JPH0375557U - - Google Patents

Info

Publication number
JPH0375557U
JPH0375557U JP13754389U JP13754389U JPH0375557U JP H0375557 U JPH0375557 U JP H0375557U JP 13754389 U JP13754389 U JP 13754389U JP 13754389 U JP13754389 U JP 13754389U JP H0375557 U JPH0375557 U JP H0375557U
Authority
JP
Japan
Prior art keywords
wiring layer
substrate
insulating substrate
substrate via
sectional area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13754389U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13754389U priority Critical patent/JPH0375557U/ja
Publication of JPH0375557U publication Critical patent/JPH0375557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP13754389U 1989-11-27 1989-11-27 Pending JPH0375557U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13754389U JPH0375557U (enrdf_load_stackoverflow) 1989-11-27 1989-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13754389U JPH0375557U (enrdf_load_stackoverflow) 1989-11-27 1989-11-27

Publications (1)

Publication Number Publication Date
JPH0375557U true JPH0375557U (enrdf_load_stackoverflow) 1991-07-29

Family

ID=31684695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13754389U Pending JPH0375557U (enrdf_load_stackoverflow) 1989-11-27 1989-11-27

Country Status (1)

Country Link
JP (1) JPH0375557U (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007861A1 (ja) * 2005-07-07 2007-01-18 Ibiden Co., Ltd. 多層プリント配線板
KR100900671B1 (ko) * 2007-11-06 2009-06-01 삼성전기주식회사 다층 배선 기판에 사용되는 도전성 비아 형성 방법
JP2010034258A (ja) * 2008-07-29 2010-02-12 Kyocera Corp 配線基板、実装構造体及び配線基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007861A1 (ja) * 2005-07-07 2007-01-18 Ibiden Co., Ltd. 多層プリント配線板
KR100900671B1 (ko) * 2007-11-06 2009-06-01 삼성전기주식회사 다층 배선 기판에 사용되는 도전성 비아 형성 방법
JP2010034258A (ja) * 2008-07-29 2010-02-12 Kyocera Corp 配線基板、実装構造体及び配線基板の製造方法

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