JPH0389166U - - Google Patents

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Publication number
JPH0389166U
JPH0389166U JP14878989U JP14878989U JPH0389166U JP H0389166 U JPH0389166 U JP H0389166U JP 14878989 U JP14878989 U JP 14878989U JP 14878989 U JP14878989 U JP 14878989U JP H0389166 U JPH0389166 U JP H0389166U
Authority
JP
Japan
Prior art keywords
wall
liquid supply
large number
electrolytic
electrolytic cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14878989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14878989U priority Critical patent/JPH0389166U/ja
Publication of JPH0389166U publication Critical patent/JPH0389166U/ja
Pending legal-status Critical Current

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  • Electrolytic Production Of Metals (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案電解槽の一実施例を示す斜視
図、第2図は、電解槽短辺側断面として示す本考
案電解槽例の説明図、第3図は、本考案電解槽の
給液側内壁の一実施例を示す説明図、第4図は、
本考案電解槽の排液側内壁の一実施例を示す説明
図である。 1……電解槽、3,7……長手方向側壁、5…
…アノード、9……カソード、10……電解液供
給管、11……給液側内壁、12……給液穴、1
3……隔壁、15……排液側内壁、16……排液
穴、17……下部排出穴、18……集合排液管、
20……沈降物排出管。
Fig. 1 is a perspective view showing an embodiment of the electrolytic cell of the present invention, Fig. 2 is an explanatory diagram of an example of the electrolytic cell of the present invention shown as a cross section on the short side of the electrolytic cell, and Fig. 3 is an illustration of the electrolytic cell of the present invention. FIG. 4 is an explanatory diagram showing an example of the inner wall on the liquid supply side.
FIG. 2 is an explanatory diagram showing an embodiment of the drain-side inner wall of the electrolytic cell of the present invention. 1... Electrolytic cell, 3, 7... Longitudinal side wall, 5...
... Anode, 9 ... Cathode, 10 ... Electrolyte supply pipe, 11 ... Liquid supply side inner wall, 12 ... Liquid supply hole, 1
3... Partition wall, 15... Drain side inner wall, 16... Drain hole, 17... Lower drain hole, 18... Collection drain pipe,
20...Sediment discharge pipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電解精製又は電解採取用電解槽において、平行
して設置されたアノード5及びカソード9それぞ
れの面に直交する側の電解槽1の側壁3,7のそ
れぞれの内側に、間隔をおいて給液側内壁11及
び排液側内壁15を設け、給液側内壁11に多数
の給液穴12を設け、排液側内壁15に給液穴1
2に対向して多数の排液穴16を設けてなる高純
度金属製造用電解層。
In an electrolytic cell for electrolytic refining or electrowinning, a liquid supply side is provided at intervals on the inside of each of the side walls 3, 7 of the electrolytic cell 1 on the side perpendicular to the respective surfaces of the anode 5 and cathode 9 installed in parallel. An inner wall 11 and a drain side inner wall 15 are provided, a large number of liquid supply holes 12 are provided in the liquid supply side inner wall 11, and a large number of liquid supply holes 1 are provided in the liquid drain side inner wall 15.
An electrolytic layer for producing high-purity metals, which is provided with a large number of drainage holes 16 opposite to the electrolytic layer 2.
JP14878989U 1989-12-25 1989-12-25 Pending JPH0389166U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14878989U JPH0389166U (en) 1989-12-25 1989-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14878989U JPH0389166U (en) 1989-12-25 1989-12-25

Publications (1)

Publication Number Publication Date
JPH0389166U true JPH0389166U (en) 1991-09-11

Family

ID=31695223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14878989U Pending JPH0389166U (en) 1989-12-25 1989-12-25

Country Status (1)

Country Link
JP (1) JPH0389166U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010537051A (en) * 2007-08-27 2010-12-02 メットトップ ゲーエムベーハー How to operate a copper electrolytic cell
JP2013036074A (en) * 2011-08-05 2013-02-21 Jx Nippon Mining & Metals Corp Method of producing indium hydroxide and compound including indium hydroxide
JP2014208871A (en) * 2013-03-25 2014-11-06 住友金属鉱山株式会社 Anode and method of producing the same
JP2016033242A (en) * 2014-07-31 2016-03-10 佐々木半田工業株式会社 High-current-density electrolytic refining method of tin
JP2016117928A (en) * 2014-12-19 2016-06-30 住友金属鉱山株式会社 Electrolytic device for indium hydroxide powder or tin hydroxide powder, method for producing indium hydroxide powder or tin hydroxide powder, and method for producing sputtering target

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121292A (en) * 1983-11-08 1985-06-28 バルター ホルツアー Method and apparatus for separating copper, for example, from electrolytic bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121292A (en) * 1983-11-08 1985-06-28 バルター ホルツアー Method and apparatus for separating copper, for example, from electrolytic bath

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010537051A (en) * 2007-08-27 2010-12-02 メットトップ ゲーエムベーハー How to operate a copper electrolytic cell
JP2013036074A (en) * 2011-08-05 2013-02-21 Jx Nippon Mining & Metals Corp Method of producing indium hydroxide and compound including indium hydroxide
JP2014208871A (en) * 2013-03-25 2014-11-06 住友金属鉱山株式会社 Anode and method of producing the same
WO2015022846A1 (en) * 2013-08-13 2015-02-19 住友金属鉱山株式会社 Anode and method for manufacturing same
JP2016033242A (en) * 2014-07-31 2016-03-10 佐々木半田工業株式会社 High-current-density electrolytic refining method of tin
JP2016117928A (en) * 2014-12-19 2016-06-30 住友金属鉱山株式会社 Electrolytic device for indium hydroxide powder or tin hydroxide powder, method for producing indium hydroxide powder or tin hydroxide powder, and method for producing sputtering target

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