JPH0385649U - - Google Patents
Info
- Publication number
- JPH0385649U JPH0385649U JP14702389U JP14702389U JPH0385649U JP H0385649 U JPH0385649 U JP H0385649U JP 14702389 U JP14702389 U JP 14702389U JP 14702389 U JP14702389 U JP 14702389U JP H0385649 U JPH0385649 U JP H0385649U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- protrusion
- suction head
- suction surface
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Description
第１図は本考案に係るウエーハチヤツクの平面
図、第２図は第１図の−線断面図、第３図は
第２図Ａ部の拡大詳細図、第４図は同ウエーハチ
ヤツクの作用説明図、第５図は従来のウエーハチ
ヤツクの斜視図である。
１……ウエーハチヤツク、２……吸着ヘツド、
２ａ……吸着面、４……ガス噴出孔、５……突起
。
Fig. 1 is a plan view of the wafer hatch according to the present invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, Fig. 3 is an enlarged detailed view of section A in Fig. 2, and Fig. 4 is an explanatory diagram of the operation of the wafer hatch. , FIG. 5 is a perspective view of a conventional wafer chuck. 1... Wafer chuck, 2... Suction head,
2a...Adsorption surface, 4...Gas blowout hole, 5...Protrusion.
Claims (1)
の透明石英製吸着ヘツドの吸着面外周部に、耐熱
性樹脂から成る複数の突起を突設して構成される
ことを特徴とするウエーハチヤツク。 (2) 前記突起は、ポリイミド系樹脂で構成され
ることを特徴とする請求項１記載のウエーハチヤ
ツク。 (3) 前記突起は、前記吸着ヘツドに着脱自在に
取り付けられることを特徴とする請求項１又は２
記載のウエーハチヤツク。[Scope of Claim for Utility Model Registration] (1) A disc-shaped transparent quartz suction head consisting of a gas outlet opening on the suction surface, with a plurality of protrusions made of heat-resistant resin protruding from the outer periphery of the suction surface. A wafer hat characterized by being composed of. (2) The wafer backpack according to claim 1, wherein the protrusion is made of polyimide resin. (3) Claim 1 or 2, wherein the protrusion is detachably attached to the suction head.
The wafer gear described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14702389U JPH0385649U (en) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14702389U JPH0385649U (en) | 1989-12-22 | 1989-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385649U true JPH0385649U (en) | 1991-08-29 |
Family
ID=31693557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14702389U Pending JPH0385649U (en) | 1989-12-22 | 1989-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385649U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011027547A1 (en) * | 2009-09-07 | 2011-03-10 | 村田機械株式会社 | Substrate transfer apparatus |
-
1989
- 1989-12-22 JP JP14702389U patent/JPH0385649U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011027547A1 (en) * | 2009-09-07 | 2011-03-10 | 村田機械株式会社 | Substrate transfer apparatus |