JPH0377672U - - Google Patents
Info
- Publication number
- JPH0377672U JPH0377672U JP13961289U JP13961289U JPH0377672U JP H0377672 U JPH0377672 U JP H0377672U JP 13961289 U JP13961289 U JP 13961289U JP 13961289 U JP13961289 U JP 13961289U JP H0377672 U JPH0377672 U JP H0377672U
- Authority
- JP
- Japan
- Prior art keywords
- bump
- board
- wiring pattern
- hole
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961289U JPH0377672U (US06277897-20010821-C00009.png) | 1989-12-01 | 1989-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961289U JPH0377672U (US06277897-20010821-C00009.png) | 1989-12-01 | 1989-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377672U true JPH0377672U (US06277897-20010821-C00009.png) | 1991-08-05 |
Family
ID=31686646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13961289U Pending JPH0377672U (US06277897-20010821-C00009.png) | 1989-12-01 | 1989-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377672U (US06277897-20010821-C00009.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101908439B1 (ko) * | 2017-04-20 | 2018-10-16 | 바다중공업 주식회사 | 고속단정용 대빗의 흔들림 방지장치 |
-
1989
- 1989-12-01 JP JP13961289U patent/JPH0377672U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101908439B1 (ko) * | 2017-04-20 | 2018-10-16 | 바다중공업 주식회사 | 고속단정용 대빗의 흔들림 방지장치 |
