JPH0377445U - - Google Patents
Info
- Publication number
- JPH0377445U JPH0377445U JP13908789U JP13908789U JPH0377445U JP H0377445 U JPH0377445 U JP H0377445U JP 13908789 U JP13908789 U JP 13908789U JP 13908789 U JP13908789 U JP 13908789U JP H0377445 U JPH0377445 U JP H0377445U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- elasticity
- circuit board
- printed circuit
- end side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13908789U JPH0377445U (is) | 1989-11-29 | 1989-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13908789U JPH0377445U (is) | 1989-11-29 | 1989-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377445U true JPH0377445U (is) | 1991-08-05 |
Family
ID=31686148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13908789U Pending JPH0377445U (is) | 1989-11-29 | 1989-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377445U (is) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006144524A (ja) * | 2004-11-19 | 2006-06-08 | Toyoyuki Murase | 尿排出器具 |
| JP4427604B1 (ja) * | 2008-11-18 | 2010-03-10 | 庄次 島田 | 排便介護器具 |
-
1989
- 1989-11-29 JP JP13908789U patent/JPH0377445U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006144524A (ja) * | 2004-11-19 | 2006-06-08 | Toyoyuki Murase | 尿排出器具 |
| JP4427604B1 (ja) * | 2008-11-18 | 2010-03-10 | 庄次 島田 | 排便介護器具 |
| JP2010148852A (ja) * | 2008-11-18 | 2010-07-08 | Shoji Shimada | 排便介護器具 |