JPH0379430U - - Google Patents
Info
- Publication number
- JPH0379430U JPH0379430U JP14150989U JP14150989U JPH0379430U JP H0379430 U JPH0379430 U JP H0379430U JP 14150989 U JP14150989 U JP 14150989U JP 14150989 U JP14150989 U JP 14150989U JP H0379430 U JPH0379430 U JP H0379430U
- Authority
- JP
- Japan
- Prior art keywords
- piston
- detection means
- syringe
- semiconductor chip
- adhesive coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims 2
- 230000005389 magnetism Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14150989U JPH0379430U (US20030199744A1-20031023-C00003.png) | 1989-12-06 | 1989-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14150989U JPH0379430U (US20030199744A1-20031023-C00003.png) | 1989-12-06 | 1989-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379430U true JPH0379430U (US20030199744A1-20031023-C00003.png) | 1991-08-13 |
Family
ID=31688397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14150989U Pending JPH0379430U (US20030199744A1-20031023-C00003.png) | 1989-12-06 | 1989-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379430U (US20030199744A1-20031023-C00003.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362572A (ja) * | 1986-09-03 | 1988-03-18 | Toshiba Chem Corp | ダイボンデイングペ−ストの吐出装置 |
| JPH01187442A (ja) * | 1988-01-22 | 1989-07-26 | Nec Yamagata Ltd | 半導体装置の製造装置 |
-
1989
- 1989-12-06 JP JP14150989U patent/JPH0379430U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362572A (ja) * | 1986-09-03 | 1988-03-18 | Toshiba Chem Corp | ダイボンデイングペ−ストの吐出装置 |
| JPH01187442A (ja) * | 1988-01-22 | 1989-07-26 | Nec Yamagata Ltd | 半導体装置の製造装置 |
