JPH0380975U - - Google Patents
Info
- Publication number
- JPH0380975U JPH0380975U JP14165489U JP14165489U JPH0380975U JP H0380975 U JPH0380975 U JP H0380975U JP 14165489 U JP14165489 U JP 14165489U JP 14165489 U JP14165489 U JP 14165489U JP H0380975 U JPH0380975 U JP H0380975U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- recess
- opening
- insulating housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14165489U JPH0380975U (de) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14165489U JPH0380975U (de) | 1989-12-08 | 1989-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380975U true JPH0380975U (de) | 1991-08-19 |
Family
ID=31688532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14165489U Pending JPH0380975U (de) | 1989-12-08 | 1989-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380975U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4463321B1 (ja) * | 2009-06-24 | 2010-05-19 | 勝也 宮木 | 荷物積載用ボード |
-
1989
- 1989-12-08 JP JP14165489U patent/JPH0380975U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4463321B1 (ja) * | 2009-06-24 | 2010-05-19 | 勝也 宮木 | 荷物積載用ボード |