JPH0379429U - - Google Patents

Info

Publication number
JPH0379429U
JPH0379429U JP14129389U JP14129389U JPH0379429U JP H0379429 U JPH0379429 U JP H0379429U JP 14129389 U JP14129389 U JP 14129389U JP 14129389 U JP14129389 U JP 14129389U JP H0379429 U JPH0379429 U JP H0379429U
Authority
JP
Japan
Prior art keywords
syringe
dispenser
distal end
stepped portion
inner diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14129389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14129389U priority Critical patent/JPH0379429U/ja
Publication of JPH0379429U publication Critical patent/JPH0379429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ及びｂは、本考案一実施例によるデイ
スペンサの分解断面図及び実使用状態を示す断面
図、第２図ａ及びｂは、従来のＡｇペースト塗布
方式を示した概略図、第３図ａ及びｂは、従来例
によるデイスペンサの分解断面図及び実使用状態
を示す断面図である。 １……デイスペンサ、２……シリンジ、３……
シリンジ針、７……内通孔、Ｂ……段差部、Ｃ…
…シリンジの先端部端面。

Claims (1)

  1. 【実用新案登録請求の範囲】 シリンジと該シリンジに結合されるシリンジ針
    とからなるデイスペンサにおいて、 上記シリンジの先端部は、上記シリンジ針の内
    通孔に挿入され、 該シリンジ針の内通孔には上記シリンジの先端
    部端面が当接する段差部を設け、 且つ、上記段差部における内径を上記シリンジ
    の先端部の内径よりも小さくしたことを特徴とす
    るデイスペンサ。
JP14129389U 1989-12-05 1989-12-05 Pending JPH0379429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14129389U JPH0379429U (ja) 1989-12-05 1989-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14129389U JPH0379429U (ja) 1989-12-05 1989-12-05

Publications (1)

Publication Number Publication Date
JPH0379429U true JPH0379429U (ja) 1991-08-13

Family

ID=31688202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14129389U Pending JPH0379429U (ja) 1989-12-05 1989-12-05

Country Status (1)

Country Link
JP (1) JPH0379429U (ja)

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