JPH0379474U - - Google Patents
Info
- Publication number
- JPH0379474U JPH0379474U JP13942989U JP13942989U JPH0379474U JP H0379474 U JPH0379474 U JP H0379474U JP 13942989 U JP13942989 U JP 13942989U JP 13942989 U JP13942989 U JP 13942989U JP H0379474 U JPH0379474 U JP H0379474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- component
- printed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims 1
- 238000005187 foaming Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13942989U JPH0379474U (it) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13942989U JPH0379474U (it) | 1989-11-30 | 1989-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0379474U true JPH0379474U (it) | 1991-08-13 |
Family
ID=31686476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13942989U Pending JPH0379474U (it) | 1989-11-30 | 1989-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0379474U (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011009534A (ja) * | 2009-06-26 | 2011-01-13 | Nec Corp | ピン挿入部品の実装構造 |
-
1989
- 1989-11-30 JP JP13942989U patent/JPH0379474U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011009534A (ja) * | 2009-06-26 | 2011-01-13 | Nec Corp | ピン挿入部品の実装構造 |