JPH0381632U - - Google Patents
Info
- Publication number
- JPH0381632U JPH0381632U JP1989141552U JP14155289U JPH0381632U JP H0381632 U JPH0381632 U JP H0381632U JP 1989141552 U JP1989141552 U JP 1989141552U JP 14155289 U JP14155289 U JP 14155289U JP H0381632 U JPH0381632 U JP H0381632U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- electrodes
- electrode surface
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000004840 adhesive resin Substances 0.000 claims 1
- 229920006223 adhesive resin Polymers 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989141552U JPH0381632U (US06826419-20041130-M00005.png) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989141552U JPH0381632U (US06826419-20041130-M00005.png) | 1989-12-08 | 1989-12-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0381632U true JPH0381632U (US06826419-20041130-M00005.png) | 1991-08-21 |
Family
ID=31688436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989141552U Pending JPH0381632U (US06826419-20041130-M00005.png) | 1989-12-08 | 1989-12-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0381632U (US06826419-20041130-M00005.png) |
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1989
- 1989-12-08 JP JP1989141552U patent/JPH0381632U/ja active Pending