JPH0380252A - Photosetting resin composition - Google Patents
Photosetting resin compositionInfo
- Publication number
- JPH0380252A JPH0380252A JP21808589A JP21808589A JPH0380252A JP H0380252 A JPH0380252 A JP H0380252A JP 21808589 A JP21808589 A JP 21808589A JP 21808589 A JP21808589 A JP 21808589A JP H0380252 A JPH0380252 A JP H0380252A
- Authority
- JP
- Japan
- Prior art keywords
- polyester
- acrylate
- acid
- methacrylate
- glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 24
- 229920000728 polyester Polymers 0.000 claims abstract description 44
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 12
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 5
- -1 methacryloyl group Chemical group 0.000 claims description 31
- 229920001169 thermoplastic Polymers 0.000 claims description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 238000001723 curing Methods 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 6
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- 125000004386 diacrylate group Chemical group 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 150000002596 lactones Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- WZESLRDFSNLECD-UHFFFAOYSA-N phenyl prop-2-eneperoxoate Chemical class C=CC(=O)OOC1=CC=CC=C1 WZESLRDFSNLECD-UHFFFAOYSA-N 0.000 description 3
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 3
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920006344 thermoplastic copolyester Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical compound C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000012644 addition polymerization Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229940057847 polyethylene glycol 600 Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- UHLWGJNVYHBNBV-UHFFFAOYSA-N 1-(1-hydroxypropan-2-yloxy)-3-methoxypropan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.COCC(O)COC(C)CO UHLWGJNVYHBNBV-UHFFFAOYSA-N 0.000 description 1
- IMPRSCUWYGENLJ-UHFFFAOYSA-N 1-(2-hydroxyethoxy)butan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCC(O)COCCO IMPRSCUWYGENLJ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- FLTJDUOFAQWHDF-UHFFFAOYSA-N 2,2-dimethylhexane Chemical compound CCCCC(C)(C)C FLTJDUOFAQWHDF-UHFFFAOYSA-N 0.000 description 1
- QRIMLDXJAPZHJE-UHFFFAOYSA-N 2,3-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CO QRIMLDXJAPZHJE-UHFFFAOYSA-N 0.000 description 1
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- ZDTLUUIYCAMIMQ-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(O)COCCO ZDTLUUIYCAMIMQ-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- JQCWCBBBJXQKDE-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(O)COCCOCCO JQCWCBBBJXQKDE-UHFFFAOYSA-N 0.000 description 1
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 description 1
- ZUOBXYGNVPJKLK-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-1-methoxyethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(O)COCCOCCOCCO ZUOBXYGNVPJKLK-UHFFFAOYSA-N 0.000 description 1
- TVFJLSWPPLFHKR-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCCOCCOCC(O)OC1=CC=CC=C1 TVFJLSWPPLFHKR-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- ADRHDZXSVIPHAF-UHFFFAOYSA-N 2-[2-[2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCCOCCOCCOCCOCC(O)OC1=CC=CC=C1 ADRHDZXSVIPHAF-UHFFFAOYSA-N 0.000 description 1
- HLCPWBZNUKCSBN-UHFFFAOYSA-N 2-aminobenzonitrile Chemical class NC1=CC=CC=C1C#N HLCPWBZNUKCSBN-UHFFFAOYSA-N 0.000 description 1
- DJKKWVGWYCKUFC-UHFFFAOYSA-N 2-butoxyethyl 2-methylprop-2-enoate Chemical compound CCCCOCCOC(=O)C(C)=C DJKKWVGWYCKUFC-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- WSFYPFLCEFLXOZ-UHFFFAOYSA-N 2-decylbutanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)CC(O)=O WSFYPFLCEFLXOZ-UHFFFAOYSA-N 0.000 description 1
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-hydroxyoctadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- LLEJOIKEASLYBB-UHFFFAOYSA-N 2-nonadecylpropanedioic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(C(O)=O)C(O)=O LLEJOIKEASLYBB-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FNUNONDFVXOMML-UHFFFAOYSA-N OC(=O)C=C.C1CCC=CC=CC=CC1 Chemical class OC(=O)C=C.C1CCC=CC=CC=CC1 FNUNONDFVXOMML-UHFFFAOYSA-N 0.000 description 1
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- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
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- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
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- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
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- 150000005215 alkyl ethers Chemical class 0.000 description 1
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- 239000003957 anion exchange resin Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
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- 239000012965 benzophenone Substances 0.000 description 1
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- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
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- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- VHHHONWQHHHLTI-UHFFFAOYSA-N hexachloroethane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)Cl VHHHONWQHHHLTI-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- NFMHSPWHNQRFNR-UHFFFAOYSA-N hyponitrous acid Chemical class ON=NO NFMHSPWHNQRFNR-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
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- 239000011976 maleic acid Substances 0.000 description 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
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- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
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- 239000003505 polymerization initiator Substances 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
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Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、光硬化型樹脂組成物に関するものであり、詳
細にはポリエステル成形品への接着性が良好で硬化後も
可撓性に優れており、、塗料、インク、接着剤、さらに
はコーティング剤として広範囲に利用できる光硬化型樹
脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a photocurable resin composition, and specifically, a photocurable resin composition that has good adhesion to polyester molded products and excellent flexibility even after curing. The present invention relates to photocurable resin compositions that can be used in a wide range of applications such as paints, inks, adhesives, and coatings.
(従来の技術) ポリエステルは、優れた機械的特性、耐熱性。(Conventional technology) Polyester has excellent mechanical properties and heat resistance.
耐候性、耐薬性を有することから、繊維、フィルム、シ
ート等、さまざまな成形品の素材として広く用いられて
いる。また、近年、複合化の傾向からポリエステル同士
、あるいは他の樹脂と組み合わせて用いる機会が増えて
おり、その際、ポリエステル樹脂に対する接着性は必須
な条件である。Because it has weather resistance and chemical resistance, it is widely used as a material for various molded products such as fibers, films, and sheets. In addition, in recent years, due to the trend toward composites, opportunities for using polyesters in combination with each other or with other resins have increased, and in this case, adhesion to the polyester resin is an essential condition.
一方、光硬化型樹脂は6省エネルギー、省資源。On the other hand, photocurable resin saves energy and resources.
省スペースあるいは環境汚染対策等の面で利点を有する
。そこで、用途に応じて各種の光硬化型樹脂の研究開発
が積極的に進めらており、それぞれの用途に応じた性能
が要求されてきた。その1つにポリエステル成形品に対
するものがある。It has advantages in terms of space saving and environmental pollution control. Therefore, research and development of various photocurable resins has been actively carried out depending on the application, and performance according to each application has been required. One of them is for polyester molded products.
従来のアクリル系樹脂を主体とする光硬化型樹脂では1
重合硬化に必要なアクリロイル基やメタクリロイル基が
ポリエステルに対する親和性に欠けるので、ポリエステ
ルに対する濡れ性や接着性が劣っていた。またアクリロ
イル基やメタクリロイル基の重合硬化で生じるメチレン
鎖もポリエステルに対して親和性に欠け、ポリエステル
に対する濡れ性や接着性に劣っていた。アクリロイル基
濃度が低くてポリエステルに対して比較的親和性がある
アクリル酸エステルでも1重合硬化するとポリエステル
に対する接着性が低下してしまうので、ポリエステルに
対して十分な接着性能を得るためには、ポリエステル表
面にブライマーを予め塗る等の前処理をする必要があっ
た。またアクリル酸エステルを主体とする光硬化型樹脂
は、硬化すると可撓性が低下してしまうので、フレキシ
ブルなポリエステル成形品に適用した場合、剥離やひび
割れ等が生ずるおそれがあった。1 for conventional photocurable resins mainly based on acrylic resins.
Since the acryloyl group and methacryloyl group necessary for polymerization and curing lack affinity for polyester, the wettability and adhesion to polyester were poor. Furthermore, methylene chains produced by polymerization and curing of acryloyl groups and methacryloyl groups also lacked affinity for polyester, resulting in poor wettability and adhesion to polyester. Even if acrylic ester has a low concentration of acryloyl groups and has a relative affinity for polyester, its adhesion to polyester will decrease if it is cured by single polymerization, so in order to obtain sufficient adhesive performance for polyester, polyester It was necessary to pre-treat the surface by applying a primer on it. Moreover, since the flexibility of photocurable resins mainly composed of acrylic esters decreases when cured, there is a risk that peeling or cracking may occur when applied to flexible polyester molded products.
(発明が解決しようとする課題)
このような状況に鑑み1本発明の課題は、特にポリエス
テル成形品に対して良好な接着性を持ち。(Problems to be Solved by the Invention) In view of the above circumstances, one object of the present invention is to have good adhesion, especially to polyester molded products.
硬化後もなお可撓性を有する光硬化型樹脂組成物の提供
にある。An object of the present invention is to provide a photocurable resin composition that remains flexible even after curing.
(課題を解決するための手段)
本発明者らは、前記課題について鋭意検討した結果、後
述するような成分組成よりなる光硬化型樹脂組成物は光
によって容易に硬化し、ポリエステルに対して良好な接
着性を示し、また硬化後も良好な可撓性を有するという
知見を得9本発明に到達した。(Means for Solving the Problems) As a result of intensive studies on the above-mentioned problems, the present inventors found that a photocurable resin composition having the component composition described below is easily cured by light and has good properties against polyester. The present invention was achieved based on the knowledge that the adhesive exhibits good adhesion and also has good flexibility even after curing.
すなわち1本発明の要旨は次に述べる通りである。That is, the gist of the present invention is as follows.
1分子牛に少なくとも1つのアクリロイル基又はメタク
リロイル基を有する反応性希釈剤5〜95重量部と、数
平均分子量2.000〜20.000の熱可塑性ポリエ
ステルの末端又は側鎖のうちの少なくとも一部に下記(
1)式で表される構造を有する化合物95〜5重量部と
からなることを特徴とする光硬化型樹脂組成物。5 to 95 parts by weight of a reactive diluent having at least one acryloyl group or methacryloyl group per molecule and at least a portion of the terminal or side chain of a thermoplastic polyester having a number average molecular weight of 2.000 to 20.000. below (
1) A photocurable resin composition comprising 95 to 5 parts by weight of a compound having a structure represented by the formula:
OH0
(ただし、Rは水素または炭素数1〜5のアルキル基を
表す。)
本発明において用いられる1分子牛に少なくとも1つの
アクリロイル基またはメタクリロイル基を有する反応性
希釈剤とは2通常光硬化反応の分野で用いられる化合物
で1反応性を持ち、かつ。OH0 (However, R represents hydrogen or an alkyl group having 1 to 5 carbon atoms.) What is the reactive diluent having at least one acryloyl group or methacryloyl group per molecule used in the present invention?2Usually photocuring reaction A compound used in the field of 1 reactivity, and.
溶媒的な働きを有する。例えば、アクリレート類が好適
に用いられ、具体的には、メチルアクリレート、メチル
メタクリレート、エチルアクリレート、エチルメタクリ
レート、プロピルアクリレート、プロピルメタクリレー
ト、ブチルアクリレート、ブチルメタクリレート、ヘキ
シルアクリレート、ヘキシルメタクリレート、オクチル
アクリレート、オクチルメタクリレート、ラウリルアク
リレート、ラウリルメタクリレート、アリルアクリレー
ト、アリルメタクリレート、ベンジルアクリレート、ベ
ンジルメタクリレ−)、ECH(エピクロルヒドリン)
変性ビスフェノールAジアクリレート、EO(エチレン
オキサイド)変性ビスフェノールAジアノリレー)、E
O変性ビスフェノールSジアクリレート、ビスフェノー
ルAジメタクリレート、E○変性ビスフェノールAジメ
タクリレート、1.4−ブタンジオールジアクリレー)
、1.4−ブタンジオールジメタクリレート、ブトキシ
エチルアクリレート、ブトキシエチルメタクリレ−)、
ECH変性ブチルアクリレート、1゜3−ブチレングリ
コールジアクリレート、1.3−ブチレングリコールジ
メタクリレート、シクロへキシルアクリレート、シクロ
へキシルメタクリレート、ジシクロペンタニルアクリレ
ート、ジシクロペンタニルメタクリレート、ジシクロペ
ンテニルアクリレート、E○変性ジシクロペンテニルア
クリレート、E○変性ジシクロペンテニルメタクリレー
ト、ジエチレングリコールジアクリレート。It acts like a solvent. For example, acrylates are preferably used, and specifically, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, hexyl acrylate, hexyl methacrylate, octyl acrylate, octyl methacrylate , lauryl acrylate, lauryl methacrylate, allyl acrylate, allyl methacrylate, benzyl acrylate, benzyl methacrylate), ECH (epichlorohydrin)
Modified bisphenol A diacrylate, EO (ethylene oxide) modified bisphenol A dianorelay), E
O-modified bisphenol S diacrylate, bisphenol A dimethacrylate, E○-modified bisphenol A dimethacrylate, 1,4-butanediol diacrylate)
, 1.4-butanediol dimethacrylate, butoxyethyl acrylate, butoxyethyl methacrylate),
ECH modified butyl acrylate, 1゜3-butylene glycol diacrylate, 1.3-butylene glycol dimethacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, E○ modified dicyclopentenyl acrylate, E○ modified dicyclopentenyl methacrylate, diethylene glycol diacrylate.
ジエチレングリコールジメタクリレート、ECH変性ジ
エチレングリコールジメタクリレート、エチルジエチレ
ングリコールアクリレ−)、ECH変性エチレングリコ
ールジアクリレート、エチレングリコールジメタクリレ
ート、ECH変性エチレングリコールジメタクリレート
、2−エチルヘキシルアクリレート、2−エチルへキシ
ルメタクjJ17−)、グリセロールアクリレート/メ
タクリレート、グリセロールメタクリレート、グリセロ
ールジメタクリレート、グリシジルアクリレート。diethylene glycol dimethacrylate, ECH modified diethylene glycol dimethacrylate, ethyl diethylene glycol acrylate), ECH modified ethylene glycol diacrylate, ethylene glycol dimethacrylate, ECH modified ethylene glycol dimethacrylate, 2-ethylhexyl acrylate, 2-ethylhexylmethacjJ17-), Glycerol acrylate/methacrylate, glycerol methacrylate, glycerol dimethacrylate, glycidyl acrylate.
グリシジルメタクリレ−)、1.6−ヘキサンシオール
ジアクリレー)、ECH変性1.6−ヘキサンジアクリ
レー)、1.6−ヘキサンシオールジメタクリレート、
2−ヒドロキシエチルアクリレート。glycidyl methacrylate), 1,6-hexanethiol diacrylate), ECH-modified 1,6-hexane diacrylate), 1,6-hexanethiol dimethacrylate,
2-Hydroxyethyl acrylate.
2−ヒドロ・キシエチルメタクリレート、カプロラクト
ン変性2−ヒドロキシエチルアクリレート。2-hydroxyethyl methacrylate, caprolactone-modified 2-hydroxyethyl acrylate.
カプロラクトン変性2−ヒドロキシエチルメタクリレー
ト、2−ヒドロキシプロピルアクリレート。Caprolactone-modified 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate.
2−ヒドロキシプロピルメタクリレート、イソボルニル
アクリレート、イソボルニルメタクリレート、イソデシ
ルアクリレート、イソオクチルアクリレート、2−メト
キシエチルアクリレート、メトキシジエチレングリコー
ルメタクリレート、メトキシトリエチレングリコールア
クリレート、メトキシトリエチレングリコールメタクリ
レート。2-hydroxypropyl methacrylate, isobornyl acrylate, isobornyl methacrylate, isodecyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate, methoxydiethylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate.
メトキシテトラエチレングリコールメタクリレート、メ
トキシポリエチレングリコール400メタクリレート、
メトキシジプロピレングリコールアクリレート、メトキ
シ化シクロデカトリエンアクリレート、メトキシ化シク
ロヘキシルジアクリレート、ネオペンチルグリコールジ
アクリレート。Methoxytetraethylene glycol methacrylate, methoxypolyethylene glycol 400 methacrylate,
Methoxydipropylene glycol acrylate, methoxylated cyclodecatriene acrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate.
ネオペンチルグリコールジメタクリレート、ヒドロキシ
ピバリン酸エステルネオペンチルグリコールジアクリレ
ート、カプロラクトン変性ヒドロキシヒバリン酸エステ
ルネオペンチルグリコールジアクリレート、ノニルフェ
ノキシポリエチレングリコールアクリレート、ノニルフ
ェノキシポリプロピレングリコールアクリレート、EC
H変性フェノキシアクリレート、フェノキシエチルアク
リレート、フェノキシエチルメタクリレート、フェノキ
シジエチレングリコールアクリレート、フェノキシテト
ラエチレングリコールアクリレート。Neopentyl glycol dimethacrylate, hydroxypivalic acid ester neopentyl glycol diacrylate, caprolactone-modified hydroxyhyvalic acid ester neopentyl glycol diacrylate, nonylphenoxy polyethylene glycol acrylate, nonylphenoxy polypropylene glycol acrylate, EC
H-modified phenoxy acrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, phenoxydiethylene glycol acrylate, phenoxytetraethylene glycol acrylate.
フェノキシヘキサエチレングリコールアクリレート、フ
ェニルメタクリレート、EO変性フタル酸アクリレート
、カプロラクトン変性フタル酸ジアクリレート、ポリエ
チレングリコール200ジアクリレート、ポリエチレン
グリコール400ジアクリレート、ポリエチレングリコ
ール600ジアクリレート、ポリエチレングリコール9
0メタクリレート。Phenoxyhexaethylene glycol acrylate, phenyl methacrylate, EO-modified phthalic acid acrylate, caprolactone-modified phthalic acid diacrylate, polyethylene glycol 200 diacrylate, polyethylene glycol 400 diacrylate, polyethylene glycol 600 diacrylate, polyethylene glycol 9
0 methacrylate.
ポリエチレングリコール200メタクリレート、ポリエ
チレングリコール400メタクリレート、ポリエチレン
グリコール200ジメタクリレート、ポリエチレングリ
コール400ジメタクリレート、ポリエチレングリコー
ル600ジメタクリレート、ポリプロピレングリコール
400ジアクリレート、ポリプロピレングリコール30
0メタクリレート、ポリプロピレングリコール500メ
タクリレート、ポリプロピレングリコール800メタク
リレート、ポリプロピレングリコール400ジメタクリ
レート、ECH変性プロピレングリコールジアクリレー
ト。Polyethylene glycol 200 methacrylate, polyethylene glycol 400 methacrylate, polyethylene glycol 200 dimethacrylate, polyethylene glycol 400 dimethacrylate, polyethylene glycol 600 dimethacrylate, polypropylene glycol 400 diacrylate, polypropylene glycol 30
0 methacrylate, polypropylene glycol 500 methacrylate, polypropylene glycol 800 methacrylate, polypropylene glycol 400 dimethacrylate, ECH modified propylene glycol diacrylate.
ステアリルアクリレート、テトラエチレングリコールジ
アクリレート、テトラエチレングリコールジメタクリレ
ート、テトラヒドロフルフリルアクリレート、テトラヒ
ドロフルフリルメタクリレート、カプロラクトン変性テ
トラヒドロフルフリルアクリレート、トリエチレングリ
コールジアクリレート、ネオペンチルグリコール変性ト
リメチロールプロパンジアクリレート、トリプロピレン
グリコールジアクリレート等が挙げられる。なお。Stearyl acrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, caprolactone-modified tetrahydrofurfuryl acrylate, triethylene glycol diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, tripropylene Examples include glycol diacrylate. In addition.
前記化合物において、炭素原子に結合した水素原子が、
塩素もしくはフッ素等のハロゲン原子、メチル基等のア
ルキル基、アルコキシ基またはその他の官能基等で置換
されていてもよい。また、これらの化合物のうち1種以
上を適宜組み合わせて用いることができる。In the compound, the hydrogen atom bonded to the carbon atom is
It may be substituted with a halogen atom such as chlorine or fluorine, an alkyl group such as a methyl group, an alkoxy group, or other functional group. Furthermore, one or more of these compounds can be used in appropriate combination.
次に数平均分子量2.000〜20.000の熱可塑性
ポリエステルの末端又は側鎖のうちの少なくとも一部に
下記(1)式で表される構造を有する化合物について説
明する。Next, a compound having a structure represented by the following formula (1) in at least a part of the terminal or side chain of a thermoplastic polyester having a number average molecular weight of 2.000 to 20.000 will be described.
(ただし、Rは水素または炭素数1〜5のアルキル基を
表す。)
この化合物は熱可塑性ポリエステルの末端あるいは側鎖
のカルボキシル基と下記−数式(2)で示されるグリシ
ジルアクリレート類との反応によって得られる。(However, R represents hydrogen or an alkyl group having 1 to 5 carbon atoms.) This compound is produced by the reaction between the terminal or side chain carboxyl group of the thermoplastic polyester and the glycidyl acrylate represented by the following formula (2). can get.
前記熱可塑性ポリエステルとは、テレフタル酸。The thermoplastic polyester is terephthalic acid.
イソフタル酸、フタル酸、ナフタレンジカルボン酸、こ
はく酸、グルタル酸、アジピン酸、ピメリン酸、スペリ
ン酸、アゼライン酸、セバシン酸。Isophthalic acid, phthalic acid, naphthalene dicarboxylic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, speric acid, azelaic acid, sebacic acid.
1.9−ノナンジカルボン酸、1.10−デカンジカル
ボン酸、1,2−ドデカンジカルボン酸、1.2−オク
タデカンジカルボン酸、アイコサンジカルボン酸、シク
ロヘクサンジカルボン酸、ヘキサヒドロフタル酸等のジ
カルボン酸成分、りんご酸、酒石酸、1.2−ヒドロキ
システアリン酸、パラオキシ安息香酸、ε−オキシカプ
ロン酸(ε−カプロラクトン)等のオキシ酸成分、エチ
レングリコール、ジエチレングリコール、トリエチレン
グリコール、1.2−プロパンジオール、■、3−プロ
パンジオール、1,3−ブタンジオール、1,4−ブタ
ンジオール、1,5−ベンタンジオール、1.6−ヘキ
サンジオール、l、9−ノナンジオール、1.10−デ
カンジオール、ネオペンチルグリコール、2.2.4−
トリメチルペンタン−■、3−ジオール等のグリコール
成分を適宜組み合わせて得られるものであり、その他に
上記成分に加えて、いわゆるゲル化物が生じない程度の
量のトリメリット酸、ピロメリット酸、トリメチロール
エタン、トリメチロールプロパン、グリセリン、ペンタ
ニルスリトール等の多価カルボン酸、多価アルコール成
分、また不飽和基を有するジカルボン酸やグリコール、
例えばマレイン酸、イタコン酸等を適宜組み合わせて得
られるものが挙げられる。中でも熱′可塑性ポリエステ
ルを構成するポリエステル成分のうち。Dicarboxylic acids such as 1.9-nonanedicarboxylic acid, 1.10-decanedicarboxylic acid, 1,2-dodecanedicarboxylic acid, 1.2-octadecanedicarboxylic acid, icosanedicarboxylic acid, cyclohexanedicarboxylic acid, hexahydrophthalic acid, etc. Ingredients: Oxyacid components such as malic acid, tartaric acid, 1,2-hydroxystearic acid, paraoxybenzoic acid, ε-oxycaproic acid (ε-caprolactone), ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propanediol , ■, 3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-bentanediol, 1,6-hexanediol, l,9-nonanediol, 1.10-decanediol, Neopentyl glycol, 2.2.4-
It is obtained by appropriately combining glycol components such as trimethylpentane-■ and 3-diol, and in addition to the above components, trimellitic acid, pyromellitic acid, and trimethylol in an amount that does not cause so-called gelled products. Polyhydric carboxylic acids and polyhydric alcohol components such as ethane, trimethylolpropane, glycerin, and pentanylthritol, as well as dicarboxylic acids and glycols with unsaturated groups,
For example, those obtained by appropriately combining maleic acid, itaconic acid, etc. can be mentioned. Among the polyester components that make up thermoplastic polyester.
酸成分としてテレフタル酸やイソフタル酸等の芳香族ジ
カルボン酸、メチレン基鎖の炭素数が2〜20の脂肪族
ジカルボン酸、トリメリット酸、トリメリット酸無水物
、ピロメリット酸、ピロメリット酸無水物等の多塩基酸
及びその無水物、アルコール成分としてメチレン基調の
炭素数が2〜20の脂肪族グリコール、あるいはオキシ
酸成分としてメチレン基調の炭素数が2〜20の脂肪族
オキシ酸(そのラクトン類を含む)とからなるものが好
ましく、特に、脂肪族オキシ酸またはそのラクトン類を
5〜70モル%、より好ましくは5〜35モル%共重合
成分として含むものは、ポリエステル成形品に対して良
好な密着性を示し、硬化後の可撓性も良好となる。なぜ
ならば、脂肪族オキシ酸またはそのラクトン類は、比較
的少量の共重合組成比で熱可型性共重合ポリエステルの
結晶性を失わせるからである。また、該ポリエステルは
本発明の光硬化型樹脂組成物を構成する他の成分である
1分子牛に少なくとも1つのアクリロイル基又はメタク
リロイル基を持つ反応性希釈剤に対する相溶性が良好で
ある。相溶性に関しては、トリメリット酸、ピロメリッ
ト酸等の多官能モノマーを共重合成分としたものは、1
分子当たりのアクリロイル基あるいはメタクリロイル基
の数が増えるはど相溶性は向上する。Acid components include aromatic dicarboxylic acids such as terephthalic acid and isophthalic acid, aliphatic dicarboxylic acids with a methylene group having 2 to 20 carbon atoms, trimellitic acid, trimellitic anhydride, pyromellitic acid, and pyromellitic anhydride. polybasic acids and their anhydrides, aliphatic glycols with a methylene base of 2 to 20 carbon atoms as an alcohol component, or aliphatic oxyacids with a methylene base of 2 to 20 carbons as an oxyacid component (their lactones) In particular, those containing 5 to 70 mol%, more preferably 5 to 35 mol%, of aliphatic oxyacids or their lactones as a copolymer component are good for polyester molded products. It exhibits good adhesion and good flexibility after curing. This is because aliphatic oxyacids or their lactones cause the thermoplastic copolyester to lose its crystallinity at a relatively small copolymerization composition ratio. Further, the polyester has good compatibility with a reactive diluent having at least one acryloyl group or methacryloyl group per molecule, which is another component constituting the photocurable resin composition of the present invention. Regarding compatibility, copolymerization components containing polyfunctional monomers such as trimellitic acid and pyromellitic acid have a
The compatibility increases as the number of acryloyl or methacryloyl groups per molecule increases.
さらに、ポリエステルを構成するアルコール成分中に、
ポリテトラメチレングリコールのような分子量的500
〜1.500程度のポリアルキレングリコールを共重合
させて、エラスチックなポリエステルの特性を出したり
、あるいはビスフェノールへのエチレンオキサイド付加
物、ビスフェノールSのエチレンオキサイド付加物等の
ように芳香族環を持ったグリコールを共重合させると、
耐熱性や密着性の良好な硬化組成物を得ることができる
。Furthermore, in the alcohol component that makes up polyester,
Molecular weight 500, such as polytetramethylene glycol
Copolymerizing polyalkylene glycols of about 1.500 to give elastic polyester properties, or creating products with aromatic rings such as ethylene oxide adducts to bisphenol and ethylene oxide adducts to bisphenol S. When glycol is copolymerized,
A cured composition with good heat resistance and adhesion can be obtained.
本発明の光硬化型樹脂組成物の硬化後の特性は。What are the properties of the photocurable resin composition of the present invention after curing?
熱可塑性共重合ポリエステルの特性によって大いに影響
され、前記のように熱可塑性共重合ポリエステルの共重
合組成を変えることにより、ある程度コントロールでき
るが、さらに、ガラス転移温度(Tg)が−40〜60
℃、好ましくは一20〜40℃のものを用いると可撓性
がより改善される。It is greatly influenced by the properties of the thermoplastic copolyester, and can be controlled to some extent by changing the copolymer composition of the thermoplastic copolyester as described above, but in addition, the glass transition temperature (Tg) is -40 to 60
C., preferably -20 to 40.degree. C., the flexibility is further improved.
また9本発明においては熱可塑性ポリエステルにおける
熱可塑性ポリエステル残基の数平均分子量は2.000
〜20.000.好ましくは3.000〜9.000で
あることを要件とする。熱可塑性ポリエステルを形成す
るエステル連鎖がある程度長く1本発明のように平均分
子量が2.000未満では強度、柔軟性等が発揮されず
、2,000より大きいとき、好ましくは3.000以
上になったとき1組成物の硬化後の特性を効果的にコン
トロールすることが可能になる。また、平均分子量が2
0.000より大きい場合は1組成物の粘度が高くなり
、取扱いが困難となるため、 20.[100以下、よ
り好ましくは9.000以下のものを用いるのが良い。9 In the present invention, the number average molecular weight of the thermoplastic polyester residue in the thermoplastic polyester is 2.000.
~20.000. The requirement is preferably 3.000 to 9.000. If the ester chain forming the thermoplastic polyester is long to some extent, as in the present invention, if the average molecular weight is less than 2.000, strength, flexibility, etc. will not be exhibited, and if it is greater than 2,000, preferably 3.000 or more. At this time, it becomes possible to effectively control the properties of a composition after curing. Also, the average molecular weight is 2
If it is larger than 0.000, the viscosity of the composition becomes high, making it difficult to handle. 20. [It is preferable to use one with a value of 100 or less, more preferably 9,000 or less.
以上のように熱可塑性ポリエステルを規制することによ
って、密着性や可撓性の良い光硬化型樹脂組成物を得る
ことができるが、さらに1本発明を構成する他のもう1
つの成分である1分子牛に少なくとも1つのアクリロイ
ル基、メタクリロイル基を有する反応性希釈剤の種類や
混合比に応じて決定することが好ましい。By regulating the thermoplastic polyester as described above, a photocurable resin composition with good adhesion and flexibility can be obtained.
It is preferable to decide according to the type and mixing ratio of the reactive diluent having at least one acryloyl group or methacryloyl group per molecule of the two components.
熱可塑性ポリエステルのカルボキシル基量や分子量を調
節する方法には1種々の方法があり、最も好ましいのは
、高分子量のポリエステルを製造しておき、所定量のジ
カルボン酸やトリカルボン酸で解重合して得る方法であ
る。この方法を採用するとカルボキシル基や分子量の調
節が容易である。There are various methods for adjusting the carboxyl group weight and molecular weight of thermoplastic polyester. The most preferable method is to produce a high molecular weight polyester and depolymerize it with a predetermined amount of dicarboxylic acid or tricarboxylic acid. This is the way to get it. When this method is adopted, carboxyl groups and molecular weight can be easily controlled.
グリシジルアクリレート類としてはグリシジルアクリレ
ート、グリシジルメタクリレート、グリシジルメタクリ
レート等が挙げられる。Examples of glycidyl acrylates include glycidyl acrylate, glycidyl methacrylate, and glycidyl methacrylate.
この反応はバルク状態で、または希釈剤あるいは有機溶
媒中で120℃以下、好ましくは110℃以下で行われ
る。120℃を超える温度ではアクリロイル基やメタク
リロイル基が付加重合してしまう恐れがある。また付加
重合を防ぐために少量のラジカル捕捉剤を用いてもよい
。また、場合によっては酸、塩基、アニオン交換樹脂、
第4級アンモニウム塩等を触媒として用いる。This reaction is carried out in bulk or in a diluent or organic solvent at a temperature below 120°C, preferably below 110°C. At temperatures exceeding 120°C, there is a risk that acryloyl groups and methacryloyl groups will undergo addition polymerization. A small amount of radical scavenger may also be used to prevent addition polymerization. In some cases, acids, bases, anion exchange resins,
A quaternary ammonium salt or the like is used as a catalyst.
なお、希釈剤としては、先に具体例を示したアクリロイ
ル基あるいはメタクリロイル基を有する低粘性の化合物
を用いることができ、有機溶剤としては、ポリエステル
を溶解し得るベンゼン、トルエン、キシレン、アセトン
、メチルエチルケトン、メチルイソブチルケトン、テト
ラヒドロフラン、ジオキサン、シクロヘキサノン、酢酸
エチル。Note that as the diluent, a low-viscosity compound having an acryloyl group or a methacryloyl group as shown in the example above can be used, and as an organic solvent, benzene, toluene, xylene, acetone, methyl ethyl ketone that can dissolve polyester can be used. , methyl isobutyl ketone, tetrahydrofuran, dioxane, cyclohexanone, ethyl acetate.
酢酸メチル、セロソルブ類、塩化メチレン、クロロホル
ム、トリクロロエタン、テトラクロロエタン等から選ば
れる1種または2種以上を用いることができる。One or more types selected from methyl acetate, cellosolves, methylene chloride, chloroform, trichloroethane, tetrachloroethane, etc. can be used.
本発明の光硬化型樹脂組成物は、1分子牛に少なくとも
1つのアクリロイル基又はメタクリロイル基を有する反
応性希釈剤5〜95重量部と、前記のようにして得た(
1)式で表される構造を有する化合物95〜5重量部、
より好ましくは90〜10重量部とからなるものであり
、(1)式で表される構造を有する化合物が5重量部未
満では接着性や硬化後の可撓性に優れたものが得られず
、95重量部を超えたものは光硬化が困難になる。The photocurable resin composition of the present invention is prepared by adding 5 to 95 parts by weight of a reactive diluent having at least one acryloyl group or methacryloyl group per molecule, and (
1) 95 to 5 parts by weight of a compound having a structure represented by the formula,
More preferably, it consists of 90 to 10 parts by weight, and if the amount of the compound having the structure represented by formula (1) is less than 5 parts by weight, a product with excellent adhesiveness and flexibility after curing cannot be obtained. If the amount exceeds 95 parts by weight, photocuring becomes difficult.
また1本発明では、 (1)式で表される構造を有する
化合物の混合量によって、光硬化型樹脂組成物の粘度を
広範囲に変えることが可能となり。In addition, in the present invention, the viscosity of the photocurable resin composition can be varied over a wide range depending on the amount of the compound having the structure represented by formula (1) mixed.
目的と用途により、適切なものを実用に供することがで
きる。Depending on the purpose and use, an appropriate one can be put to practical use.
本発明の光硬化型樹脂組成物は、そのままで熱。The photocurable resin composition of the present invention can be heated as it is.
光、電子線、触媒等によって容易に重合硬化する。Easily polymerized and cured by light, electron beams, catalysts, etc.
また、前述した有機溶剤や反応性の希釈剤と混合して用
いることもできる。It can also be used in combination with the organic solvent or reactive diluent mentioned above.
本発明においては光重合開始剤を用いると光重合が容易
となり、光重合開始剤としては、前記光硬化型樹脂組成
物を光重合開始することが可能なものであればどのよう
なものでも用いることができ1組成割合および光源等に
応じて適宜選定される。このような光開始剤としては1
例えば、アセトフェノン類、ベンゾフェノン、ミヒラー
ケトン。In the present invention, the use of a photopolymerization initiator facilitates photopolymerization, and any photopolymerization initiator can be used as long as it can initiate photopolymerization of the photocurable resin composition. It can be appropriately selected depending on the composition ratio, light source, etc. Such photoinitiators include 1
For example, acetophenones, benzophenone, Michler's ketone.
ベンジルおよびその誘導体、ベンゾインおよびそのアル
キルエーテル類、キサントンおよびその誘導体、チオキ
サントンおよびその誘導体、ジスフィト化合物、アゾ化
合物等が挙げられる。Examples include benzyl and its derivatives, benzoin and its alkyl ethers, xanthone and its derivatives, thioxanthone and its derivatives, disphite compounds, azo compounds, and the like.
このとき、照射される光の波長は1通常180〜700
nmのものが用いられる。とりわけ、紫外線の照射は効
果的である。その他に、He−N’eレーザー、Arレ
ーザーおよび各種電子線、各種X線等の放射線等も使用
可能であり、熱や触媒によっても硬化させることができ
る。At this time, the wavelength of the irradiated light is usually 180 to 700.
nm is used. Irradiation with ultraviolet light is particularly effective. In addition, radiation such as a He-N'e laser, an Ar laser, various electron beams, and various X-rays can also be used, and curing can also be performed with heat or a catalyst.
その際、増感剤の使用は極めて有効であり、前配光重合
開始剤によって引き起こされる光重合速度を促進させる
ことによって2本発明の実用性を高めるものである。こ
のような増感剤としては。In this case, the use of a sensitizer is extremely effective and enhances the practicality of the present invention by accelerating the photopolymerization rate caused by the pre-distributive polymerization initiator. As such a sensitizer.
例えば9次のようなものが用いられる。すなわち。For example, the 9th order is used. Namely.
アミン類としては、脂肪族アミン、芳香族アミン。Amines include aliphatic amines and aromatic amines.
窒素複素環化合物、尿素類としては、アリル系尿素、〇
−トリルチオ尿素等、イオウ化合物としては、ナトリウ
ムジエチルジチオホスフェート、芳香族スルフィン酸の
可溶性塩、ニトリル類としては、N、N−ジ置換−p−
アミノベンゾニトリル系化合物、リン化合物としては、
)IJ−n−ブチルホスフィン等、その他の窒素化合物
としては。Examples of nitrogen heterocyclic compounds and ureas include allyl urea and 〇-tolylthiourea; examples of sulfur compounds include sodium diethyldithiophosphate and soluble salts of aromatic sulfinic acids; examples of nitriles include N,N-disubstituted- p-
As aminobenzonitrile compounds and phosphorus compounds,
) IJ-n-butylphosphine and other nitrogen compounds.
N−ニトロソヒドロキシルアミン誘導体、オキサゾリン
化合均等、塩素化合物としては、四塩化炭素、ヘキサク
ロロエタン等が用いられる。As the N-nitrosohydroxylamine derivative, oxazoline compound, and chlorine compound, carbon tetrachloride, hexachloroethane, etc. are used.
上記、光重合開始剤および増感剤は1本発明の光硬化型
樹脂組成物100重量部に対して、それぞれ0〜lO重
合部および0〜15重量部、より好ましくは、それぞれ
0.5〜2重量部およびO〜5重量部配合される。これ
らは、具体例を示したもの等の中から1種以上適宜組み
合わせて使用することができる。The above-mentioned photopolymerization initiator and sensitizer are each 0 to 10 polymerized parts and 0 to 15 parts by weight, more preferably 0.5 to 15 parts by weight, respectively, per 100 parts by weight of the photocurable resin composition of the present invention. 2 parts by weight and O to 5 parts by weight are blended. One or more of these can be used in appropriate combinations from among those shown in specific examples.
さらに1本発明にかかわる光硬化型樹脂組成物中には、
上記威勢に加えて、必要に応じ9着色剤。Furthermore, in the photocurable resin composition according to the present invention,
In addition to the above ingredients, add 9 coloring agents if necessary.
無機質充填剤等の添加剤を配合することが可能である。It is possible to incorporate additives such as inorganic fillers.
本発明の光硬化型樹脂組成物はそのままで、あるいは溶
剤や希釈剤に溶解し、各種添加剤を加えてインキ、塗料
、接着剤1表面コート材、製版材。The photocurable resin composition of the present invention can be used as it is, or by dissolving it in a solvent or diluent and adding various additives to form inks, paints, adhesives, surface coating materials, and plate-making materials.
封止剤、電機絶縁材等として各種の分野において。Used in various fields as sealants, electrical insulation materials, etc.
有効に使用することができ、その工業的価値は大である
。It can be used effectively and has great industrial value.
(実施例)
以下1本発明を実施例によって具体的に説明する。なお
、「%」または「部」とあるのは、いずれも重量基準で
あり、「モル」とあるのは、仕込み時のモル比を示す。(Example) The present invention will be specifically explained below by referring to an example. Note that "%" and "part" are based on weight, and "mole" indicates the molar ratio at the time of preparation.
実施例1 (1) 第1表に示す原料をエステル反応管にとり。Example 1 (1) Place the raw materials listed in Table 1 into an ester reaction tube.
常圧下でN、ガスを通じつつ、250℃で縮合水を流出
しつつ2時間エステル化を行い、さらに、0.5トル下
で1〜2時間重縮合を行い高分子量の熱可塑性ポリエス
テルA、B、Cを得た。Esterification was carried out at 250° C. for 2 hours while passing N and gas under normal pressure and flowing out the condensed water, and then polycondensation was carried out for 1 to 2 hours under 0.5 torr to obtain high molecular weight thermoplastic polyesters A and B. , C was obtained.
第1表
〔単位:モル〕
得られた熱可塑性ポリエステルを、第2表に示す量の脂
肪族ジカルボン酸で250℃、1時間解重合を行い、ポ
リエステルA−1,B−1〜5. C−1を得た。なお
、数平均分子量は、末端基滴定法により求めた。また1
表中n値は前記(1)式で表される構造の個数で近似値
である。Table 1 [Unit: moles] The obtained thermoplastic polyesters were depolymerized with aliphatic dicarboxylic acids in the amounts shown in Table 2 at 250°C for 1 hour to form polyesters A-1, B-1 to 5. C-1 was obtained. The number average molecular weight was determined by end group titration. Also 1
In the table, the n value is the number of structures expressed by the above formula (1) and is an approximate value.
第2表
(2)ポリエステルA−1,B−1〜5.C−1のそれ
ぞれ100部をトルエン100部に溶解し、グリシジル
メタクリレートと100℃で、酸価0.5mgK○H/
g以下になるまで反応させた。熱重合禁止剤としてメト
キノン0.003部、触媒としてトリメチルベンジルア
ンモニウムクロライド0.2部を加えた。反応終了後、
トルエンを留去し、減圧乾燥した。Table 2 (2) Polyester A-1, B-1 to 5. 100 parts of each of C-1 were dissolved in 100 parts of toluene, and mixed with glycidyl methacrylate at 100°C to give an acid value of 0.5 mg K○H/
The reaction was allowed to take place until the amount decreased to below g. 0.003 part of methoquinone was added as a thermal polymerization inhibitor, and 0.2 part of trimethylbenzylammonium chloride was added as a catalyst. After the reaction is complete,
Toluene was distilled off and the residue was dried under reduced pressure.
(3)前記(2)で得た生成物を、ECH変性フェノキ
シアクリレートに対し、10%、20%、30%の割合
で混合し、光硬化型樹脂組成物を得た。得られた光硬化
型樹脂組成物100部に対して、ベンゾインイソプロピ
ルエーテル1部、メタクリル酸ジエチルアミノエチル2
部を加えたものを1表面未処理のPETフィルムの間に
挟み、メタルハライドランプを2000mJ/cdで照
射し、硬化させてPETフィルムを接着し、T剥離強度
によりPETに対する密着性を測定した。その結果を第
3表に示す。(3) The product obtained in (2) above was mixed with ECH-modified phenoxy acrylate at a ratio of 10%, 20%, and 30% to obtain a photocurable resin composition. 1 part of benzoin isopropyl ether and 2 parts of diethylaminoethyl methacrylate per 100 parts of the obtained photocurable resin composition.
The resulting film was sandwiched between PET films with one surface untreated, and irradiated with a metal halide lamp at 2000 mJ/cd to cure and adhere the PET films.The adhesion to PET was measured by T-peel strength. The results are shown in Table 3.
実施例2
実施例1で得たポリエステルA−1,B−1〜5、C−
1を、それぞれIO%、20%、30%ずつECH変性
フェノキシアクリレートに混合し、グリシジルメタクリ
レートと100℃で酸価0.5mgKOH/g以下にな
るまで反応させた。熱重合禁止剤としてメトキノン0.
003部、触媒としてトリメチルベンジルアンモニウム
クロライド0.2部を加えた。Example 2 Polyester A-1, B-1 to B-5, C- obtained in Example 1
1 was mixed with ECH-modified phenoxy acrylate in IO%, 20%, and 30%, respectively, and reacted with glycidyl methacrylate at 100°C until the acid value became 0.5 mgKOH/g or less. Methoquinone 0.0% as a thermal polymerization inhibitor.
0.003 parts and 0.2 parts of trimethylbenzylammonium chloride as a catalyst were added.
反応終了後、得られた光硬化型樹脂組成物に対して、実
施例1と同様にしてPETに対する密着性を測定した。After the reaction was completed, the resulting photocurable resin composition was measured for adhesion to PET in the same manner as in Example 1.
その結果を第4表に示す。The results are shown in Table 4.
実施例3
実施例2で密着性テストに用いた樹脂A−1゜8−2〜
5.C−1に関して樹脂量100部に対してB Y K
−300(B Y K Chemika1社製)1部
を加え。Example 3 Resin A-1゜8-2~ used for adhesion test in Example 2
5. B Y K per 100 parts of resin for C-1
Add 1 part of -300 (manufactured by B Y K Chemika 1).
PETフィルムに約100μmの厚さでコーティングし
、メタルハライドランプを2000m J / ctl
で照射して硬化させ、 180 ”曲げにより可撓性を
テストした。第5表に結果を示す。Coating a PET film with a thickness of about 100 μm and a metal halide lamp at 2000 m J/ctl
The samples were cured by irradiation and tested for flexibility by 180" bending. Table 5 shows the results.
比較例1
第1表のBのポリマーをA D A 15モル%で解重
合し、 B−6(数平均分子量1100)とした。B−
6を実施例1,2.3と同様に反応及び処理してPET
の密着性を測定した。結果を第3表、第4表、第5表に
比較例として示す。Comparative Example 1 Polymer B in Table 1 was depolymerized with 15 mol % of ADA to obtain B-6 (number average molecular weight: 1100). B-
6 was reacted and treated in the same manner as in Examples 1 and 2.3 to obtain PET.
The adhesion was measured. The results are shown in Tables 3, 4, and 5 as comparative examples.
接着していない) 第4表 〔単位: kg / 25mm ] ※ Aは界面剥離。not glued) Table 4 [Unit: kg/25mm] * A is interfacial peeling.
■は慣性剥離
第5表
(発明の効果)
本発明の光硬化型樹脂組成物は、ポリエステル成形品に
対して優れた接着性を有し、硬化後も可撓性を示すので
剥離、ひび割れ等が生ずることはない。したがって塗料
6インク、接着剤、およびコーティング剤として広範囲
に利用できる。なお当然のことながら本発明の光硬化型
樹脂組成物は。(2) indicates inertial peeling in Table 5 (effects of the invention) The photocurable resin composition of the present invention has excellent adhesion to polyester molded products and remains flexible even after curing, resulting in peeling, cracking, etc. will not occur. Therefore, it can be widely used as paint 6 ink, adhesive, and coating agent. Note that, as a matter of course, the photocurable resin composition of the present invention.
ポリエステル成形品以外のもの1例えば、金属等にも適
用でき、金属板等に本発明の光硬化型樹脂組成物をコー
トしておき。Items other than polyester molded products 1 For example, it can be applied to metals, etc., and the photocurable resin composition of the present invention is coated on metal plates and the like.
後に成形加工するプレ コートメタル用途としても適用できる。Pre-forming process It can also be used as coated metal.
Claims (1)
メタクリロイル基を有する反応性希釈剤5〜95重量部
と、数平均分子量2,000〜20,000の熱可塑性
ポリエステルの末端又は側鎖のうちの少なくとも一部に
下記(1)式で表される構造を有する化合物95〜5重
量部とからなることを特徴とする光硬化型樹脂組成物。 ▲数式、化学式、表等があります▼(1) (ただし、Rは水素または炭素数1〜5のアルキル基を
表す。)(1) 5 to 95 parts by weight of a reactive diluent having at least one acryloyl group or methacryloyl group per molecule and the terminal or side chain of a thermoplastic polyester having a number average molecular weight of 2,000 to 20,000. A photocurable resin composition comprising, at least in part, 95 to 5 parts by weight of a compound having a structure represented by the following formula (1). ▲There are mathematical formulas, chemical formulas, tables, etc.▼(1) (However, R represents hydrogen or an alkyl group having 1 to 5 carbon atoms.)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1218085A JP2842899B2 (en) | 1989-08-23 | 1989-08-23 | Photocurable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1218085A JP2842899B2 (en) | 1989-08-23 | 1989-08-23 | Photocurable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0380252A true JPH0380252A (en) | 1991-04-05 |
JP2842899B2 JP2842899B2 (en) | 1999-01-06 |
Family
ID=16714405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1218085A Expired - Lifetime JP2842899B2 (en) | 1989-08-23 | 1989-08-23 | Photocurable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2842899B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420504B1 (en) * | 2001-08-18 | 2004-03-09 | 김명순 | The correction apparatus of the big toe and the production method thereof |
JP2011075865A (en) * | 2009-09-30 | 2011-04-14 | Taiyo Holdings Co Ltd | Photosetting resin composition, dry film and hardened material of the same, and printed wiring board using the same |
JP2016121265A (en) * | 2014-12-25 | 2016-07-07 | 東洋インキScホールディングス株式会社 | Active energy ray polymerizable resin composition and laminate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5038521A (en) * | 1973-08-07 | 1975-04-10 | ||
JPS531284A (en) * | 1977-05-30 | 1978-01-09 | Nok Corp | Photosensitive compositions |
JPS5453187A (en) * | 1977-10-06 | 1979-04-26 | Teijin Ltd | Photo-setting resin composition |
JPS5458790A (en) * | 1977-10-20 | 1979-05-11 | Teijin Ltd | Photo-sensitive resin composition |
-
1989
- 1989-08-23 JP JP1218085A patent/JP2842899B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5038521A (en) * | 1973-08-07 | 1975-04-10 | ||
JPS531284A (en) * | 1977-05-30 | 1978-01-09 | Nok Corp | Photosensitive compositions |
JPS5453187A (en) * | 1977-10-06 | 1979-04-26 | Teijin Ltd | Photo-setting resin composition |
JPS5458790A (en) * | 1977-10-20 | 1979-05-11 | Teijin Ltd | Photo-sensitive resin composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100420504B1 (en) * | 2001-08-18 | 2004-03-09 | 김명순 | The correction apparatus of the big toe and the production method thereof |
JP2011075865A (en) * | 2009-09-30 | 2011-04-14 | Taiyo Holdings Co Ltd | Photosetting resin composition, dry film and hardened material of the same, and printed wiring board using the same |
JP2016121265A (en) * | 2014-12-25 | 2016-07-07 | 東洋インキScホールディングス株式会社 | Active energy ray polymerizable resin composition and laminate |
Also Published As
Publication number | Publication date |
---|---|
JP2842899B2 (en) | 1999-01-06 |
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