JPH0385198U - - Google Patents
Info
- Publication number
- JPH0385198U JPH0385198U JP14646189U JP14646189U JPH0385198U JP H0385198 U JPH0385198 U JP H0385198U JP 14646189 U JP14646189 U JP 14646189U JP 14646189 U JP14646189 U JP 14646189U JP H0385198 U JPH0385198 U JP H0385198U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lower mold
- molding die
- backward
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Control Of Presses (AREA)
Description
第1図は本考案の一実施例を示す図。第2図は
本考案の一実施例において金型を示す図。
1……下金型、2……受材、3……上金型、4
……芯出し調整装置、5……歪センサ、6……増
幅器、7……表示装置、8……許容可能な歪みレ
ベル。
FIG. 1 is a diagram showing an embodiment of the present invention. FIG. 2 is a diagram showing a mold in an embodiment of the present invention. 1...Lower mold, 2...Receiving material, 3...Upper mold, 4
... centering adjustment device, 5 ... strain sensor, 6 ... amplifier, 7 ... display device, 8 ... allowable distortion level.
Claims (1)
金型装置において、上金型または下金型の外周に
対向してX方向、Y方向にそれぞれ設けられた歪
センサと、上金型が下金型に進退自在したさいの
前記歪センサからの検出信号をX−Y座標に表示
し予め定めた許容設定レベルと比較する表示装置
とからなることを特徴とする成形金型の芯出し装
置。 In a molding die device in which an upper mold is movable forward and backward relative to a lower mold, strain sensors are provided in the X direction and the Y direction, respectively, facing the outer periphery of the upper mold or the lower mold, and A core of a molding die, characterized by comprising a display device that displays the detection signal from the strain sensor on X-Y coordinates when the mold is freely moving forward and backward into the lower mold, and compares it with a predetermined allowable setting level. Output device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14646189U JPH0385198U (en) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14646189U JPH0385198U (en) | 1989-12-21 | 1989-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0385198U true JPH0385198U (en) | 1991-08-28 |
Family
ID=31693041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14646189U Pending JPH0385198U (en) | 1989-12-21 | 1989-12-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0385198U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008000933A (en) * | 2006-06-20 | 2008-01-10 | Dainippon Printing Co Ltd | Memo pad with calendar and memo pad with indicating body |
JP2019098338A (en) * | 2017-11-28 | 2019-06-24 | 株式会社デンソー | Alignment device and alignment method |
-
1989
- 1989-12-21 JP JP14646189U patent/JPH0385198U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008000933A (en) * | 2006-06-20 | 2008-01-10 | Dainippon Printing Co Ltd | Memo pad with calendar and memo pad with indicating body |
JP2019098338A (en) * | 2017-11-28 | 2019-06-24 | 株式会社デンソー | Alignment device and alignment method |