JPH0379440U - - Google Patents
Info
- Publication number
- JPH0379440U JPH0379440U JP13999889U JP13999889U JPH0379440U JP H0379440 U JPH0379440 U JP H0379440U JP 13999889 U JP13999889 U JP 13999889U JP 13999889 U JP13999889 U JP 13999889U JP H0379440 U JPH0379440 U JP H0379440U
- Authority
- JP
- Japan
- Prior art keywords
- code
- circuit board
- electronic parts
- conductive foil
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13999889U JPH0379440U (sv) | 1989-12-01 | 1989-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13999889U JPH0379440U (sv) | 1989-12-01 | 1989-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379440U true JPH0379440U (sv) | 1991-08-13 |
Family
ID=31687008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13999889U Pending JPH0379440U (sv) | 1989-12-01 | 1989-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379440U (sv) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253291A (ja) * | 1984-05-29 | 1985-12-13 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
| JPS6134990A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
| JPS61172393A (ja) * | 1985-01-26 | 1986-08-04 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
-
1989
- 1989-12-01 JP JP13999889U patent/JPH0379440U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60253291A (ja) * | 1984-05-29 | 1985-12-13 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
| JPS6134990A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
| JPS61172393A (ja) * | 1985-01-26 | 1986-08-04 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |