacitor, 0 is applied to the bonded portion of the capacitor elements.
．． 1. A surface mount type multilayer ceramic capacitor, characterized in that a gap having a distance of 2 mm or more is provided, and the adhesive area of the bonded portion is 10% to 50% of the planar area of the bonded portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15234189U JPH0390422U (en) | 1989-12-27 | 1989-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15234189U JPH0390422U (en) | 1989-12-27 | 1989-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390422U true JPH0390422U (en) | 1991-09-13 |
Family
ID=31698610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15234189U Pending JPH0390422U (en) | 1989-12-27 | 1989-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390422U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161687A (en) * | 2019-03-27 | 2020-10-01 | Tdk株式会社 | Multilayer ceramic electronic component |
-
1989
- 1989-12-27 JP JP15234189U patent/JPH0390422U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161687A (en) * | 2019-03-27 | 2020-10-01 | Tdk株式会社 | Multilayer ceramic electronic component |
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