JPH0383954U - - Google Patents
Info
- Publication number
- JPH0383954U JPH0383954U JP14540889U JP14540889U JPH0383954U JP H0383954 U JPH0383954 U JP H0383954U JP 14540889 U JP14540889 U JP 14540889U JP 14540889 U JP14540889 U JP 14540889U JP H0383954 U JPH0383954 U JP H0383954U
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- flat package
- lengths
- chip
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14540889U JPH0383954U (ru) | 1989-12-19 | 1989-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14540889U JPH0383954U (ru) | 1989-12-19 | 1989-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383954U true JPH0383954U (ru) | 1991-08-26 |
Family
ID=31692044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14540889U Pending JPH0383954U (ru) | 1989-12-19 | 1989-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383954U (ru) |
-
1989
- 1989-12-19 JP JP14540889U patent/JPH0383954U/ja active Pending