JPH0390246A - Coated sand for manufacturing mold - Google Patents
Coated sand for manufacturing moldInfo
- Publication number
- JPH0390246A JPH0390246A JP22907689A JP22907689A JPH0390246A JP H0390246 A JPH0390246 A JP H0390246A JP 22907689 A JP22907689 A JP 22907689A JP 22907689 A JP22907689 A JP 22907689A JP H0390246 A JPH0390246 A JP H0390246A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- polyaldehyde
- resin component
- resin
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004576 sand Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920001744 Polyaldehyde Polymers 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 229920002472 Starch Polymers 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 239000008107 starch Substances 0.000 claims abstract description 4
- 235000019698 starch Nutrition 0.000 claims abstract description 4
- 125000003172 aldehyde group Chemical group 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract 2
- 239000007787 solid Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 31
- 238000001723 curing Methods 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- -1 aldehyde compounds Chemical class 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 5
- 239000007849 furan resin Substances 0.000 description 5
- 150000001299 aldehydes Chemical class 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 3
- 239000008116 calcium stearate Substances 0.000 description 3
- 235000013539 calcium stearate Nutrition 0.000 description 3
- 230000009970 fire resistant effect Effects 0.000 description 3
- 150000002240 furans Chemical class 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920005610 lignin Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000003110 molding sand Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002261 Corn starch Polymers 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229960002645 boric acid Drugs 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000008120 corn starch Substances 0.000 description 1
- 229940099112 cornstarch Drugs 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940098895 maleic acid Drugs 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229940116315 oxalic acid Drugs 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical group OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 238000010112 shell-mould casting Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は加熱硬化して鋳型を成型する被覆砂に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to coated sand that is heated and hardened to form a mold.
従来、加熱硬化鋳型の製造法としては、耐火性粒状骨材
にフェノールノボラック樹脂を被覆し、ヘキサメチレン
テトラミンを触媒として約300°C近辺で加熱硬化せ
しめる、所謂シェルモールド法がある。この加熱硬化法
は設備的に簡便であり、作業的に使用しやすい等の利点
により現在加熱硬化鋳型製造法としては最も多く使用さ
れている。しかしながら、硬化時間が長く、硬化温度が
高いため、金型の歪、鋳型の歪が多く、鋳型のパリ取り
作業が欠かせず、又、寸法精度も不充分であった。更に
硬化温度が高い事による作業環境の劣悪さ及びフェノー
ル樹脂、ヘキサメチレンテトラミンの熱分解臭気による
作業環境の汚染も著しく、これらの大幅な改善が望まれ
ていた。Conventionally, as a method for manufacturing heat-curing molds, there is a so-called shell molding method in which refractory granular aggregate is coated with a phenol novolak resin and heated and cured at around 300° C. using hexamethylenetetramine as a catalyst. This heat-curing method is currently the most commonly used heat-curing mold manufacturing method due to its simple equipment and ease of use. However, since the curing time was long and the curing temperature was high, there were many mold distortions and mold distortions, mold deburring work was indispensable, and dimensional accuracy was insufficient. Furthermore, the working environment is extremely poor due to the high curing temperature, and the working environment is extremely polluted due to the odor of thermal decomposition of the phenol resin and hexamethylenetetramine, and it has been desired to significantly improve these conditions.
また、150°Cから250°C近辺で耐火性粒状骨材
にフラン樹脂、フェノールレゾール樹脂やフェノール又
は尿素/ホルマリン変性フラン樹脂等の酸硬化性樹脂と
、塩化アンモニウム、シュウ酸等の硬化触媒を混じた混
合物を加熱硬化し、鋳型を生産する方法がある。これは
硬化時間がシェルモールド法よりは短く、温度による歪
、寸法精度や熱的作業環境の面でも改善される。In addition, acid-curing resins such as furan resin, phenol resol resin, phenol or urea/formalin-modified furan resin, and curing catalysts such as ammonium chloride and oxalic acid are added to the refractory granular aggregate at temperatures between 150°C and 250°C. There is a method of producing a mold by heating and hardening the mixed mixture. This method has a shorter curing time than the shell mold method, and is also improved in terms of temperature-induced distortion, dimensional accuracy, and thermal working environment.
しかしながら、これらのフラン樹脂、フェノールレゾー
ル樹脂やフェノール又は尿素/ホルマリン変性フラン樹
脂等の酸硬化性樹脂は常温で液体であり、従ってこれを
鋳物用耐火性骨材と混合した場合、混練砂は湿った状態
であり、シェルモールド法のような乾態砂に比較し、充
填性が劣るためブロ一方案等の対応が必要である。However, acid-curing resins such as furan resins, phenol resol resins, and phenol- or urea/formalin-modified furan resins are liquid at room temperature, so when mixed with refractory aggregate for foundries, the kneading sand becomes wet. Compared to dry sand such as the shell mold method, the filling properties are inferior, so measures such as blow blowing are required.
このように従来の加熱硬化鋳型造型法に用いられる鋳物
砂には各々一長一短があり、これらの長所を兼ね備える
ような更に優れた鋳物砂が望まれている。As described above, each of the molding sands used in the conventional heat-hardening mold making method has its advantages and disadvantages, and there is a desire for an even better molding sand that combines these advantages.
本発明者らは上記課題を解決すべく鋭意研究の結果、特
定の樹脂成分と硬化剤成分を耐火性粒状骨材表面に予め
コーティングし、骨材表面に固形のレジンコーティング
層を形成した鋳型製造用被覆砂が他の性能を低下させる
ことなく大幅に鋳型の硬化速度及び充填性を向上できる
ことを見出し本発明を完成するに至った。As a result of intensive research to solve the above problems, the present inventors manufactured a mold by pre-coating the surface of fire-resistant granular aggregate with a specific resin component and curing agent component to form a solid resin coating layer on the surface of the aggregate. The present inventors have discovered that the coating sand can significantly improve the curing speed and filling properties of molds without deteriorating other properties, and have completed the present invention.
すなわち本発明は、次の樹脂成分(イ)、(ロ)と硬化
剤とを耐火性骨材表面に被覆した鋳型製造用被覆砂を提
供するものである。That is, the present invention provides coated sand for mold production in which the surface of a fire-resistant aggregate is coated with the following resin components (a) and (b) and a curing agent.
朋E基」=C0−
(i)澱粉から誘導される分子内に2つ以上のアルデヒ
ド基を有する化合物
(ii )下記の弐で表されるポリアルデヒド(式中、
mは0又は1% nは0又は1、lは1〜5の数を表
す。ただし1ll−0のときn−1、m−1のときn−
0である。)
(tii)下記の式で表されるポリアルデヒドR+
(式中、m、 nは2又は3、k、fはO〜50の数を
表す。R,、R2はそれぞれH−又はC)!3−をを表
す。)
(iv )下記の式で表されるポリ”アルデヒド(式中
、mはO〜4、nは2〜3の数を表し、RはH−、CH
s−、CJs−1C3H?−、80−、H3CO−。(i) A compound derived from starch and having two or more aldehyde groups in its molecule (ii) A polyaldehyde represented by the following 2 (in the formula,
m represents 0 or 1%, n represents 0 or 1, and l represents a number from 1 to 5. However, when 1ll-0, n-1, when m-1, n-
It is 0. ) (tii) Polyaldehyde R+ represented by the following formula (wherein m and n are 2 or 3, k and f represent numbers from O to 50, R, and R2 are each H- or C)! Represents 3-. ) (iv) Poly"aldehyde represented by the following formula (in the formula, m represents a number of O to 4, n represents a number of 2 to 3, R is H-, CH
s-, CJs-1C3H? -, 80-, H3CO-.
HOOC−、H,N−の少なくとも1種である。)上記
(i)〜(iv )の中から選ばれた1種又は2種以上
のポリアルデヒド化合物。At least one of HOOC-, H, and N-. ) One or more polyaldehyde compounds selected from the above (i) to (iv).
崖鳳羞に00−
常温で固体であり、活性水素を持ち樹脂分(イ)と反応
して−CI(−結合(X :アルデヒド残基)を生威
し得る化合物。00- A compound that is solid at room temperature, has active hydrogen, and can react with the resin component (a) to form -CI (-bond (X: aldehyde residue)).
本発明に用いられる樹脂成分(ロ)としては、例えばツ
ユノール系モノマー、フェノール系樹脂、アミノ化合物
、アミノ系樹脂、芳香族炭化水素系樹脂等が挙げられる
。好ましくはビスフエノールA1ビスフェノールFルゾ
ルシノール、キシレノール等のフェノール系モノマーフ
ェノール系樹脂、尿素、尿素樹脂、キシレン樹脂等が挙
げられる。Examples of the resin component (b) used in the present invention include tjunol monomers, phenol resins, amino compounds, amino resins, and aromatic hydrocarbon resins. Preferred examples include phenolic monomers such as bisphenol A1, bisphenol F, lusorcinol, and xylenol, as well as phenolic resins, urea, urea resins, and xylene resins.
また、本発明に用いられる樹脂成分には従来公知の変性
剤の少なくとも一種を混合もしくは共縮合させることも
できる。Furthermore, at least one of conventionally known modifiers may be mixed or co-condensed with the resin component used in the present invention.
従来公知の変性剤を具体的に例示すれば、クマロン・イ
ンデン樹脂、石油樹脂、ポリエステル、アルキッド樹脂
、ポリビニルアルコール、エポキシ樹脂、エチレン・ビ
ニルアセテート、ポリビニルアセテート、ポリブタジェ
ン、ポリエーテル、ポリエチレンイミン、ポリ塩化ビニ
ル、ポリアクリル酸エステル、ポリビニルブチラール、
フェノキシ樹脂、酢酸セルロース、キシレン樹脂、トル
エン樹脂、ボリアミド、スチレン樹脂、ポリビニルホル
マール、アクリル樹脂、ウレタン樹脂、ナイロン等のポ
リマー及びオリゴマーや、リグニン、リグニンスルホン
酸、ロジン、エステルガム、植物油、ビチュごメン、重
油、カシューナツト殻液、バニリン、タンニン類等の天
然物や、澱粉、コーンスターチ、グルコース、デキスト
リン等の糖類及びその誘導体や、レゾルシン残渣、クレ
ゾール残渣、2.2.4−トリメチル−4−(ヒドロキ
シフェニル)クマロンとイソプロペニルフェノールの反
応副生物、テレフタル酸とエチレングリコールの反応副
生物等の反応残渣及び副生物や、ポリエチレングリコー
ル等の多価アルコールや、アセトン、シクロヘキサノン
、アセトフェノン等のケトン類及びアルデヒドとの縮合
物や、ジシアンジアミド、アクリルアミド、チオ尿素等
のアミノもしくはイミノ化合物及びそれらのアルデヒド
縮金物や、フルフラール、グリオキザール等のアルデヒ
ド化合物や、イソシアヌル酸エステル、不飽和脂肪酸エ
ステル等のエステル化合物などである。Specific examples of conventionally known modifiers include coumaron/indene resin, petroleum resin, polyester, alkyd resin, polyvinyl alcohol, epoxy resin, ethylene/vinyl acetate, polyvinyl acetate, polybutadiene, polyether, polyethyleneimine, and polychloride. Vinyl, polyacrylic ester, polyvinyl butyral,
Polymers and oligomers such as phenoxy resin, cellulose acetate, xylene resin, toluene resin, polyamide, styrene resin, polyvinyl formal, acrylic resin, urethane resin, nylon, lignin, lignin sulfonic acid, rosin, ester gum, vegetable oil, bitumen , heavy oil, cashew nut shell liquid, vanillin, natural products such as tannins, saccharides and their derivatives such as starch, cornstarch, glucose, dextrin, resorcin residue, cresol residue, 2.2.4-trimethyl-4-( Reaction residues and by-products such as reaction by-products of hydroxyphenyl) coumarone and isopropenylphenol, reaction by-products of terephthalic acid and ethylene glycol, polyhydric alcohols such as polyethylene glycol, ketones such as acetone, cyclohexanone, acetophenone, etc. Condensates with aldehydes, amino or imino compounds such as dicyandiamide, acrylamide, and thiourea, and their aldehyde condensates, aldehyde compounds such as furfural and glyoxal, and ester compounds such as isocyanuric acid esters and unsaturated fatty acid esters. be.
本発明に用いられる樹脂成分は(イ)、(ロ)ともに常
温で固体であるが、これを微粉砕するか、あるいは塊状
のまま加熱した鋳物砂中に投入するか、あるいは溶剤に
溶解した後、鋳物砂中に投入するすることにより耐火性
骨材表面に均一に付着させる。The resin components (a) and (b) used in the present invention are both solid at room temperature, but they can be finely pulverized, put into heated molding sand as a lump, or dissolved in a solvent and then By pouring it into foundry sand, it is made to adhere uniformly to the surface of the refractory aggregate.
本発明において、樹脂成分(イ)、(ロ)は耐火性骨材
100重量部に対しくイ)+(ロ)総量で0.5〜8重
量部、好ましくは1〜5重量部を配合する。In the present invention, resin components (a) and (b) are blended in a total amount of 0.5 to 8 parts by weight, preferably 1 to 5 parts by weight, per 100 parts by weight of the fire-resistant aggregate. .
そのうち、樹脂成分(イ)は耐火性骨材100重量部に
対し0.1〜5重量部、好ましくは0.3〜3重量部を
配合する。Among them, the resin component (a) is blended in an amount of 0.1 to 5 parts by weight, preferably 0.3 to 3 parts by weight, per 100 parts by weight of the refractory aggregate.
本発明の樹脂成分(イ)、(ロ)は予め一部反応させた
状態で砂に被覆してもよいが、一般には反応させない状
態で砂に被覆する。被覆中に砂は加熱されているので、
その熱により一部反応が進行することがある。Although the resin components (a) and (b) of the present invention may be partially reacted in advance and coated on the sand, they are generally coated on the sand without being reacted. Since the sand is heated during coating,
Part of the reaction may proceed due to the heat.
本発明における樹脂成分(イ)、(ロ)には本発明の効
果を更に一層太き(するためにシランカップリング剤(
例えばT−ウレイドプロピルトリエトキシシラン)、滑
材(例えばステアリン酸カルシウム)等を配合してもよ
い。In order to further enhance the effect of the present invention, the resin components (a) and (b) in the present invention contain a silane coupling agent.
For example, T-ureidopropyltriethoxysilane), a lubricant (for example, calcium stearate), etc. may be added.
また、本発明における硬化剤としてはシュウ酸、サリチ
ル酸、マレイン酸、ホウ酸、ベンゼンスルホン酸、トル
エンスルホン酸、キシレンスルホン酸等の有機スルホン
酸等の酸の少なくとも1種、あるいはシュウ酸、サリチ
ル酸、マレイン酸、ホウ酸、トルエンスルホン酸、キシ
レンスルホン酸、ベンゼンスルホン酸等の有機スルホン
酸等と銅、鉄、アルごニウム、亜鉛、尿素、メラミン、
アミンなどとの塩、塩化銅、塩化鉄等のルイス酸等の常
温で固体の酸あるいは塩が使用され、その配合量は、樹
脂成分(イ)+(ロ)総量に対して0゜5〜50重量%
、好ましくは10〜40重量%である。この硬化剤を樹
脂成分と共に砂に被覆することにより鋳型造型時の被覆
砂の硬化時間を短くすることができる。Further, as the curing agent in the present invention, at least one acid such as oxalic acid, salicylic acid, maleic acid, boric acid, benzenesulfonic acid, toluenesulfonic acid, organic sulfonic acid such as xylene sulfonic acid, or oxalic acid, salicylic acid, Organic sulfonic acids such as maleic acid, boric acid, toluenesulfonic acid, xylene sulfonic acid, benzenesulfonic acid, etc. and copper, iron, argonium, zinc, urea, melamine,
Acids or salts that are solid at room temperature, such as salts with amines, copper chloride, iron chloride, and other Lewis acids, are used, and the blending amount is 0°5 to 0.5 to the total amount of resin components (a) + (b). 50% by weight
, preferably 10 to 40% by weight. By coating the sand with this curing agent together with the resin component, the curing time of the coated sand during mold making can be shortened.
本発明において用いられる耐火性粒状骨材としては、石
英質を主成分とする珪砂の他、ジルコン砂、クロマイト
砂、オリピン砂等が使用されるが、特にこれらに限定さ
れものではない。The refractory granular aggregate used in the present invention includes, but is not particularly limited to, silica sand containing quartz as a main component, zircon sand, chromite sand, oripin sand, and the like.
(実 施 例)
以下実施例にて本発明を説明するが、本発明はこれらの
実施例に限定されるものではない。(Examples) The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.
実施例1〜8
オーストラリア産フラタリー珪砂100重量部に、表−
1に示す如き硬化剤の20%メタノール溶液を2重量部
、表−1に示す如き樹脂成分(ロ)の20%メタノール
溶液5重量部を加えてミキサーにて混練し、溶剤を蒸発
させた後、表−■に示す如き樹脂成分(イ)の20%メ
タノール溶液5重量部を加えてミキサーにて混練し、溶
剤を蒸発させた後、ステアリン酸カルシウム0.1重量
部を加えて混練し、流動性のある被覆砂を得た。Examples 1 to 8 100 parts by weight of Australian flattery silica sand was added with the table below.
After adding 2 parts by weight of a 20% methanol solution of the curing agent shown in Table 1 and 5 parts by weight of a 20% methanol solution of the resin component (b) shown in Table 1, kneading them in a mixer and evaporating the solvent. , 5 parts by weight of a 20% methanol solution of the resin component (a) as shown in Table 1 was added and kneaded in a mixer, the solvent was evaporated, and 0.1 part by weight of calcium stearate was added and kneaded to obtain a fluidized A coated sand with good properties was obtained.
この被覆砂を、予め180°Cに加熱した25 X 2
5X 250m/mの型枠に加圧空気と共に吹き込んで
充填し、10秒間焼放して鋳型を成型した。This coated sand was heated to 180°C in advance in a 25 x 2
A mold of 5×250 m/m was filled by blowing with pressurized air and baked for 10 seconds to form a mold.
抜型後10秒後の曲げ強度及び鋳型かさ比重を測定した
。結果を表−1に示す。The bending strength and bulk specific gravity of the mold were measured 10 seconds after the mold was removed. The results are shown in Table-1.
比較例1. 2
オーストラリア産フラタリー珪砂100重量部に対し、
軟化点85°C1平均分子量1150のノボラック型フ
ェノール樹脂2重量部、20%へキサメチレンテトラミ
ン水溶液1.5重量部、ステアリン酸カルシウム0.1
重量部を被覆した樹脂被覆砂を、予め表−2に示す温度
に加熱した25 X 25X 250m/mの金型に加
圧空気と共に吹き込んで充填し、表−2に示す時間焼成
して鋳型を成型し、実施例1と同様の評価を行った。結
果を表−2に示す。Comparative example 1. 2 For 100 parts by weight of Australian flattery silica sand,
2 parts by weight of novolac type phenolic resin with a softening point of 85°C and an average molecular weight of 1150, 1.5 parts by weight of a 20% hexamethylenetetramine aqueous solution, and 0.1 parts by weight of calcium stearate.
The resin-coated sand coated with the weight part was blown and filled with pressurized air into a 25 x 25 x 250 m/m mold that had been preheated to the temperature shown in Table 2, and was fired for the time shown in Table 2 to form the mold. It was molded and evaluated in the same manner as in Example 1. The results are shown in Table-2.
比較例3,4
オーストラリア産フラタリー珪砂100重量部に表−2
に示す如き硬化剤の20%水溶液を0.45重量部、尿
素変性フラン樹脂を1.5重量部使用して作った被覆砂
を、予め表−2に示す温度に加熱した25 X 25
X 250−/mの金型に加圧空気と共に吹き込んで充
填し、表−2に示す時間焼成して鋳型を成型し、実施例
1と同様の評価を行った。結果を表−2に示す。Comparative Examples 3 and 4 Table 2 in 100 parts by weight of Australian flattery silica sand
A coated sand prepared by using 0.45 parts by weight of a 20% aqueous solution of a curing agent as shown in Table 2 and 1.5 parts by weight of a urea-modified furan resin was heated in advance to the temperature shown in Table 2.
The mixture was blown into a mold of X 250-/m and filled with pressurized air, fired for the time shown in Table 2 to form a mold, and evaluated in the same manner as in Example 1. The results are shown in Table-2.
Claims (1)
材表面に被覆した鋳型製造用被覆砂。 樹脂成分(イ) (i)澱粉から誘導される分子内に2つ以上のアルデヒ
ド基を有する化合物 (ii)下記の式で表されるポリアルデヒド▲数式、化
学式、表等があります▼ (式中、mは0又は1、nは0又は1、lは1〜5の数
を表す。ただしm=0のときn=1、m=1のときn=
0である。) (iii)下記の式で表されるポリアルデヒド▲数式、
化学式、表等があります▼ (式中、m、nは2又は3、k、lは0〜50の数を表
す。R_1、R_2はそれぞれH−又はCH_3−をを
表す。) (iv)下記の式で表されるポリアルデヒド▲数式、化
学式、表等があります▼ (式中、mは0〜4、nは2〜3の数を表し、RはH−
、CH_3−、C_2H_5、C_3H_7−、HO−
、H_3CO−、HOOC−、H_2N−の少なくとも
1種である。)上記(i)〜(iv)の中から選ばれた
1種又は2種以上のポリアルデヒド化合物。 樹脂成分(ロ) 常温で固体であり、活性水素を持ち樹脂成 分(イ)と反応して▲数式、化学式、表等があります▼
結合(X;アルデヒド残基)を生成し得る化合物。[Scope of Claims] 1. A coated sand for mold manufacturing, in which the surface of a refractory aggregate is coated with the following resin components (a) and (b) and a curing agent. Resin component (a) (i) Compound having two or more aldehyde groups in the molecule derived from starch (ii) Polyaldehyde represented by the formula below ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (in the formula , m is 0 or 1, n is 0 or 1, l is a number from 1 to 5. However, when m = 0, n = 1, and when m = 1, n =
It is 0. ) (iii) Polyaldehyde represented by the following formula ▲ Formula,
There are chemical formulas, tables, etc. ▼ (In the formula, m and n represent 2 or 3, k and l represent numbers from 0 to 50. R_1 and R_2 each represent H- or CH_3-.) (iv) Below Polyaldehyde represented by the formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, m represents a number from 0 to 4, n represents a number from 2 to 3, and R represents H-
, CH_3-, C_2H_5, C_3H_7-, HO-
, H_3CO-, HOOC-, and H_2N-. ) One or more polyaldehyde compounds selected from the above (i) to (iv). Resin component (B) It is solid at room temperature, has active hydrogen, and reacts with resin component (B) ▲There are mathematical formulas, chemical formulas, tables, etc.▼
A compound that can form a bond (X; aldehyde residue).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1229076A JP2747054B2 (en) | 1989-09-04 | 1989-09-04 | Coated sand for mold production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1229076A JP2747054B2 (en) | 1989-09-04 | 1989-09-04 | Coated sand for mold production |
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Publication Number | Publication Date |
---|---|
JPH0390246A true JPH0390246A (en) | 1991-04-16 |
JP2747054B2 JP2747054B2 (en) | 1998-05-06 |
Family
ID=16886367
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JP1229076A Expired - Fee Related JP2747054B2 (en) | 1989-09-04 | 1989-09-04 | Coated sand for mold production |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823177A (en) * | 1981-08-03 | 1983-02-10 | オ−トメ−シヨン・インダストリ−ズ・インコ−ポレ−テツド | Shielding cover for rapid return type electric connector |
-
1989
- 1989-09-04 JP JP1229076A patent/JP2747054B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823177A (en) * | 1981-08-03 | 1983-02-10 | オ−トメ−シヨン・インダストリ−ズ・インコ−ポレ−テツド | Shielding cover for rapid return type electric connector |
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