JPH0385653U - - Google Patents

Info

Publication number
JPH0385653U
JPH0385653U JP1989147034U JP14703489U JPH0385653U JP H0385653 U JPH0385653 U JP H0385653U JP 1989147034 U JP1989147034 U JP 1989147034U JP 14703489 U JP14703489 U JP 14703489U JP H0385653 U JPH0385653 U JP H0385653U
Authority
JP
Japan
Prior art keywords
heating element
plate structure
cold plate
discharge passage
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989147034U
Other languages
Japanese (ja)
Other versions
JPH0648871Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147034U priority Critical patent/JPH0648871Y2/en
Publication of JPH0385653U publication Critical patent/JPH0385653U/ja
Application granted granted Critical
Publication of JPH0648871Y2 publication Critical patent/JPH0648871Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の実施例を示す図であり、第
２図は、第１図における一部断面図であり、第３
図は、第１図の外観図であり、第４図は、従来の
構造を示し、第５図は、第４図における一部断面
図であり、第６図は、第４図の外観図である。 図において、１……基板、２……コールドプレ
ート、３……発熱素子、４……冷媒供給大流路、
７……冷媒帰還大流路、１１……排出穴、１１′
……排出路、をそれぞれ示す。 FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a partial sectional view of FIG. 1, and FIG.
The figures are an external view of Fig. 1, Fig. 4 shows a conventional structure, Fig. 5 is a partial sectional view of Fig. 4, and Fig. 6 is an external view of Fig. 4. It is. In the figure, 1...board, 2...cold plate, 3...heating element, 4...coolant supply large flow path,
7... Refrigerant return large flow path, 11... Discharge hole, 11'
...Exhaust channels are shown respectively.

Claims (1)

【実用新案登録請求の範囲】 基板１に実装された発熱素子３を冷却する冷却
液がその内部で循環されてなるコールドプレート
構造において、 前記冷却プレートを構成してなる１ブロツクに
冷却液が供給される冷媒供給大流路４と 前記発熱素子３に衝突した冷却液が排出される
排出穴１１と、 該排出穴１１に連通される排出路１１′と、 該排出路１１′と連通される冷媒帰還大流路７
を該発熱素子３単位に形成してなることを特徴と
するコールドプレート構造。[Claims for Utility Model Registration] In a cold plate structure in which a cooling liquid for cooling a heating element 3 mounted on a substrate 1 is circulated within the cold plate structure, the cooling liquid is supplied to one block forming the cooling plate. a large refrigerant supply channel 4, a discharge hole 11 through which the coolant that has collided with the heating element 3 is discharged, a discharge passage 11' communicating with the discharge hole 11, and a discharge passage 11' communicating with the discharge passage 11'. Refrigerant return large flow path 7
A cold plate structure characterized in that the heating element is formed in three units.
JP1989147034U 1989-12-22 1989-12-22 Cold plate structure Expired - Lifetime JPH0648871Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (en) 1989-12-22 1989-12-22 Cold plate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147034U JPH0648871Y2 (en) 1989-12-22 1989-12-22 Cold plate structure

Publications (2)

Publication Number Publication Date
JPH0385653U true JPH0385653U (en) 1991-08-29
JPH0648871Y2 JPH0648871Y2 (en) 1994-12-12

Family

ID=31693567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147034U Expired - Lifetime JPH0648871Y2 (en) 1989-12-22 1989-12-22 Cold plate structure

Country Status (1)

Country Link
JP (1) JPH0648871Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006170538A (en) * 2004-12-16 2006-06-29 Daikin Ind Ltd Heat exchange system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006170538A (en) * 2004-12-16 2006-06-29 Daikin Ind Ltd Heat exchange system
JP4635595B2 (en) * 2004-12-16 2011-02-23 ダイキン工業株式会社 Heat exchange system

Also Published As

Publication number Publication date
JPH0648871Y2 (en) 1994-12-12

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