JPH0385637U - - Google Patents
Info
- Publication number
- JPH0385637U JPH0385637U JP14761189U JP14761189U JPH0385637U JP H0385637 U JPH0385637 U JP H0385637U JP 14761189 U JP14761189 U JP 14761189U JP 14761189 U JP14761189 U JP 14761189U JP H0385637 U JPH0385637 U JP H0385637U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- pick
- semiconductor
- collection
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14761189U JPH0385637U (en, 2012) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14761189U JPH0385637U (en, 2012) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385637U true JPH0385637U (en, 2012) | 1991-08-29 |
Family
ID=31694117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14761189U Pending JPH0385637U (en, 2012) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385637U (en, 2012) |
-
1989
- 1989-12-21 JP JP14761189U patent/JPH0385637U/ja active Pending