JPH038461U - - Google Patents
Info
- Publication number
- JPH038461U JPH038461U JP6684089U JP6684089U JPH038461U JP H038461 U JPH038461 U JP H038461U JP 6684089 U JP6684089 U JP 6684089U JP 6684089 U JP6684089 U JP 6684089U JP H038461 U JPH038461 U JP H038461U
- Authority
- JP
- Japan
- Prior art keywords
- current circuit
- circuit board
- insulating board
- board
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 3
- 239000011888 foil Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6684089U JPH0720937Y2 (ja) | 1989-06-09 | 1989-06-09 | 複合回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6684089U JPH0720937Y2 (ja) | 1989-06-09 | 1989-06-09 | 複合回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH038461U true JPH038461U (zh) | 1991-01-28 |
| JPH0720937Y2 JPH0720937Y2 (ja) | 1995-05-15 |
Family
ID=31599899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6684089U Expired - Lifetime JPH0720937Y2 (ja) | 1989-06-09 | 1989-06-09 | 複合回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720937Y2 (zh) |
-
1989
- 1989-06-09 JP JP6684089U patent/JPH0720937Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720937Y2 (ja) | 1995-05-15 |