JPH0377327U - - Google Patents

Info

Publication number
JPH0377327U
JPH0377327U JP13902289U JP13902289U JPH0377327U JP H0377327 U JPH0377327 U JP H0377327U JP 13902289 U JP13902289 U JP 13902289U JP 13902289 U JP13902289 U JP 13902289U JP H0377327 U JPH0377327 U JP H0377327U
Authority
JP
Japan
Prior art keywords
cable
coating layer
preventing condensation
water
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13902289U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13902289U priority Critical patent/JPH0377327U/ja
Publication of JPH0377327U publication Critical patent/JPH0377327U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Conductors (AREA)
JP13902289U 1989-11-30 1989-11-30 Pending JPH0377327U (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13902289U JPH0377327U (sv) 1989-11-30 1989-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13902289U JPH0377327U (sv) 1989-11-30 1989-11-30

Publications (1)

Publication Number Publication Date
JPH0377327U true JPH0377327U (sv) 1991-08-02

Family

ID=31686092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13902289U Pending JPH0377327U (sv) 1989-11-30 1989-11-30

Country Status (1)

Country Link
JP (1) JPH0377327U (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959756B2 (en) 2000-09-25 2015-02-24 Ibiden Co., Ltd. Method of manufacturing a printed circuit board having an embedded electronic component
US9245838B2 (en) 2000-09-25 2016-01-26 Ibiden Co., Ltd. Semiconductor element

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