JPH0388336U - - Google Patents
Info
- Publication number
- JPH0388336U JPH0388336U JP15069189U JP15069189U JPH0388336U JP H0388336 U JPH0388336 U JP H0388336U JP 15069189 U JP15069189 U JP 15069189U JP 15069189 U JP15069189 U JP 15069189U JP H0388336 U JPH0388336 U JP H0388336U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- cavity
- accommodation hole
- mold
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15069189U JPH0388336U (sk) | 1989-12-26 | 1989-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15069189U JPH0388336U (sk) | 1989-12-26 | 1989-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0388336U true JPH0388336U (sk) | 1991-09-10 |
Family
ID=31697031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15069189U Pending JPH0388336U (sk) | 1989-12-26 | 1989-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0388336U (sk) |
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1989
- 1989-12-26 JP JP15069189U patent/JPH0388336U/ja active Pending