JPH0383955U - - Google Patents
Info
- Publication number
- JPH0383955U JPH0383955U JP14548289U JP14548289U JPH0383955U JP H0383955 U JPH0383955 U JP H0383955U JP 14548289 U JP14548289 U JP 14548289U JP 14548289 U JP14548289 U JP 14548289U JP H0383955 U JPH0383955 U JP H0383955U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- main body
- bent
- component main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14548289U JPH0383955U (fi) | 1989-12-19 | 1989-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14548289U JPH0383955U (fi) | 1989-12-19 | 1989-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383955U true JPH0383955U (fi) | 1991-08-26 |
Family
ID=31692115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14548289U Pending JPH0383955U (fi) | 1989-12-19 | 1989-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383955U (fi) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595651A (ja) * | 1982-07-01 | 1984-01-12 | Fujitsu Ltd | 樹脂封止型半導体装置およびその製造方法 |
| JPS626244B2 (fi) * | 1979-08-01 | 1987-02-09 | Hitachi Ltd | |
| JPH01255253A (ja) * | 1988-04-04 | 1989-10-12 | Ibiden Co Ltd | プリント基板に実装される電子部品 |
-
1989
- 1989-12-19 JP JP14548289U patent/JPH0383955U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS626244B2 (fi) * | 1979-08-01 | 1987-02-09 | Hitachi Ltd | |
| JPS595651A (ja) * | 1982-07-01 | 1984-01-12 | Fujitsu Ltd | 樹脂封止型半導体装置およびその製造方法 |
| JPH01255253A (ja) * | 1988-04-04 | 1989-10-12 | Ibiden Co Ltd | プリント基板に実装される電子部品 |