JPH0388352U - - Google Patents
Info
- Publication number
- JPH0388352U JPH0388352U JP14835389U JP14835389U JPH0388352U JP H0388352 U JPH0388352 U JP H0388352U JP 14835389 U JP14835389 U JP 14835389U JP 14835389 U JP14835389 U JP 14835389U JP H0388352 U JPH0388352 U JP H0388352U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- charge
- sealing
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14835389U JPH0388352U (lt) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14835389U JPH0388352U (lt) | 1989-12-22 | 1989-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0388352U true JPH0388352U (lt) | 1991-09-10 |
Family
ID=31694808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14835389U Pending JPH0388352U (lt) | 1989-12-22 | 1989-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0388352U (lt) |
-
1989
- 1989-12-22 JP JP14835389U patent/JPH0388352U/ja active Pending