JPH0377442U - - Google Patents
Info
- Publication number
- JPH0377442U JPH0377442U JP13898389U JP13898389U JPH0377442U JP H0377442 U JPH0377442 U JP H0377442U JP 13898389 U JP13898389 U JP 13898389U JP 13898389 U JP13898389 U JP 13898389U JP H0377442 U JPH0377442 U JP H0377442U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead frame
- supply device
- tape
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 3
- 230000032258 transport Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898389U JPH0377442U (ar) | 1989-11-30 | 1989-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898389U JPH0377442U (ar) | 1989-11-30 | 1989-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377442U true JPH0377442U (ar) | 1991-08-05 |
Family
ID=31686056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13898389U Pending JPH0377442U (ar) | 1989-11-30 | 1989-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377442U (ar) |
-
1989
- 1989-11-30 JP JP13898389U patent/JPH0377442U/ja active Pending
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