JPH0375549U - - Google Patents
Info
- Publication number
- JPH0375549U JPH0375549U JP13570989U JP13570989U JPH0375549U JP H0375549 U JPH0375549 U JP H0375549U JP 13570989 U JP13570989 U JP 13570989U JP 13570989 U JP13570989 U JP 13570989U JP H0375549 U JPH0375549 U JP H0375549U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- component module
- metal case
- unit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13570989U JPH0375549U (xx) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13570989U JPH0375549U (xx) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375549U true JPH0375549U (xx) | 1991-07-29 |
Family
ID=31682957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13570989U Pending JPH0375549U (xx) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375549U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014033119A (ja) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | 半導体装置 |
-
1989
- 1989-11-22 JP JP13570989U patent/JPH0375549U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014033119A (ja) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | 半導体装置 |