JPH037475B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of joining amorphous metals together to increase the thickness of the amorphous metal, thereby manufacturing a thick-walled member.

Currently, there is no technology to manufacture amorphous metals only in the form of thin wires or thin plates, and the emergence of thick wires or thick plates is extremely important in expanding their uses. However, at present, this technology has not been developed, and as a transitional technology, there are bonding technologies that overlap thin amorphous metals to make them thicker, or overlap amorphous metals and other metals to make them thicker. is necessary.

When conventionally known general bonding techniques are applied to such bonding, the following problems arise.

Generally, when joining metals, there are methods such as welding, brazing, adhesion, and mechanical joining, but in normal welding and brazing, the workpiece is heated over a relatively wide area, and the heated part is cooled. It takes time to heat up the process, and recrystallization progresses in the heated part, so even if you try to weld or braze amorphous amorphous metal, the welded part will recrystallize, and the purpose of using amorphous metal will fade or disappear. do.

It is also possible to thicken amorphous amorphous metal sheets by overlapping them with adhesive, but in this case, the adhesive is generally a polymeric material and its performance deteriorates at around 100°C. There are restrictions on the use of metals. Moreover, when adhering, it takes time and effort to extremely clean and activate the surface. Furthermore, it is extremely difficult to make the thickness of the product highly accurate due to curing shrinkage of the adhesive and other factors.

As for the mechanical connection, for example, bolt connection can be considered, but in this case, there are problems such as a decrease in strength due to the bolt hole and the unavoidable protrusion of the bolt head.

The present invention aims to provide a method for manufacturing a thick-walled amorphous metal member that solves these problems, and involves bringing thin plates of amorphous metal into contact with each other by overlapping or butting each other, and applying pressure to the joint portion. By scanning a narrow electron beam or laser beam with a high energy density sufficient to bond the two while moving at relatively high speed, the contact area is instantaneously heated and then rapidly cooled by heat diffusion. The method is characterized in that a plurality of amorphous metal thin plates are bonded while maintaining their amorphous states, thereby increasing the thickness of the amorphous metal.

To explain the present invention in more detail, the workpieces to be joined according to the present invention include thin plates of amorphous metal or thin plates of amorphous metal and other metal plates that can be melted and bonded to the thin plates of amorphous metal. Two or more sheets are brought into contact by overlapping or butting, and the contact portions are bonded by instantaneous heating and melting using a narrow electron beam or laser beam.

The electron beam or laser beam needs to have a high enough energy density to instantaneously heat and melt the workpiece when it scans at high speed, and at the same time It needs to be thin enough to allow rapid cooling by heat diffusion while maintaining its amorphous state.

When bonding amorphous amorphous metal, etc. using an electron beam or laser beam, the electron beam, etc. is moved at high speed relative to the surface of the amorphous metal, etc., which is made by stacking two or many amorphous metals. scanning or scanning along the parts of amorphous metals etc. that abut against each other, thereby instantaneously rapidly heating the contact parts where the amorphous metals etc. are brought into contact by overlapping or butting them, and also rapidly cools them afterwards. The amorphous metal is locally fused and joined while maintaining its amorphous state.

When bonding by such a method, in order to bond the periphery of a portion through which an electron beam or the like has passed, it is necessary to pass the electron beam or the like again after a sufficient time has elapsed to cool the amorphous state.

Furthermore, when scanning with an electron beam or the like, one method is to perform scanning while irradiating the electron beam intermittently, rather than continuously, in order to cool the area sufficiently rapidly.

Furthermore, in order to prevent air from entering between the stacked metals, it is also possible to carry out the work in a vacuum. In this case, in order to make the stacked metals stick together, the thin metal plates are welded all over in a vacuum, and then the thin metal plates are brought into close contact with each other in the atmosphere by the atmospheric pressure, and each part is melted and joined all over. good. It is also possible to cool the lower surface of the metal sheet to aid in rapid cooling of the heated portion. In addition,
If these operations are performed especially in the shade of outer space, a vacuum state can always be easily obtained and no cooling medium is required.

When bonding is performed using an electron beam, the direction of scanning can be arbitrarily changed by changing the electric field at high speed, so parts of the thin metal plate can be sequentially bonded as needed. However, for laser light, it is necessary to scan the metal thin plate vertically and horizontally or randomly by arranging multiple multifaceted or curved mirrors in different directions and appropriately combining the rotation speed and phase. .

On the other hand, there are various ways to move a thin metal plate at high speed, such as wrapping it around a drum and rotating it at high speed, placing it on a rotating disk, or sending it with a rolling roller.

Note that when two or many thin metal plates are overlapped and scanned vertically and horizontally or randomly with an electron beam or laser beam, if the scanning density is coarse, there will be areas where the metal thin plates are not joined. In relatively many cases, this is not a problem depending on the use of the thin metal sheet, and in that case it does not pose a particular problem.

Next, an example of the configuration of a scanning device for scanning with laser light will be described.

In the scanning device shown in FIG. 1, 10 is a laser light source, 11 and 12 are multifaceted rotating mirrors, 13 is a fixed mirror, 14 is a workpiece of superimposed metal thin plates, and 15 is each rotating mirror 11, 12. It shows an energy absorption mechanism that operates in accordance with the phase.

In this scanning device, a laser beam projected from a laser light source 10 is reflected by rotating mirrors 11 and 12 and a fixed mirror 13 and irradiated onto a thin metal plate 14. If it is rotated at high speed, the laser beam will move on the thin metal plate 14 from A→
Scan B, C→D, E→F, and so on. ,,
An appropriate interval is provided between EF, ..., and scanning is performed sequentially between them after sufficient cooling time as described above. All you have to do is tilt it at low speed. Further, scanning from a to b, c to d, and e to f can be performed by rotating the rotating mirror 11 at a higher speed than the rotating mirror 12.

The energy absorption mechanism 15 is intended to prevent the laser beam from irradiating parts other than the thin metal plate 14, and must be operated in accordance with the phase of the rotating mirrors 11 and 12. If the entire device is surrounded by a shielding plate or an energy absorbing plate, the configuration becomes significantly simpler.

Figure 2 shows A→B, C→D,... in Figure 1.
This figure shows a scanning device that individually performs scanning in the direction of , and scanning in the directions of a→b, c→d, . . . , and 20 is a laser light source;
22' is a rotating mirror, 23 and 23' are fixed mirrors, 24 is a thin metal plate, 25 is an energy absorption mechanism, and 26 is a mirror for switching the laser beam to the rotating mirror 21 or 21' side.

This device is advantageous over the scanning device of FIG. 1 in that the rotational speed control of each rotating mirror is extremely simplified.

According to the method of the present invention described in detail above, the problems that arise when conventional general bonding techniques are applied to amorphous metals are resolved, and thin amorphous metal plates can be bonded while maintaining the amorphous state. By increasing the thickness, it is possible to manufacture a thick-walled member made of amorphous metal.

[Brief explanation of the drawing]

FIGS. 1 and 2 are a perspective view and a side view of a laser beam scanning device used to implement the present invention. 14, 24...Thin metal plate.

Claims (1)

[Claims] 1. By bringing thin plates of amorphous metal into contact with each other by overlapping or butting them together, and scanning the joint portion with a thin electron beam or laser beam with a high energy density sufficient to bond the two, while moving at a relatively high speed, The contact area is instantaneously heated rapidly and then rapidly cooled by heat diffusion, thereby joining multiple thin amorphous metal plates while maintaining their amorphous state, thereby increasing the thickness of the amorphous metal. A method for producing a thick-walled amorphous metal member.