JPH0375750A - Photopolymerizable composition - Google Patents
Photopolymerizable compositionInfo
- Publication number
- JPH0375750A JPH0375750A JP1212699A JP21269989A JPH0375750A JP H0375750 A JPH0375750 A JP H0375750A JP 1212699 A JP1212699 A JP 1212699A JP 21269989 A JP21269989 A JP 21269989A JP H0375750 A JPH0375750 A JP H0375750A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- group
- microgel
- compound
- photopolymerizable composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- 239000002253 acid Substances 0.000 claims abstract description 19
- 125000000524 functional group Chemical group 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 abstract description 33
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 229920000642 polymer Polymers 0.000 abstract description 6
- 238000006116 polymerization reaction Methods 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 abstract description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 150000001408 amides Chemical class 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- 238000000034 method Methods 0.000 description 17
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 11
- -1 2-(5-hydroxypentanoyloxy)ethyl methacrylate Chemical compound 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 238000007743 anodising Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000007720 emulsion polymerization reaction Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- 150000003440 styrenes Chemical class 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012674 dispersion polymerization Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 239000005457 ice water Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- RSZXXBTXZJGELH-UHFFFAOYSA-N 2,3,4-tri(propan-2-yl)naphthalene-1-sulfonic acid Chemical compound C1=CC=CC2=C(C(C)C)C(C(C)C)=C(C(C)C)C(S(O)(=O)=O)=C21 RSZXXBTXZJGELH-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- LOLKAJARZKDJTD-UHFFFAOYSA-N 4-Ethoxy-4-oxobutanoic acid Chemical compound CCOC(=O)CCC(O)=O LOLKAJARZKDJTD-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 2
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000008262 pumice Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical group CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- HSOOIVBINKDISP-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CCC)OC(=O)C(C)=C HSOOIVBINKDISP-UHFFFAOYSA-N 0.000 description 1
- QHIGBUQIFLDZPZ-UHFFFAOYSA-N 1-[(4e)-4-diazo-2-methoxycyclohexa-1,5-dien-1-yl]pyrrolidine Chemical compound C1=CC(=[N+]=[N-])CC(OC)=C1N1CCCC1 QHIGBUQIFLDZPZ-UHFFFAOYSA-N 0.000 description 1
- FHDQFPCQZMLBFE-UHFFFAOYSA-N 1-[(4e)-4-diazo-2-methylcyclohexa-1,5-dien-1-yl]pyrrolidine Chemical compound C1=CC(=[N+]=[N-])CC(C)=C1N1CCCC1 FHDQFPCQZMLBFE-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- QWQNFXDYOCUEER-UHFFFAOYSA-N 2,3-ditert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1C(C)(C)C QWQNFXDYOCUEER-UHFFFAOYSA-N 0.000 description 1
- IRLYGRLEBKCYPY-UHFFFAOYSA-N 2,5-dimethylbenzenesulfonic acid Chemical compound CC1=CC=C(C)C(S(O)(=O)=O)=C1 IRLYGRLEBKCYPY-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- IBDVWXAVKPRHCU-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCCOC(=O)C(C)=C IBDVWXAVKPRHCU-UHFFFAOYSA-N 0.000 description 1
- NNZJWOOLGPPUKX-UHFFFAOYSA-N 2-(2-phenylethenyl)-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound O1C(C(Cl)(Cl)Cl)=NN=C1C=CC1=CC=CC=C1 NNZJWOOLGPPUKX-UHFFFAOYSA-N 0.000 description 1
- ISMOJWRJYOWCQW-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=C(OC)C(OC)=CC=C1C1=NN=C(C(Cl)(Cl)Cl)O1 ISMOJWRJYOWCQW-UHFFFAOYSA-N 0.000 description 1
- ICTNASDKKZRWNT-UHFFFAOYSA-N 2-(4-methoxyphenyl)-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=CC(OC)=CC=C1C1=NN=C(C(Cl)(Cl)Cl)O1 ICTNASDKKZRWNT-UHFFFAOYSA-N 0.000 description 1
- CSPDHHJVLJAZLR-UHFFFAOYSA-N 2-(dichloromethyl)-1,3,4-oxadiazole Chemical compound ClC(Cl)C1=NN=CO1 CSPDHHJVLJAZLR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- JIKJXWFVPDDJNU-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=CC(OC)=CC=C1C=CC1=NN=C(C(Cl)(Cl)Cl)O1 JIKJXWFVPDDJNU-UHFFFAOYSA-N 0.000 description 1
- VFIOULNONUXFER-UHFFFAOYSA-N 2-[4-(2-phenylethenyl)phenyl]-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound O1C(C(Cl)(Cl)Cl)=NN=C1C(C=C1)=CC=C1C=CC1=CC=CC=C1 VFIOULNONUXFER-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
- GPOGMJLHWQHEGF-UHFFFAOYSA-N 2-chloroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCl GPOGMJLHWQHEGF-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XCSZUHHAYFILGO-UHFFFAOYSA-N 2-methyl-4-nitrobenzenesulfonic acid Chemical compound CC1=CC([N+]([O-])=O)=CC=C1S(O)(=O)=O XCSZUHHAYFILGO-UHFFFAOYSA-N 0.000 description 1
- NQRAOOGLFRBSHM-UHFFFAOYSA-N 2-methyl-n-(4-sulfamoylphenyl)prop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(S(N)(=O)=O)C=C1 NQRAOOGLFRBSHM-UHFFFAOYSA-N 0.000 description 1
- TURITJIWSQEMDB-UHFFFAOYSA-N 2-methyl-n-[(2-methylprop-2-enoylamino)methyl]prop-2-enamide Chemical compound CC(=C)C(=O)NCNC(=O)C(C)=C TURITJIWSQEMDB-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- ZJUAJDHQUFXWLV-UHFFFAOYSA-N 2-phenyl-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound O1C(C(Cl)(Cl)Cl)=NN=C1C1=CC=CC=C1 ZJUAJDHQUFXWLV-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、平版印刷版や、IC回路、フォトマスク等の
製造に好適に使用される感光性組成物に関し、特に露光
時の感度が向上した新規な光重合性組成物に関する。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a photosensitive composition suitably used for manufacturing lithographic printing plates, IC circuits, photomasks, etc. The present invention relates to a novel photopolymerizable composition.
〔従来の技術及びその解決すべき課題〕光重合性組成物
を感光性平版印刷版等の感光性画像形成層として用いる
試みは多く、特公昭46−32714号公報に開示され
ているように、バインダーとしてのポリマー、七ノマー
及び光重合開始剤から威る基本組成、特公昭49−34
041号公報に開示されているように、バインダーとし
てのポリマーに不飽和二重結合を導入し、硬化効率を改
善した組成、特公昭4B−38403号、特公昭53−
27605号及び英国特許第1388492号明細書等
に開示されているように、新規な光重合開始剤を用いた
組成等が知られており、一部で実用に供されているが、
いずれの感光性Mll動物十分な感度は得られておらず
、短い露光時間では十分な画像が得られないという問題
があった。[Prior art and problems to be solved] There have been many attempts to use photopolymerizable compositions as photosensitive image forming layers of photosensitive lithographic printing plates, etc., as disclosed in Japanese Patent Publication No. 46-32714, Basic composition consisting of a polymer as a binder, a heptanomer, and a photopolymerization initiator, Japanese Patent Publication No. 49-34
As disclosed in Japanese Patent Publication No. 041, compositions in which unsaturated double bonds are introduced into a polymer as a binder to improve curing efficiency, Japanese Patent Publication No. 4B-38403, Japanese Patent Publication No. 53-
As disclosed in No. 27605 and British Patent No. 1388492, compositions using novel photopolymerization initiators are known, and some of them are in practical use.
Sufficient sensitivity was not obtained for any of the photosensitive Mll animals, and there was a problem in that sufficient images could not be obtained with short exposure times.
従って、本発明の目的は、短い露光時間でも十分な画像
形成のできる高感度なネガ型光重合性組成物を提供する
ことにある。Therefore, an object of the present invention is to provide a highly sensitive negative photopolymerizable composition that can form sufficient images even with short exposure times.
/本発明者らは上記目的を達成すべく鋭意検討した結果
、新規な感光性組成物を使用することにより、上記目的
が容易に達成されることを見い出し、本発明に到達した
。As a result of intensive studies to achieve the above object, the present inventors have found that the above object can be easily achieved by using a novel photosensitive composition, and have thus arrived at the present invention.
即ち、本発明は、下記一般式(I)で示される官能基及
びpKa値が14以下の酸基を有するミクロゲルと、光
重合開始剤とを含むことを特徴とする光重合性m酸物に
関する。That is, the present invention relates to a photopolymerizable m-acid characterized by containing a microgel having a functional group represented by the following general formula (I) and an acid group having a pKa value of 14 or less, and a photopolymerization initiator. .
(ただし、式中、Rは−H又は−CUtを示す、)以下
、本発明について詳述する。(However, in the formula, R represents -H or -CUt.) The present invention will be described in detail below.
本発明で使用される上記−紋穴(I〉で示される官能基
と、pKa値が14以下の酸基とを有するミグ50ゲル
とは、架橋構造を有する直径0.01〜1μmの球状の
高分子化合物を言い、乳化重合等によって作られる。ミ
クロゲルの作製と利用については、例えば英国特許第9
67、051号及び米国特許第3.895.082号公
報中に説明されている。The MIG50 gel used in the present invention, which has a functional group represented by the above-mentioned symbol (I) and an acid group with a pKa value of 14 or less, is a spherical gel with a crosslinked structure and a diameter of 0.01 to 1 μm. It refers to a high-molecular compound and is produced by emulsion polymerization, etc. Regarding the production and use of microgels, for example, British Patent No. 9
No. 67,051 and U.S. Pat. No. 3,895,082.
本発明において、好適に使用されるpKa値が14以下
の酸基としては、例えば−SO3H。In the present invention, the acid group having a pKa value of 14 or less that is preferably used is, for example, -SO3H.
−CONHCO−−SO,NH−、フェノール性−OH
。-CONHCO--SO,NH-,phenolic-OH
.
−COCHzCOo−等が挙げられる。-COCHzCOo- and the like.
本発明において好適に使用される一般式(I)で示され
る官能基と、pKa値が14以下の酸基とを有するミク
ロゲルは、下記A−C群の化合物及び必要に応じて更に
D群の化合物を用い、好ましくは乳化重合又は分散重合
によりミクロゲルとし、更にE群の化合物と反応させる
ことにより得られる。The microgel having a functional group represented by the general formula (I) and an acid group having a pKa value of 14 or less, which is preferably used in the present invention, is made of compounds of the following groups A to C and, if necessary, further of the group D. It is obtained by using a compound, preferably by emulsion polymerization or dispersion polymerization, to form a microgel, and then reacting it with a compound of Group E.
」
重合可能なエチレン性不飽和結合と、重合反応には不活
性であるが他の反応(例えば、エステル化、アミド化)
には活性な官能基(例えば、ヒドロキシル基、グリシジ
ル基、ハロゲン原子、アミ)基)とを有する化合物(好
ましくは5〜95モル%)
本発明において好適に使用されるこのような化合物とし
ては、例えば2−ヒドロキシエチルメタクリレート、2
−ヒドロキシプロピルメタクリレート、ポリエチレング
リコールモノメタクリレート、2−(5−ヒドロキシペ
ンタノイルオキシ)エチルメタクリレート、グリシジル
メタクリレート、2−クロロエチルメタクリレート、2
−ブロモエチルメタクリレ−)、N−(p−ヒドロキシ
フェニル)メタクリルアミド、N −(m−アミノフェ
ニル〉メタクリルアミド等のメタクリル酸誘導体、上記
と同様の置換基を有するアクリル酸誘導体及びp−クロ
ロメチルスチレン等のスチレン誘導体が挙げられる。” Polymerizable ethylenically unsaturated bonds and other reactions that are inert to polymerization reactions (e.g., esterification, amidation)
Compounds (preferably 5 to 95 mol%) having an active functional group (e.g., hydroxyl group, glycidyl group, halogen atom, amine) group (preferably 5 to 95 mol%) Such compounds preferably used in the present invention include: For example, 2-hydroxyethyl methacrylate, 2
-Hydroxypropyl methacrylate, polyethylene glycol monomethacrylate, 2-(5-hydroxypentanoyloxy)ethyl methacrylate, glycidyl methacrylate, 2-chloroethyl methacrylate, 2
Methacrylic acid derivatives such as -bromoethyl methacrylate), N-(p-hydroxyphenyl) methacrylamide, N-(m-aminophenyl>methacrylamide), acrylic acid derivatives having the same substituents as above, and p-chloro Examples include styrene derivatives such as methylstyrene.
1星
重合可能なエチレン性不飽和結合と、pKa値が14以
下の酸基とを有する化合物(好ましくは1〜80モル%
)
本発明において好適に使用されるこのような化合物とし
ては、例えばメタクリル酸、アクリル酸、3−(2−メ
タクリロイルオキシエトキシカルボニル)プロピオン酸
、N−(2−スルホ−1,1−ジメチルエチル)メタク
リルアミド、N−(フェニルスルホニル)メタクリルア
ミド、N−(p−スルファモイルフェニル)メタクリル
アミド、N−(p−ヒドロキシフェニル)メタクリルア
ミド、2−アセトアセトキシエチルメタクリレート等の
メタクリルM誘導体、上記と同様の置換基を有するアク
リル酸誘導体、マレイミド類、p−ビニルベンゼンスル
ホン酸等のスチレン誘導体、及びEP 115410
A2等に記載されている化合−物が挙げられる。A compound having an ethylenically unsaturated bond capable of one-star polymerization and an acid group having a pKa value of 14 or less (preferably 1 to 80 mol%)
) Such compounds suitably used in the present invention include, for example, methacrylic acid, acrylic acid, 3-(2-methacryloyloxyethoxycarbonyl)propionic acid, N-(2-sulfo-1,1-dimethylethyl) Methacryl M derivatives such as methacrylamide, N-(phenylsulfonyl)methacrylamide, N-(p-sulfamoylphenyl)methacrylamide, N-(p-hydroxyphenyl)methacrylamide, 2-acetoacetoxyethyl methacrylate, and the above and Acrylic acid derivatives having similar substituents, maleimides, styrene derivatives such as p-vinylbenzenesulfonic acid, and EP 115410
Examples include compounds described in A2 and the like.
立並
2つ以上の重合可能なエチレン性不飽和結合を有する化
合物(架橋化剤、好ましくは1〜50モル%)
本発明において好適に使用されるこのような化合物とし
ては、例えば、エチレングリコールジメタクリレート、
ブタンジオールジメタクリレート、トリメチロールプロ
パントリメタクリレート、メチレンビスメタクリルアミ
ド等のメタクリル酸誘導体及び上記と同様の置換基を有
するアクリル酸誘導体、及びジビニルベンゼン等のスチ
レン誘導体等が挙げられる。Compounds having two or more polymerizable ethylenically unsaturated bonds (crosslinking agent, preferably 1 to 50 mol%) Such compounds preferably used in the present invention include, for example, ethylene glycol di methacrylate,
Examples include methacrylic acid derivatives such as butanediol dimethacrylate, trimethylolpropane trimethacrylate, methylene bismethacrylamide, acrylic acid derivatives having the same substituents as above, and styrene derivatives such as divinylbenzene.
旦星
その他の重合可能なエチレン性不飽和結合を有する化合
物(好ましくは、5〜80モル%)本発明において好適
に使用されるこのような化合物としては、例えば炭素数
20以下のメタクリル酸エステル類、アクリル酸エステ
ル類、メタクリル酸ア逅ド類、アクリルアミド類、スチ
レン類及びアクリロニトリル、メタクリレートリル等が
挙げられる。Compounds having a polymerizable ethylenically unsaturated bond (preferably 5 to 80 mol%) such as Dansei etc. Such compounds suitably used in the present invention include, for example, methacrylic acid esters having 20 or less carbon atoms. , acrylic esters, methacrylic acid esters, acrylamides, styrenes, acrylonitrile, methacrylate trile, and the like.
なお、分散重合を行う場合には、゛ポリエステルオリゴ
マーの末端をメタクリル酸エステルとしたマクロマー等
を用いることが好ましい。In addition, when carrying out dispersion polymerization, it is preferable to use a macromer or the like in which the terminal end of a polyester oligomer is a methacrylic ester.
1星
一般式(1,)で示される官能基及びA群の化合物中に
含まれる官能基と反応しうる官能基を有する化合物。A compound having a functional group represented by the 1-star general formula (1,) and a functional group capable of reacting with a functional group contained in a compound of Group A.
本発明において好適に使用されるこのような化合物とし
ては例えば、メタクリル酸、メタクリル酸クロリド、メ
タクリル酸無水物、メタクリル酸とトルエンスルホン酸
の混合酸無水物、メタクリル酸と炭酸の混合酸無水物、
2−メタクリロイルオキシエチルイソシアナート等のメ
タクリル酸誘導体、及び上記と同様のアクリル酸誘導体
等が挙げられる。Examples of such compounds preferably used in the present invention include methacrylic acid, methacrylic acid chloride, methacrylic anhydride, mixed acid anhydride of methacrylic acid and toluenesulfonic acid, mixed acid anhydride of methacrylic acid and carbonic acid,
Examples include methacrylic acid derivatives such as 2-methacryloyloxyethyl isocyanate, and acrylic acid derivatives similar to those mentioned above.
本発明のミクロゲルは好ましくは乳化重合又は分散重合
によって得られるが、これらの重合方法については、米
国特許第3.895.082号、英国特許第967.0
51号及びイムノロジカル・コミュニケーシヨンズ(I
MMUNOLOGICAL COMMUNICATIO
NS)、12(5) 、509−517 (1983
)を始めとし、数多くの文献がある。The microgels of the present invention are preferably obtained by emulsion polymerization or dispersion polymerization, and these polymerization methods are described in US Pat. No. 3.895.082 and British Patent No. 967.0.
No. 51 and Immunological Communications (I
MMUNOLOGICAL COMMUNICATIO
NS), 12(5), 509-517 (1983
), and there are many other documents.
また、A−C群の化合物及び必要に応じてさらにD群の
化合物を用い乳化重合によりミクロゲルとした場合、E
群との化合物との反応を行う前にミクロゲルを乾燥した
粉末に変える操作が通常必要である。il集、濾過、洗
浄及び乾燥という公知技術をこの目的のため用いること
ができる。また、適当な有機溶剤(例えば、トルエン等
)を使用し、共沸蒸留によりミクロゲルの水分散液より
粉末にすることなく、有機溶剤の分散液とすることもで
きる。In addition, when a microgel is formed by emulsion polymerization using compounds of groups A to C and optionally a compound of group D, E
It is usually necessary to transform the microgel into a dry powder before carrying out the reaction with the compound. The known techniques of collection, filtration, washing and drying can be used for this purpose. Furthermore, by using a suitable organic solvent (for example, toluene, etc.), an aqueous dispersion of the microgel can be converted into an organic solvent dispersion by azeotropic distillation without turning the aqueous dispersion into a powder.
更にE群との反応を行う場合、ピリジン、アミン類等の
塩基の存在下で行うことが望ましい。Furthermore, when the reaction with Group E is carried out, it is desirable to carry out the reaction in the presence of a base such as pyridine or amines.
本発明のミクロゲルの使用量は光重合性組成物の総重量
を基準にして、5〜95重量%、好ましくは、lO〜a
O重量%の範囲である。The amount of the microgel of the present invention used is 5 to 95% by weight based on the total weight of the photopolymerizable composition, preferably 1O to a
% by weight.
なお、感光性&11底物の中にミクロゲルを成分の1つ
として用いることは特開昭52−116301号、特開
昭62−173455号の各公報等に記載されているが
、これらは一般式(I)で示される官能基を実質上含ん
でおらず、この点で本発明とは区別される。Note that the use of microgel as one of the components in the photosensitive & It does not substantially contain the functional group represented by (I), and is distinguished from the present invention in this point.
本発明において好適に使用される光重合開始剤としては
、例えば米国特許第2.367.660号明細書に開示
されているビシナールポリケタルドニル化合物、米国特
許第2,367.661号及び第2,367.670号
明細書に開示されているα−カルボニル化合物、米国特
許第2.448.828号明細書に開示されているアシ
ロインエーテル、米国特許第2,722.512号明細
書に開示されているα−位が炭化水素で置換された芳香
族アシロイン化合物、米国特許第3.046,127号
及び第2.951.758号明細書に開示されている多
核率ノン化合物、米国特許第3.549.367号明細
書に開示されているトリアリールイミダゾ−ルダイマー
/p−アミノフェニルケトンの組合せ、米国特許第3.
870.524号明細書に開示されているベンゾチアゾ
ール系化合物、米国特許第3、751.259号明細書
に開示されているアクリジン/フェナジン化合物、米国
特許第4.212.970号明細書に開示されているオ
キサジアゾール化合物等が含まれる。Examples of photopolymerization initiators suitably used in the present invention include vicinal polyketaldonyl compounds disclosed in U.S. Pat. No. 2,367.660, U.S. Pat. No. 2,367,661 and α-carbonyl compounds disclosed in U.S. Pat. No. 2,367.670, asylloin ethers disclosed in U.S. Pat. No. 2,448.828, U.S. Pat. No. 2,722.512 Aromatic acyloin compounds substituted with a hydrocarbon at the α-position disclosed in U.S. Pat. No. 3,046,127 and U.S. Pat. The triarylimidazole dimer/p-aminophenyl ketone combination disclosed in U.S. Pat. No. 3,549,367;
Benzothiazole compounds disclosed in U.S. Pat. No. 870.524, acridine/phenazine compounds disclosed in U.S. Pat. No. 3,751.259, and U.S. Pat. No. 4,212.970. This includes oxadiazole compounds, etc.
好ましくは下記一般式(n)又は(I[[)で示される
トリハロメチル−3−トリアジン化合物又はトリハロメ
チルオキサジアゾール化合物が挙げられる。Preferred examples include trihalomethyl-3-triazine compounds and trihalomethyloxadiazole compounds represented by the following general formula (n) or (I[[).
Zl
ここで式中、N2は置換もしくは無置換のアリール、ア
ルケニル基、Zl はz’ 、−cy、又は、置換もし
くは無置換のアルキル基を示す。Yは塩素原子又は臭素
原子を示す。Zl In the formula, N2 represents a substituted or unsubstituted aryl or alkenyl group, and Zl represents z', -cy, or a substituted or unsubstituted alkyl group. Y represents a chlorine atom or a bromine atom.
一般式(n)で示される化合物としては、例えば若林ら
著、Bull、 Chem、 Soc、 、Japan
、第42巻、第2924頁(1969年)に記載の化合
物、英国特許第1.388.492号、西独特許第2.
718.259号、および西独特許N3.337.02
4号明細書記載の化合物が挙げられる。具体的には次に
示す化合物が含まれる。Examples of the compound represented by the general formula (n) include Wakabayashi et al., Bull, Chem, Soc, Japan.
, Vol. 42, p. 2924 (1969), British Patent No. 1.388.492, West German Patent No. 2.
No. 718.259, and West German patent N3.337.02
Examples include the compounds described in Specification No. 4. Specifically, the following compounds are included.
即ち、2−フェニル−4,6−ビス(トリクロロメチル
)−5−)リアジン、2−(p−クロロフェニル)−4
,6−ビス(トリクロロメチル)−8−トリアジン、2
−(p−)リル)−4,6−ヒス()IJクロロメチル
)−S−)リアジン、2−(p−メトキシフェニル)−
4,6−ビス(トリクロロメチル)−3−)リアジン、
2−(2’、4’−ジクロロフェニル)−4,6−ビス
(トリクロロメチル’)−3−)リアジン、2゜4.6
−トリス(トリクロロメチル)−3−)リアジン、2−
メチル−4,6−ビス(トリクロロメチル)−5−)リ
アジン、2−n−ノニル−4゜6−ビス(トリクロロメ
チル)−3−)リアジン、2−(α、α、β−トリクロ
ロエチル)−4,,6−ビス(トリクロロメチル)−5
−)リアジン、2−スチリル−4,6−ビス(トリクロ
ロメチル)−8−トリアジン、2−(p−メチルスチリ
ル)−4,6−ビス(トリクロロメチル)−3−トリア
ジン、2−(p−メトキシスチリル)−4,6−ビス(
トリクロロメチル)−3−トリアジン、2−(4−メト
キシ−ナフト−1−イル)−4゜6−ビス(トリクロロ
メチル)−3−)リアジン、2−(4−エトキシ−ナフ
ト−1−イル)−4゜6−ビス(トリクロロメチル)−
S−トリアジン、2−’、、(4−(2−エトキシエチ
ル)−ナフト−1−イル)−4,6−ビス(トリクロロ
メチル)−3−トリアジン、2− (4,7−ジフトキ
ジ−ナフト−l−イル)−4,6−ビス(トリクロロメ
チル)−5−)リアジン、2−(アセナフト−5−イル
)−4,6−ビス(トリクロロメチル)−3−トリアジ
ン、2− (4−スチリルフェニル)−4,6−ビス(
トリクロロメチル)−3−トリアジン等が含まれる。That is, 2-phenyl-4,6-bis(trichloromethyl)-5-)riazine, 2-(p-chlorophenyl)-4
, 6-bis(trichloromethyl)-8-triazine, 2
-(p-)lyl)-4,6-his()IJchloromethyl)-S-)riazine, 2-(p-methoxyphenyl)-
4,6-bis(trichloromethyl)-3-)riazine,
2-(2',4'-dichlorophenyl)-4,6-bis(trichloromethyl')-3-)riazine, 2°4.6
-tris(trichloromethyl)-3-) riazine, 2-
Methyl-4,6-bis(trichloromethyl)-5-) riazine, 2-n-nonyl-4゜6-bis(trichloromethyl)-3-) riazine, 2-(α,α,β-trichloroethyl) -4,,6-bis(trichloromethyl)-5
-) riazine, 2-styryl-4,6-bis(trichloromethyl)-8-triazine, 2-(p-methylstyryl)-4,6-bis(trichloromethyl)-3-triazine, 2-(p- methoxystyryl)-4,6-bis(
Trichloromethyl)-3-triazine, 2-(4-methoxy-naphth-1-yl)-4゜6-bis(trichloromethyl)-3-)riazine, 2-(4-ethoxy-naphth-1-yl) -4゜6-bis(trichloromethyl)-
S-Triazine, 2-', (4-(2-ethoxyethyl)-naphth-1-yl)-4,6-bis(trichloromethyl)-3-triazine, 2-(4,7-diphthoxyethyl)-naphtho -l-yl)-4,6-bis(trichloromethyl)-5-)riazine, 2-(acenaphth-5-yl)-4,6-bis(trichloromethyl)-3-triazine, 2-(4- styrylphenyl)-4,6-bis(
(trichloromethyl)-3-triazine and the like.
また、一般式(III)で示される化合物としては、例
えば特開昭54−74728号公報、特開昭 55−7
7742号公報、及び特開昭59−148784号公報
記載の化合物が挙げられる。Further, as the compound represented by the general formula (III), for example, JP-A-54-74728, JP-A-55-7
Examples thereof include compounds described in JP-A No. 7742 and JP-A-59-148784.
具体例には次に示す化合物が含まれる。Specific examples include the compounds shown below.
即ち、2−スチリル−5−トリクロロメチル−1,3,
4−オキサジアゾール、2−(4−クロロスチリル)−
5−)ジクロロメチル−1,3゜4−オキサジアゾール
、2− (4−メチルスチリル)−5−)ジクロロメチ
ル−1,3,4−オキサジアゾール、2−(4−メトキ
シスチリル〉−5−トリクロロメチル−1,3,4−オ
キサジアゾール、2−(4−ブトキシスチリル)−5−
)ジクロロメチル−1,3,4−オキサジアゾール、2
−(4−スチリルスチリル)−5−)ジクロロメチル−
1,3,4−オキサジアゾール、2−フェニルー5−ト
リクロロメチルー1.3.4−オキサジアゾール、2−
(4−メトキシフェニル)−5−トリクロロメチル−1
,3,4−オキサジアゾール、2−(3,4−ジメトキ
シフェニル)−5−トリクロロメチル−1,3,4−オ
キサジアゾール、2−(4−スチリルフェニル)−5−
トリクロロメチル−1,3,4−オキサジアゾール、2
−(l−ナフチル)−5−)リクロロメチルー1.3.
4−オキサジアゾール等が含まれる。That is, 2-styryl-5-trichloromethyl-1,3,
4-Oxadiazole, 2-(4-chlorostyryl)-
5-) Dichloromethyl-1,3゜4-oxadiazole, 2-(4-methylstyryl)-5-)dichloromethyl-1,3,4-oxadiazole, 2-(4-methoxystyryl)- 5-Trichloromethyl-1,3,4-oxadiazole, 2-(4-butoxystyryl)-5-
) dichloromethyl-1,3,4-oxadiazole, 2
-(4-styrylstyryl)-5-)dichloromethyl-
1,3,4-oxadiazole, 2-phenyl-5-trichloromethyl-1,3,4-oxadiazole, 2-
(4-methoxyphenyl)-5-trichloromethyl-1
, 3,4-oxadiazole, 2-(3,4-dimethoxyphenyl)-5-trichloromethyl-1,3,4-oxadiazole, 2-(4-styrylphenyl)-5-
Trichloromethyl-1,3,4-oxadiazole, 2
-(l-naphthyl)-5-)lichloromethyl-1.3.
Includes 4-oxadiazole and the like.
必要により本発明の光重合性組成物に増感剤を添加する
ことができる。具体的には、特公昭59−28328号
公報に示される芳香族チアゾール化合物、特開昭54−
151024号公報に示されるメロシアニン色素、特開
昭58−40302号公報に示される芳香族チオピリリ
ウム塩や芳香族ピリリウム塩、その他9−フェニルアク
リジン、5−ニトロアセナフチン、ケトクロリン類等の
光吸収剤が挙げられる。更にはこれらにN−フェニルグ
リシン、2−メルカプトベンゾチアゾール、N、N’−
ジメチルアミノ安息香酸エチル等の水素供与体等を組み
合わせた系も、本発明に有効に使用される。If necessary, a sensitizer can be added to the photopolymerizable composition of the present invention. Specifically, aromatic thiazole compounds disclosed in Japanese Patent Publication No. 59-28328,
Merocyanine dyes shown in JP-A No. 151024, aromatic thiopyrylium salts and aromatic pyrylium salts shown in JP-A-58-40302, and other light absorbers such as 9-phenylacridine, 5-nitroacenaphthine, ketochlorins, etc. Can be mentioned. Furthermore, these include N-phenylglycine, 2-mercaptobenzothiazole, N,N'-
Systems in combination with hydrogen donors such as ethyl dimethylaminobenzoate are also effectively used in the present invention.
本発明における光重合開始剤及び/又は増感剤の量は、
光重合性組成物の総重量を基準にして、0.01重量%
から20重量%の範囲で充分であり、更に好ましくは0
.5重量%から10重量%で良好な結果が得られる。The amount of the photopolymerization initiator and/or sensitizer in the present invention is
0.01% by weight, based on the total weight of the photopolymerizable composition
A range of from 20% by weight is sufficient, more preferably from 0 to 20% by weight.
.. Good results are obtained with 5% to 10% by weight.
本発明の光重合性組成物に1よ、更に必要に応じて、不
飽和モノマー又はオリゴマー、アルカリ可溶性樹脂、ジ
アゾ樹脂、熱重合防止剤等を含有することができる。The photopolymerizable composition of the present invention may further contain unsaturated monomers or oligomers, alkali-soluble resins, diazo resins, thermal polymerization inhibitors, etc., if necessary.
本発明の光重合性組成物に使用される不飽和モノマー又
はオリゴマーとしては、少なくとも1つの付加重合性不
飽和基を有する化合物が有用であるが、特に望ましいも
のは、エチレングリコールジ(メタ)アクリレート、ポ
リエチレングリコールジ(メタ〉アクリレート、トリメ
チロールエタントリ (メタ〉アクリレート、トリメチ
ロールプロパントリ (メタ)アクリレート、ネオペン
チルグリコールジ(メタ〉アクリレート、ペンタエリス
リトール及びジペンタエリスリトールのトリーテトラ−
もしくはヘキサ(メタ)アクリレート、エポキシジ(メ
タ)アクリレート、特公昭52−7361号公報に開示
されているようなオリゴアクリレート、特公昭48−4
1708号公報に開示されているようなアクリルウドタ
ン樹脂又はアクリルウレタンのオリゴマー等である。As the unsaturated monomer or oligomer used in the photopolymerizable composition of the present invention, compounds having at least one addition-polymerizable unsaturated group are useful, and particularly desirable ones include ethylene glycol di(meth)acrylate. , polyethylene glycol di(meth)acrylate, trimethylolethanetri(meth)acrylate, trimethylolpropanetri(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol and dipentaerythritol tritetra
Or hexa(meth)acrylate, epoxy di(meth)acrylate, oligoacrylate as disclosed in Japanese Patent Publication No. 52-7361, Japanese Patent Publication No. 48-4
Examples include acrylic urethane resin or acrylic urethane oligomer as disclosed in Japanese Patent No. 1708.
これらの不飽和モノマー及びオリゴマーは、光重合性組
成物の総重量に対して、好ましくは70重量%以下で使
用される。These unsaturated monomers and oligomers are preferably used in an amount of 70% by weight or less based on the total weight of the photopolymerizable composition.
本発明の光重合性組成物に使用されるアルカリ可溶性樹
脂としては、例えば特開昭59−46643号公報に記
載されている高分子化合物、フェノールホルムアルデヒ
ド樹脂、クレゾールホルムアルデヒド樹脂、ポリヒドロ
キシスチレン、カルボキシル基゛含有(メタ)アクリレ
ート樹脂、カルボキシル基含有ポリウレタン樹脂等、公
知のアルカリ可溶性樹脂を挙げられることができる。こ
れらのアルカリ可溶性樹脂は光重合性組成物の総重量に
対して、好ましくは70重量%以下で使用される。Examples of the alkali-soluble resin used in the photopolymerizable composition of the present invention include polymer compounds described in JP-A-59-46643, phenol formaldehyde resin, cresol formaldehyde resin, polyhydroxystyrene, and carboxyl group. Examples include known alkali-soluble resins such as (meth)acrylate resins containing carboxyl groups and polyurethane resins containing carboxyl groups. These alkali-soluble resins are preferably used in an amount of 70% by weight or less based on the total weight of the photopolymerizable composition.
本発明の光重合性&l1tc物に使用されるジアゾ樹脂
としては4言ジアゾージフエニルアξン、1−ジアシー
4−N、N−ジメチルアミノベンゼン、1−ジアゾ−4
−N、N−ジエチルアミノベンゼン、1−ジアゾ−4−
N−エチル−N−ヒドロキシエチルアミノベンゼン、1
−ジアゾ−4−N−メチル−N−ヒドロキシエチルアミ
ノベンゼン、1−ジアゾ−2,5−ジェトキシ−4−ベ
ンゾイルアミノベンゼン、1−ジアゾ−4−N−ベンジ
ルアミノベンゼン、1−ジアゾ−4°−N、N−ジメチ
ルアミノベンゼン、1−ジアゾ−4−モルフォリノベン
ゼン、1−ジアゾ−2,5−ジメトキシ−4−p−)リ
ルメルカブトベンゼン、1−ジアゾ−2−エトキシ−4
−N、N−ジメチルアミノベンゼン、p−ジアゾ−ジメ
チルアニリン、1−ジアゾ−2,5−ジブトキシ−4−
モルフォリノベンゼン、1−ジアゾ−2,5−ジェトキ
シ−4−モルフォリノベンゼン、1−ジアゾ−2,5−
ジメトキシ−4−モルフォリノベンゼン、1−ジアシー
2.5−ジェトキシ−4−モルフォリノベンゼン、1−
ジアゾ−2,5−ジェトキシ−4−p−)リルメルカブ
トベンゼン、1−ジアゾ−3−エトキシ−4−N−メチ
ル−N−ベンジルアミノベンゼン、1−ジアゾ−3−ク
ロロ−4−N。The diazo resins used in the photopolymerizable material of the present invention include 4-diazodiphenylene, 1-diazo-4-N, N-dimethylaminobenzene, 1-diazo-4
-N,N-diethylaminobenzene, 1-diazo-4-
N-ethyl-N-hydroxyethylaminobenzene, 1
-Diazo-4-N-methyl-N-hydroxyethylaminobenzene, 1-diazo-2,5-jethoxy-4-benzoylaminobenzene, 1-diazo-4-N-benzylaminobenzene, 1-diazo-4° -N,N-dimethylaminobenzene, 1-diazo-4-morpholinobenzene, 1-diazo-2,5-dimethoxy-4-p-)lylmercabutobenzene, 1-diazo-2-ethoxy-4
-N,N-dimethylaminobenzene, p-diazo-dimethylaniline, 1-diazo-2,5-dibutoxy-4-
Morpholinobenzene, 1-diazo-2,5-jethoxy-4-morpholinobenzene, 1-diazo-2,5-
Dimethoxy-4-morpholinobenzene, 1-diacy2,5-jethoxy-4-morpholinobenzene, 1-
Diazo-2,5-jethoxy-4-p-)lylmercabutobenzene, 1-diazo-3-ethoxy-4-N-methyl-N-benzylaminobenzene, 1-diazo-3-chloro-4-N.
N−ジエチルアミノベンゼン、1−ジアゾ−3−メチル
−4−ピロリジノベンゼン、1−ジアゾ−2−クロロ−
4−N、N−ジメチルアミノ−5−メトキシベンゼン、
1−ジアゾ−3−メトキシ−4−ピロリジノベンゼン、
3−メトキシ−4−ジアゾジフェニルアミン、3−エト
キシ−4−ジアゾフェニルアミン、3− (n−プロポ
キシ)−4−ジアゾフェニルアミン、3−インプロポキ
シ−4−ジアゾジフェニルアミンのようなジアゾモノマ
ーと、ホルムアルデヒド、アセトアルデヒド、プロピオ
ンアルデヒド、ブチルアルデヒド、インフチルア・ルデ
ヒド、ベンズアルデヒドのような縮合剤をモル比で各々
1:1〜1:0.5、好ましくは1:0.8〜l:0.
6とし、これを通常の方法で縮合して得られた縮合物と
陰イオンとの反応生成物が挙げられる。陰イオンとして
は、四フッ化ホウ酸、六フッ化燐酸、トリイソプロピル
ナフタレンスルホン酸、5−ニトロオルト−トルエンス
ルホン酸、5−スルホサリチル酸、2.5−ジメチルベ
ンゼンスルホン酸、2.4.6−ドデシルベンゼンスル
ホン酸、2−ニトロベンゼンスルホン酸、3−クロロベ
ンゼンスルホン13−ブロモベンゼンスルホン酸、2−
フルオロカプリルナフタレンスルホン酸、ドデシルベン
ゼンスルホン酸、1−ナフトール−5−スルホン酸、2
−メトキシ−4−ヒドロキシ−5−ベンゾイル−ベンゼ
ンスルホン酸、及びパラトルエンスルホン酸等を挙げる
ことができる。これらの中でも特に六フッ化燐酸、トリ
イソプロピルナフタレンスルホン酸や、2.5−ジメチ
ルベンゼンスルホン酸などのアルキル芳香族スルホン酸
が好適である。N-diethylaminobenzene, 1-diazo-3-methyl-4-pyrrolidinobenzene, 1-diazo-2-chloro-
4-N,N-dimethylamino-5-methoxybenzene,
1-diazo-3-methoxy-4-pyrrolidinobenzene,
Diazo monomers such as 3-methoxy-4-diazodiphenylamine, 3-ethoxy-4-diazophenylamine, 3-(n-propoxy)-4-diazophenylamine, 3-impropoxy-4-diazodiphenylamine, and formaldehyde. , acetaldehyde, propionaldehyde, butyraldehyde, inftyraldehyde, and benzaldehyde in a molar ratio of 1:1 to 1:0.5, preferably 1:0.8 to 1:0.
6, and a reaction product of a condensate obtained by condensing this by a conventional method and an anion. Examples of anions include tetrafluoroboric acid, hexafluorophosphoric acid, triisopropylnaphthalenesulfonic acid, 5-nitroortho-toluenesulfonic acid, 5-sulfosalicylic acid, 2.5-dimethylbenzenesulfonic acid, 2.4.6- Dodecylbenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 3-chlorobenzenesulfonic acid, 13-bromobenzenesulfonic acid, 2-
Fluorocaprylnaphthalenesulfonic acid, dodecylbenzenesulfonic acid, 1-naphthol-5-sulfonic acid, 2
Examples include -methoxy-4-hydroxy-5-benzoyl-benzenesulfonic acid and para-toluenesulfonic acid. Among these, particularly preferred are hexafluorophosphoric acid, triisopropylnaphthalenesulfonic acid, and alkyl aromatic sulfonic acids such as 2,5-dimethylbenzenesulfonic acid.
また、前述したジアゾモノマーと、カルボン酸及び/又
はフェノールを有するアルデヒド又はそのアセタール(
更に必要に応じて前述の縮合剤)とより得られる縮合物
及び前述の陰イオンの反応生成物や、特開平1−102
456号及び特開平l−102457号公報に記載され
ているジアゾ樹脂も本発明において好適に使用される。In addition, the aforementioned diazo monomer and an aldehyde or its acetal having a carboxylic acid and/or phenol (
Furthermore, if necessary, a reaction product of the condensate obtained with the above-mentioned condensing agent) and the above-mentioned anion, or JP-A-1-102
Diazo resins described in No. 456 and JP-A-102457 are also preferably used in the present invention.
これらジアゾ樹脂の全組成物に対する添加量は、好まし
くは15重量%以下である。The amount of these diazo resins added to the total composition is preferably 15% by weight or less.
なお、これらのジアゾ樹脂は、平版印刷版における感光
層と支持体との中間層として使用することもできる。Note that these diazo resins can also be used as an intermediate layer between the photosensitive layer and the support in a lithographic printing plate.
本発明の光重合性組成物に使用される熱重合防止剤とし
ては、例えばハイドロキノン、p−メトキシフェノール
、ジ−t−ブチル−p−クレゾール、ピロガロール、t
−ブチルカテコール、ベンゾキノン、4.4′−チオビ
ス(3−メチル−6−t−ブチルフェノール)、2.2
’−メチレンビス(4−メチル−6−t−ブチルフェノ
ール)、2−メルカプトベンゾイミダゾール等が挙げら
れる0、
なお、必要に応じて光重合性組成物の層の着色を目的に
して染料もしくは顔料や焼出剤としてpH指示薬等を添
加することもできる。Examples of the thermal polymerization inhibitor used in the photopolymerizable composition of the present invention include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-
-Butylcatechol, benzoquinone, 4.4'-thiobis(3-methyl-6-t-butylphenol), 2.2
Examples include '-methylenebis(4-methyl-6-t-butylphenol), 2-mercaptobenzimidazole, etc.If necessary, dyes or pigments or baking powders may be used for the purpose of coloring the layer of the photopolymerizable composition. A pH indicator or the like can also be added as a solvent.
焼出し剤としては、露光によって酸を放出する感光性化
合物と塩を形威し得る有機染料の組合せを代表として挙
げることもできる。Typical printing agents include a combination of a photosensitive compound that releases an acid upon exposure to light and an organic dye that can form a salt.
更に、ジアゾ樹脂を用いる場合、その安定化剤として、
リン酸、亜リン酸、酒石酸、クエン酸、リンゴ酸、ジピ
コリン酸、多核芳香族スルホン酸及びその塩、スルホサ
リチル酸等を必要に応して添加することができる。Furthermore, when using a diazo resin, as a stabilizer,
Phosphoric acid, phosphorous acid, tartaric acid, citric acid, malic acid, dipicolinic acid, polynuclear aromatic sulfonic acid and its salts, sulfosalicylic acid, etc. can be added as necessary.
また本発明の光重合性&l1t77、物には可塑剤など
を含めてもよい、可塑剤としては、ジブチルフタレート
、ジブチルフタレートなどフタル酸ジアルキルエステル
、オリゴエチレングリコールアルキルエステル、リン酸
エステル系の可塑剤などを使用することができる。In addition, the photopolymerizable product of the present invention may contain a plasticizer, etc. Examples of the plasticizer include dialkyl phthalate such as dibutyl phthalate and dibutyl phthalate, oligoethylene glycol alkyl ester, and phosphate ester plasticizer. etc. can be used.
上述のごとき光重合性&Il戒物酸物例えば、トルエン
、2−メトキシエタノール、2−メトキシエチルアセテ
ート、プロピレングリコールモノメチルエーテル、3−
メトキシプロパノール、3−メトキシプロピルアセテー
ト、メチルエチルケトン、N、N−ジメチルホルムアミ
ド、N、N−ジメチルアセドアミド、ジメチルスルオキ
シド、エチレンジクロライド、乳酸メチル、乳酸エチル
などの適当な溶剤の単独又はこれらを適当に組合せた混
合溶媒に溶解又は分散して支持体上に塗設する。Photopolymerizable &Il compound acids such as those mentioned above, such as toluene, 2-methoxyethanol, 2-methoxyethyl acetate, propylene glycol monomethyl ether, 3-
A suitable solvent such as methoxypropanol, 3-methoxypropyl acetate, methyl ethyl ketone, N,N-dimethylformamide, N,N-dimethylacedeamide, dimethyl sulfoxide, ethylene dichloride, methyl lactate, ethyl lactate, etc. alone or in combination It is dissolved or dispersed in a mixed solvent combined with the above and applied on a support.
その被覆量は乾燥後の重量で一般に0.1g/rd〜1
0 g/cd、好ましくは0.5〜5g/rrlである
。The coating amount is generally 0.1g/rd to 1% by weight after drying.
0 g/cd, preferably 0.5-5 g/rrl.
また支持体上に設けられた光重合性組成物の層の上には
、空気中の酸素の影響による重合禁止作用を防止するた
め、例えばポリビニルアルコール、酸性セルロース類な
どのような酸素遮断性に優れたポリマーよりなる保護層
を設けることが好ましい、このような保護層の塗布方法
については、例えば米国特許第3.458.311号、
特公昭55−49729号公報に詳しく記載されている
。In addition, on the layer of the photopolymerizable composition provided on the support, in order to prevent the polymerization inhibiting effect due to the influence of oxygen in the air, an oxygen-blocking material such as polyvinyl alcohol or acidic cellulose may be used. A method of applying such a protective layer, which is preferably made of a superior polymer, is described, for example, in U.S. Pat. No. 3,458,311;
It is described in detail in Japanese Patent Publication No. 55-49729.
本発明の光重合性&l1tc物を感光性平版印刷版とし
て用いる場合、支持体としてはアルミニウム板が好まし
い、アルミニウム板には純アルミニウム及びアルミニウ
ム合金板が含まれる。アルミニウム合金としては種々の
ものが使用でき、例えば珪素、銅、マンガン、マグネシ
ウム、クロム、亜鉛、鉛、ビスマス、ニッケルなどの金
属とアルミニウムの合金が用いられる。これらの組成は
、いくらかの鉄及びチタンに加えてその他無視し得る程
度の量の不純物をも含むものである。When the photopolymerizable material of the present invention is used as a photosensitive lithographic printing plate, an aluminum plate is preferred as the support, and aluminum plates include pure aluminum and aluminum alloy plates. Various aluminum alloys can be used; for example, alloys of aluminum and metals such as silicon, copper, manganese, magnesium, chromium, zinc, lead, bismuth, and nickel are used. These compositions contain some iron and titanium as well as other negligible impurities.
アルミニウム板は、必要に応じて表面処理される0例え
ば、砂目立て処理、珪酸ソーダ、フン化ジルコニウム酸
カリウム、リン酸塩等の水溶液へ浸漬処理、あるいは陽
極酸化処理などの表面処理がなされていることが好まし
い、また、米国特許第2.714.066号明細書に記
載されているように、砂目立てしたのち珪酸ナトリウム
水溶液に浸漬処理したアルミニウム板、米国特許第3.
181.461号明細書に記載されているようにアルミ
ニウム板を陽極酸化処理を行った後にアルカリ金属珪酸
塩の水溶液に浸漬処理したものも好適に使用される。The aluminum plate is surface treated as necessary.0 For example, surface treatments such as graining, immersion in an aqueous solution of sodium silicate, potassium fluorinated zirconate, phosphate, etc., or anodizing are carried out. Also preferred is an aluminum plate grained and immersed in an aqueous sodium silicate solution, as described in U.S. Pat. No. 2,714,066;
181.461, an aluminum plate which is anodized and then immersed in an aqueous solution of an alkali metal silicate is also preferably used.
上記陽極酸化処理は、例えば、リン酸、クロム酸、硫酸
、硼酸等の無機酸、若しくはシェラ酸、スルファ藁ン酸
等の有機酸又はこれらの塩の水溶液又は非水溶液の単独
又は二種以上を組み合わせた電解液中でアルミニウム板
を陽極として電流を流すことにより実施される。The above-mentioned anodizing treatment can be carried out using, for example, an aqueous or non-aqueous solution of an inorganic acid such as phosphoric acid, chromic acid, sulfuric acid, or boric acid, or an organic acid such as Schereric acid or sulfuric acid, or a salt thereof. It is carried out by passing a current through a combined electrolyte using an aluminum plate as an anode.
また、米国特許第3.658.662号明細書に記載さ
れているようなシリケート電着も有効である。Also effective is silicate electrodeposition as described in US Pat. No. 3,658,662.
これらの親水化処理は、支持体の表面を親水性とするた
めに施される以外に、その上に設けられる感光性組成物
との有害な反応を防ぐためや゛、感光性層との密着性を
向上させるために施される。These hydrophilic treatments are performed not only to make the surface of the support hydrophilic, but also to prevent harmful reactions with the photosensitive composition provided thereon, and to improve adhesion with the photosensitive layer. It is applied to improve sex.
アルミニウム板を砂目立てするに先立って、必要に応じ
て表面の圧延油を除去すること及び清浄なアルミニウム
面を表出させるためにその表面の前処理を施しても良い
、前者のためには、トリクレン等の溶剤、界面活性剤等
が用いられている。Prior to graining the aluminum plate, if necessary, the surface may be pretreated to remove rolling oil and expose a clean aluminum surface; for the former, Solvents such as trichlene, surfactants, etc. are used.
又後者のためには水酸化ナトリウム、水酸化カリウム等
のアルカリ・エツチング剤を用いる方法が広く行われて
いる。For the latter, a method using an alkaline etching agent such as sodium hydroxide or potassium hydroxide is widely used.
砂目立て方法としては、機械的、化学的及び電気化学的
な方法のいずれの方法も有効である0機械的方法として
は、ボール研磨法、プラスト研磨法、軽石のような研磨
剤の水分散スラリーをナイロンブラシで擦りつけるブラ
シ研磨法などがあり、化学的方法としては、特開昭54
−31187号公報に記載されているような鉱酸のアル
ミニウム塩の飽和水溶液に浸漬する方法が適しており、
電気化学的方法としては塩酸、硝酸又はこれらの組合せ
のような酸性電解液中で交流電解する方法が好ましい。Mechanical, chemical, and electrochemical methods are all effective for graining. Mechanical methods include ball polishing, plastic polishing, and water-dispersed slurry of abrasives such as pumice. There is a brush polishing method in which the material is rubbed with a nylon brush, and chemical methods include
A method of immersion in a saturated aqueous solution of an aluminum salt of a mineral acid as described in Publication No. 31187 is suitable.
As the electrochemical method, a method of alternating current electrolysis in an acidic electrolyte such as hydrochloric acid, nitric acid, or a combination thereof is preferred.
このような粗面化方法の内、特に特開昭55−1379
93号公報に記載されているような機械的粗面化と電気
化学的粗面化を組合せた粗面化方法は、感脂性画像の支
持体への接着力が強いので好ましい。Among these surface roughening methods, especially Japanese Patent Application Laid-Open No. 55-1379
A surface roughening method that combines mechanical roughening and electrochemical roughening as described in Japanese Patent No. 93 is preferred because it provides strong adhesion of the oil-sensitive image to the support.
上記の如き方法による砂目立ては、アルミニウム板の表
面の中心線表面粗さ(Ra)が0.3〜1.0μとなる
ような範囲で施されることが好ましい。Graining by the method described above is preferably carried out in such a range that the centerline surface roughness (Ra) of the surface of the aluminum plate is 0.3 to 1.0 μ.
このようにして砂目立てされたアルミニウム板は必要に
応じて水洗及び化学的にエツチングされる。The thus grained aluminum plate is washed with water and chemically etched as required.
二′ツチング処理液は、通常アルミニウムを溶解する塩
基あるいは酸の水溶液より選ばれる。この場合、エツチ
ングされた表面に、エツチング液成分から誘導されるア
ルミニウムと異なる被膜が形成されないものでなければ
ならない。好ましい工ッチング剤を例示すれば、塩基性
物質としては水酸化ナトリウム、水酸化カリウム、リン
酸三ナトリウム、リン酸二ナトリウム、リン酸三カリウ
ム、リン酸二カリウム等;酸性物質としては硫酸、過硫
酸、リン酸、塩酸及びその塩等であるが、アルミニウム
よりイオン化傾向の低い金属、例えば亜鉛、クロム、コ
バルト、ニッケル、銅等の塩はエツチング表面に不必要
な被膜を形成するから好ましくない。The 2'-touching solution is usually selected from aqueous solutions of bases or acids that dissolve aluminum. In this case, it is necessary that no film different from aluminum derived from the etching solution components is formed on the etched surface. Examples of preferred etching agents include basic substances such as sodium hydroxide, potassium hydroxide, trisodium phosphate, disodium phosphate, tripotassium phosphate, and dipotassium phosphate; acidic substances such as sulfuric acid and peroxide. Examples include sulfuric acid, phosphoric acid, hydrochloric acid, and their salts, but salts of metals with a lower ionization tendency than aluminum, such as zinc, chromium, cobalt, nickel, copper, etc., are not preferred because they form an unnecessary film on the etched surface.
これ等のエツチング剤は、使用濃度、温度の設定におい
て、使用するアルミニウムあるいは合金の溶解速度が浸
漬時間1分あたり0.3〜40g/m’になるように行
われるのが最も好ましいが、これを上回るあるいは下回
るものであっても差支えない。It is most preferable to use these etching agents in such a way that the dissolution rate of the aluminum or alloy used is 0.3 to 40 g/m' per minute of immersion time by setting the concentration and temperature. There is no problem even if it exceeds or falls below.
エツチングは上記エツチング液にアルミニウム板を浸漬
したり、該アルミニウム板にエツチング液を塗布するこ
と等により行われ、エツチング量が0.5〜10g/m
’の範囲となるように処理されることが好ましい。Etching is performed by immersing the aluminum plate in the above etching solution or applying the etching solution to the aluminum plate, and the etching amount is 0.5 to 10 g/m.
' is preferably processed.
上記エツチング剤としては、そのエツチング速度が早い
という特長から塩基の水溶液を使用することが望ましい
。この場合、スマットが生成するので、通常デスマット
処理される。デスマット処理に使用される酸は、硝酸、
硫酸、リン酸、クロム酸、フッ酸、ホウフッ化水素酸等
が用いられる。As the above-mentioned etching agent, it is desirable to use an aqueous base solution because of its high etching rate. In this case, since smut is generated, desmut processing is usually performed. Acids used for desmutting include nitric acid,
Sulfuric acid, phosphoric acid, chromic acid, hydrofluoric acid, hydrofluoroboric acid, etc. are used.
エツチング処理されたアルミニウム板は、必要により水
洗及び陽極酸化される。陽極酸化は、この分野で従来よ
り行なわれている方法で行なうことができる。具体的に
は、硫酸、リン酸、クロム酸、シュウ酸、スルファミン
酸、ベンゼンスルホン酸等あるいはそれらの二種類以上
を組み合せた水溶液又は非水溶液中でアルミニウムに直
流又は交流の電流を流すと、アルミニウム支持体表面に
陽極酸化被膜を形成させることができる。The etched aluminum plate is washed with water and anodized if necessary. Anodic oxidation can be performed by methods conventionally practiced in this field. Specifically, when a direct or alternating current is passed through aluminum in an aqueous or non-aqueous solution containing sulfuric acid, phosphoric acid, chromic acid, oxalic acid, sulfamic acid, benzenesulfonic acid, etc. or a combination of two or more of these, aluminum An anodic oxide film can be formed on the surface of the support.
陽極酸化の処理条件は使用される電解液によって種々変
化す°るので一概には決定され得ないが、−船釣には電
解液の濃度が1〜80重量%、液温5〜70℃、電流密
度0.5〜60 A/dm” 、電圧l〜100V、電
解時間30秒〜50分の範囲が適当である。The treatment conditions for anodic oxidation vary depending on the electrolyte used and cannot be determined unconditionally; however, for boat fishing, the concentration of the electrolyte is 1 to 80% by weight, the liquid temperature is 5 to 70°C, Appropriate ranges are a current density of 0.5 to 60 A/dm'', a voltage of 1 to 100 V, and an electrolysis time of 30 seconds to 50 minutes.
これらの陽極酸化処理の内でも、特に英国特許第1.4
12.768号明細書に記載されている硫酸中で高電流
密度で陽極酸化する方法及び米国特許第3、511.6
61号明細書に記載されているリン酸を電解浴として陽
極酸化する方法が好ましい。Among these anodizing treatments, especially British Patent No. 1.4
12,768 and U.S. Pat. No. 3,511.6.
The method of anodizing using phosphoric acid as an electrolytic bath described in No. 61 is preferred.
上記のように粗面化され、更に陽極酸化されたアルミニ
ウム板は、必要に応じて親水化処理しても良く、その好
ましい例としては米国特許第2、714.066号及び
同第3.181.461号に開示されているようなアル
カリ金属シリケート、例えば珪酸ナトリウム水溶液又は
特公昭36−22063号公報に開示されているフッ化
ジルコニウム酸カリウム及び米国特許第4.153.4
61号明細書に開示されているようなポリビニルスルホ
ン酸で処理する方法がある。The aluminum plate roughened as described above and further anodized may be subjected to a hydrophilic treatment if necessary. Preferred examples thereof include US Pat. No. 2,714.066 and US Pat. Alkali metal silicates, such as aqueous sodium silicate solutions as disclosed in Japanese Patent Publication No. 36-22063, and potassium fluorozirconate as disclosed in Japanese Patent Publication No. 36-22063 and U.S. Pat. No. 4.153.4.
There is a method of treating with polyvinylsulfonic acid as disclosed in No. 61.
更に、これらの処理の後に水溶液の樹脂、例えばポリア
クリル酸やスルホン酸基を側鎖に有する重合体及び共重
合体、その他、アルカリ性水溶液可溶性の低分子化合物
、トリエタノールアミンの塩や、アラニン化合物を下塗
りしたものも好適である。Furthermore, after these treatments, aqueous resins such as polyacrylic acid, polymers and copolymers having sulfonic acid groups in their side chains, other low molecular weight compounds soluble in alkaline aqueous solutions, triethanolamine salts, and alanine compounds are removed. It is also suitable to use an undercoat.
支持体上に塗布された上記本発明で具体的に適用される
感光性組成物は線画像、網点画像等を有する透明原画を
通して露光し、次いで水性アルカリ現像液で現像するこ
とにより\原画に対してネガのレリーフ像を与える。The photosensitive composition applied specifically in the present invention coated on a support is exposed to light through a transparent original having line images, halftone dot images, etc., and then developed into an original image by developing with an aqueous alkaline developer. gives a negative relief image.
露光に使用される光源としてはカーボンアーク灯、水銀
灯、キセノンランプ、メタルハライドランプ、ストロボ
、紫外線、レーザー光線などが挙げられる。Light sources used for exposure include carbon arc lamps, mercury lamps, xenon lamps, metal halide lamps, strobes, ultraviolet rays, laser beams, and the like.
上記感光性組成物に好適に使用される現像液としては、
ベンジルアルコール、2−フェノキシエタノール、2−
ブトキシェタノールのような有機溶媒を小量含むアルカ
リ水溶液であり、例えば米国特許第3.475.171
号及び同3.615.480号公報に記載されているも
のを挙げることができる。更に、特開昭50−2660
1号、同57−192951号、同59−84241号
、特公昭56−39464号、同56−42860号の
各公報に記載されている現像液も優れている。As the developer suitably used for the above photosensitive composition,
Benzyl alcohol, 2-phenoxyethanol, 2-
It is an alkaline aqueous solution containing a small amount of an organic solvent such as butoxethanol, for example, in U.S. Pat. No. 3,475,171.
No. 3,615,480. Furthermore, JP-A-50-2660
The developing solutions described in Japanese Patent Publications No. 1, No. 57-192951, No. 59-84241, Japanese Patent Publication No. 56-39464, and Japanese Patent Publication No. 56-42860 are also excellent.
本発明の光重合性組成物は、画像露光時の感度に優れ、
短い露光時間でも十分な画像が得られる。The photopolymerizable composition of the present invention has excellent sensitivity during image exposure,
Sufficient images can be obtained even with short exposure times.
従がって、作業効率等が著しく改善され、また、レーザ
ー光線等による走査露光に対しても十分な感度を有する
。Therefore, working efficiency etc. are significantly improved, and the film has sufficient sensitivity to scanning exposure using laser beams and the like.
以下、本発明を、合成例、実施例により更に詳細に説明
するが、本発明の内容がこれにより限定されるものでは
ない。Hereinafter, the present invention will be explained in more detail with reference to synthesis examples and examples, but the content of the present invention is not limited thereto.
合成例1
撹拌機、冷却管を備えた11フラスコに、2−ヒドロキ
シエチルメタクリレート25.38 g(0,195m
ole ’) 、n−ブチルメタクリレート4.27g
(0,03mole ) 、xチL/7グリコールジ
メタクリレー)2.97g (0,015mole )
、コハク酸水素(2−メタクリロイルオキシ)エチル1
3.81g (0,06mole )、ドデシル硫酸ナ
トリウム4.63 g及び水750−を入れ、窒素気流
下50℃に加熱した。この混合溶液に過硫酸カリウム0
.58 g及びチオ硫酸ナトリウム5水和物0、54
gを加え、5時間撹拌した。反応終了後、塩析、遠心分
離した後、減圧下で乾燥して、43gの白色粉末を得た
。Synthesis Example 1 25.38 g (0,195 m
ole'), n-butyl methacrylate 4.27g
(0,03mole), xchi L/7 glycol dimethacrylate) 2.97g (0,015mole)
, ethyl hydrogen succinate (2-methacryloyloxy) 1
3.81 g (0.06 mole), 4.63 g of sodium dodecyl sulfate, and 750 g of water were added and heated to 50° C. under a nitrogen stream. This mixed solution contains 0 potassium persulfate.
.. 58 g and sodium thiosulfate pentahydrate 0,54
g and stirred for 5 hours. After the reaction was completed, the mixture was salted out, centrifuged, and dried under reduced pressure to obtain 43 g of white powder.
得られた白色粉末10g及びピリジン100m1!を撹
拌機、冷却管を備えた200m1!フラスコに入れ、氷
水浴下撹拌した。この混合物にメタクリル酸クロリド1
0gをゆっくりと加え、そのまま氷水浴下30分間撹拌
した。更に、50℃加熱し、2時間撹拌した。10 g of white powder and 100 ml of pyridine! 200m1 with a stirrer and cooling pipe! The mixture was placed in a flask and stirred in an ice water bath. Add 1 part of methacrylic acid chloride to this mixture.
0 g was slowly added, and the mixture was stirred for 30 minutes in an ice water bath. Further, the mixture was heated to 50°C and stirred for 2 hours.
反応終了後、この混合物を氷水11に撹拌下投入し、塩
酸にて酸性とした。析出物をろ集し、塩化ナトリウム水
溶液でよく洗浄し、減圧下乾燥することにより、9gの
白色粉末(本発明のミクロゲル(p)〉を得た。After the reaction was completed, the mixture was poured into ice water 11 with stirring and made acidic with hydrochloric acid. The precipitate was collected by filtration, thoroughly washed with an aqueous sodium chloride solution, and dried under reduced pressure to obtain 9 g of white powder (microgel (p) of the present invention).
粉末粒子の球状の形を顕微鏡で確認した。The spherical shape of the powder particles was confirmed under a microscope.
合成例2〜11
合成例1と同様にして、下記第1表に示す本発明のミク
ロゲル(q)〜(2〉を合成した。Synthesis Examples 2 to 11 In the same manner as Synthesis Example 1, microgels (q) to (2) of the present invention shown in Table 1 below were synthesized.
実施例
特開昭56−28893号公報に開示された方法により
基板を作製した。即ち、厚さ0.24mmのアルミニウ
ム板をナイロンブラシと400メツシユのパミストンの
水懸濁液を用い、その表面を砂目室てした後、よく水で
洗浄した。次いで10%水酸化ナトリウムに70℃で6
0秒間浸漬してエツチングした後、流水で水洗後20%
H,N Oxで中和洗浄し、水洗した。これを陽極特電
圧が12.7■で陽極特電気量に対する陰極特電気量の
比が0.8の条件下で正弦波の交番波形電流を用いて1
%硝酸水溶液中で160ク一ロン/dm2の陽極特電気
量で電解粗面化処理を行った。このときの表面粗さを測
定したところ、0.6μ(Ra表示)であった。引き続
いて30%の硫酸中に浸漬し55℃で2分間デスマット
した後、20%硫酸中、電流密度2A/dm2において
厚さが2.7g/m’になるように2分間陽極酸化処理
した。その後70℃の珪酸ソーダ2.5%水溶液に1分
間浸漬後水洗乾燥した。このようにして準備された基板
の上に、次の感光液CVI−1〜(V)−11を塗布し
た。EXAMPLE A substrate was prepared by the method disclosed in Japanese Patent Application Laid-Open No. 56-28893. That is, the surface of an aluminum plate having a thickness of 0.24 mm was gritted using a nylon brush and a 400 mesh water suspension of pumice stone, and then thoroughly washed with water. Then add 6% to 10% sodium hydroxide at 70°C.
After immersion for 0 seconds and etching, after washing with running water, 20%
Neutralization washing was performed with H, NOx, and washing was performed with water. This was calculated by using a sinusoidal alternating waveform current under the conditions that the anode special voltage was 12.7μ and the ratio of the cathode special electricity amount to the anode special electricity amount was 0.8.
% nitric acid aqueous solution with an anode special electricity amount of 160 corons/dm2. When the surface roughness at this time was measured, it was 0.6μ (expressed as Ra). Subsequently, it was immersed in 30% sulfuric acid and desmutted at 55°C for 2 minutes, and then anodized in 20% sulfuric acid at a current density of 2 A/dm2 for 2 minutes to a thickness of 2.7 g/m'. Thereafter, it was immersed in a 2.5% sodium silicate aqueous solution at 70° C. for 1 minute, then washed with water and dried. The following photosensitive liquids CVI-1 to (V)-11 were applied onto the thus prepared substrate.
なお、感光液CV)−1〜(V)−11に用いた本発明
のミクロゲルを第2表に示す。Table 2 shows the microgels of the present invention used in photosensitive solutions CV)-1 to (V)-11.
感光液〔v〕
これらを溶解及び分散した後、回転塗布機を用いて約2
00r、p、m、で、基板上に回転塗布した。Photosensitive liquid [v] After dissolving and dispersing these, use a spin coating machine to coat approximately 2
00r, p, m, and was spin-coated onto the substrate.
ついで100℃で2分間乾燥させた。乾燥塗膜重量は3
g/mXであった。次にポリビニルアルコール(粘度は
4%溶液(20℃)によるヘプラー法で5.3±0.5
(cp)、ケン化度86.5〜89.0モル%、重合度
1000以下)の3重量%の水溶液を上記感光層の表面
に約18 Qr、plm、で回転塗布した。乾燥塗膜重
量は1.5g/m″であった。It was then dried at 100°C for 2 minutes. Dry coating weight is 3
g/mX. Next, polyvinyl alcohol (viscosity was 5.3 ± 0.5 by Hepler method using a 4% solution (20°C))
(cp), degree of saponification 86.5 to 89.0 mol%, degree of polymerization 1000 or less) was spin-coated onto the surface of the photosensitive layer at about 18 Qr, plm. The dry coating weight was 1.5 g/m''.
次に比較例として、上記感光液中の本発明のミクロゲル
の代わりに、特開昭59−46643号明細書中の実施
例に記載のアリルメタクリレート/メタクリル酸共重合
体(モル比85/15)を用いた感光液(W)を同様に
塗布し、更にポリビニルアルコールの層を同様に設けた
。Next, as a comparative example, in place of the microgel of the present invention in the photosensitive solution, allyl methacrylate/methacrylic acid copolymer (molar ratio 85/15) described in Examples in JP-A-59-46643 was used. A photosensitive liquid (W) using the same method was applied in the same manner, and a layer of polyvinyl alcohol was further provided in the same manner.
感光液CVE−1〜i’V)−11及び(W)を用いて
得られた各感光性平版印刷版(V)−1〜(V〕−11
及び〔W〕の上に富士写真フィルム■製グレイスケール
タブレットを重ね、米国バーキーテクニカル社製バーキ
ープリンター(アイツーアダルックス2KW)で露光し
、次に示す現像液にて室温で50秒間浸漬した後、脱脂
綿で表面を軽くこすり、未露光部を除去した。Each photosensitive lithographic printing plate (V)-1 to (V]-11 obtained using photosensitive liquids CVE-1 to i'V)-11 and (W)
A gray scale tablet made by Fuji Photo Film ■ was placed on top of and [W], exposed with a Berkey printer (I2 Adalux 2KW) made by Berkey Technical Co., USA, and immersed in the following developer for 50 seconds at room temperature, The surface was lightly rubbed with absorbent cotton to remove the unexposed areas.
得られた平版印刷版の露光量に対する感度を、目視にて
、ベタ部の段数より読み取った。その結果を第2表に示
す。本発明のミクロゲルを用いた感光性平版印刷版1’
V)−1〜I”V)−11は、比較例の感光性平版印刷
版〔W〕よりいずれも段数が大きく、高感度であった。The sensitivity of the obtained lithographic printing plate to the exposure amount was visually read from the number of platens in the solid area. The results are shown in Table 2. Photosensitive planographic printing plate 1' using the microgel of the present invention
V)-1 to I''V)-11 all had a larger number of plates and higher sensitivity than the photosensitive lithographic printing plate [W] of the comparative example.
第2表 手続補正書Table 2 Procedural amendment
Claims (1)
4以下の酸基を有するミクロゲルと、光重合開始剤とを
含むことを特徴とする光重合性組成物。 ▲数式、化学式、表等があります▼・・・( I ) (ただし、式中Rは−H又は−CH_3を示す。)[Claims] A functional group represented by the following general formula (I) and a pKa value of 1
A photopolymerizable composition comprising a microgel having 4 or less acid groups and a photopolymerization initiator. ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(I) (However, R in the formula represents -H or -CH_3.)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1212699A JPH0375750A (en) | 1989-08-18 | 1989-08-18 | Photopolymerizable composition |
US07/561,926 US5171655A (en) | 1989-08-03 | 1990-08-02 | Photohardenable light-sensitive composition |
DE4024710A DE4024710A1 (en) | 1989-08-03 | 1990-08-03 | Light-curable photosensitive compsn. for printing plates, etc. - contains microgel with N-substd. maleimide gps. or acryloyl gps. or with olefinic gps. and acid gps. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1212699A JPH0375750A (en) | 1989-08-18 | 1989-08-18 | Photopolymerizable composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0375750A true JPH0375750A (en) | 1991-03-29 |
Family
ID=16626964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1212699A Pending JPH0375750A (en) | 1989-08-03 | 1989-08-18 | Photopolymerizable composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0375750A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5894756A (en) * | 1996-04-02 | 1999-04-20 | Mitsuba Corporation | Governor system for engine starter mechanism |
KR100532162B1 (en) * | 2002-03-13 | 2005-11-29 | 주식회사 신화에프씨 | Photoresist resins composition for gravure printing |
JP2008132791A (en) * | 2000-01-14 | 2008-06-12 | Fujifilm Corp | Make-up method of lithographic printing plate |
JP2008171010A (en) * | 2008-01-28 | 2008-07-24 | Fujifilm Corp | Method for producing lithographic printing plate |
-
1989
- 1989-08-18 JP JP1212699A patent/JPH0375750A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5894756A (en) * | 1996-04-02 | 1999-04-20 | Mitsuba Corporation | Governor system for engine starter mechanism |
JP2008132791A (en) * | 2000-01-14 | 2008-06-12 | Fujifilm Corp | Make-up method of lithographic printing plate |
KR100532162B1 (en) * | 2002-03-13 | 2005-11-29 | 주식회사 신화에프씨 | Photoresist resins composition for gravure printing |
JP2008171010A (en) * | 2008-01-28 | 2008-07-24 | Fujifilm Corp | Method for producing lithographic printing plate |
JP4629741B2 (en) * | 2008-01-28 | 2011-02-09 | 富士フイルム株式会社 | Preparation method of lithographic printing plate |
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