JPH0385682U - - Google Patents

Info

Publication number

JPH0385682U

JPH0385682U JP14726189U JP14726189U JPH0385682U JP H0385682 U JPH0385682 U JP H0385682U JP 14726189 U JP14726189 U JP 14726189U JP 14726189 U JP14726189 U JP 14726189U JP H0385682 U JPH0385682 U JP H0385682U

Authority

JP

Japan

Prior art keywords

electrode

connection pad

circuit board

printed circuit

chip component

Prior art date

1989-12-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011248 coating agent Substances 0.000 claims description 2
• 238000000576 coating method Methods 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2

Cited By (2)