JPH0374168A - Liquid cooled semiconductor converter - Google Patents
Liquid cooled semiconductor converterInfo
- Publication number
- JPH0374168A JPH0374168A JP1210463A JP21046389A JPH0374168A JP H0374168 A JPH0374168 A JP H0374168A JP 1210463 A JP1210463 A JP 1210463A JP 21046389 A JP21046389 A JP 21046389A JP H0374168 A JPH0374168 A JP H0374168A
- Authority
- JP
- Japan
- Prior art keywords
- cubicle
- case
- liquid
- semiconductor
- conversion device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 title claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000002347 injection Methods 0.000 claims abstract description 7
- 239000007924 injection Substances 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims description 25
- 238000011084 recovery Methods 0.000 abstract description 3
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Power Conversion In General (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、パワートランジスタ等の半導体素子を用いた
高周波スイッチング特殊電源装置などの半導体変換装置
で、液冷却式の冷却体を備えた半導体変換装置に関する
。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a semiconductor conversion device such as a high-frequency switching special power supply device using semiconductor elements such as power transistors, and a semiconductor conversion device equipped with a liquid-cooled cooling body. Regarding equipment.
従来、液体冷却方式の半導体変換装置をキユービクル内
に収納するには、第４図に示すように蛇行管による冷媒
配管１２を配した冷却体４を前記キユービクル１内に固
定しており、半導体素子３による半導体変換装置２はこ
の固定された冷却体４に取付けられている。そして、交
流側あるいは直流側のケーブル５は前記半導体素子３の
主端子上に設けた端子７に直接接続される。Conventionally, in order to house a liquid-cooled semiconductor conversion device in a cubicle, a cooling body 4 having a meandering refrigerant pipe 12 arranged therein is fixed in the cubicle 1, as shown in FIG. A semiconductor conversion device 2 according to 3 is attached to this fixed cooling body 4. The AC or DC side cable 5 is directly connected to a terminal 7 provided on the main terminal of the semiconductor element 3.
また、前記冷媒配管１２の端部の液体注入出口には液体
ホース６の端を直接嵌合接続し、かつ上から締付バンド
で固定する。Further, the end of the liquid hose 6 is directly fitted and connected to the liquid injection outlet at the end of the refrigerant pipe 12, and fixed with a tightening band from above.
このような液体冷却方式の半導体変換装置のキユービク
ル内への収納構造では、半導体変換装置が故障した際、
例えば半導体素子の交換を要する場合には、狭いキユー
ビクル内で前記のケーブルを外し、故障のない正常な部
分をすべてキユービクルにマウントした状態のままで素
子の交換作業を行わなければならず、故障の復旧に時間
がかかりメンテナンス上問題があった。In such a liquid-cooled semiconductor conversion device storage structure in a cubicle, when the semiconductor conversion device breaks down,
For example, if a semiconductor device needs to be replaced, the cable must be removed inside a small cubicle, and the device must be replaced with all non-faulty parts mounted in the cubicle. It took a long time to recover and there were maintenance problems.
本発明の目的は前記従来例の不都合を解消し、必要に応
じてキユービクルから外へ自由に引き出して修理ができ
る液冷却式半導体変換装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the disadvantages of the conventional example and to provide a liquid-cooled semiconductor conversion device that can be freely pulled out of the cubicle and repaired if necessary.
（課題を解決するための手段〕
本発明は前記目的を達成するため、液体冷却方式の冷却
体を備えた半導体変換装置をケースに収め、該ケースを
キユービクル内に案内装置を介して出入れ自在に収納す
るとともに、前記半導体変換装置を構成する半導体素子
の主端子に連結される接続用プラグをこのケース外側に
突設し、また、この接続用プラグに接続可能で交流側あ
るいは直流側の母線に連結される接続用ソケットをキユ
ービクル内側に設け、ケース外側に導出する冷却体の液
体注入出口はキユービクル内の液体ホースと着脱自在な
口金としたことを要旨とするものである。(Means for Solving the Problems) In order to achieve the above object, the present invention accommodates a semiconductor conversion device equipped with a liquid cooling type cooling body in a case, and allows the case to be freely taken in and out of a cubicle via a guide device. A connection plug connected to the main terminals of the semiconductor elements constituting the semiconductor conversion device is provided protruding from the outside of the case, and a busbar on the AC side or DC side that can be connected to this connection plug is provided. The gist is that a connection socket connected to the cubicle is provided inside the cubicle, and the liquid injection outlet of the cooling body led out to the outside of the case is a cap that is detachable from the liquid hose inside the cubicle.
本発明によれば、ケース側の半導体素子の主端子に連結
される接続用プラグとキユービクル側の交流側あるいは
直流側の母線に連結される接続用ソケットは着脱自在で
あり、ケース側の冷却体の液体注入出口とキユービクル
側の液体ホースとは口金構造により着脱自在である。According to the present invention, the connection plug connected to the main terminal of the semiconductor element on the case side and the connection socket connected to the AC side or DC side bus bar on the cubicle side are detachable, and the cooling body on the case side The liquid injection outlet and the liquid hose on the cubicle side are removable due to the cap structure.
従って、この口金を外し、案内装置を介してそのままケ
ースをキユービクル外へ引き出すことができ、キユービ
クル外でケース内の半導体素子の交換等を行うことがで
きる。Therefore, the cap can be removed and the case can be directly pulled out of the cubicle via the guide device, and the semiconductor elements inside the case can be replaced outside the cubicle.
以下、図面について本発明の実施例を詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明の液冷却式半導体変換装置の１実施例を
示す一部切欠いた斜視図、第３図は本発明の半導体変換
装置を収納したキユービクルの一部切欠いた斜視図で、
図中１０は複数個の半導体素子３により構成された変換
回路で、これと保護回路１１などの付属品で半導体変換
装置を構成する。FIG. 1 is a partially cutaway perspective view showing one embodiment of the liquid-cooled semiconductor converter of the present invention, and FIG. 3 is a partially cutaway perspective view of a cubicle housing the semiconductor converter of the present invention.
In the figure, reference numeral 10 denotes a conversion circuit made up of a plurality of semiconductor elements 3, and this and accessories such as a protection circuit 11 constitute a semiconductor conversion device.
これら変換回路１０や保護回路１１は冷媒配管１２を有
する冷却体４に取付けられる。図中１９は制御回路コネ
クターである。These conversion circuit 10 and protection circuit 11 are attached to a cooling body 4 having a refrigerant pipe 12. In the figure, 19 is a control circuit connector.
さらに、該変換回路１０、保護回路１１及び冷却体４は
ケース１３内に収め、かつ変換回路１０を構成する半導
体素子３の主端子に連結される接続用プラグ１４をこの
ケースＩ３の背面もしくは側面に突設した。Furthermore, the conversion circuit 10, the protection circuit 11, and the cooling body 4 are housed in a case 13, and a connection plug 14 connected to the main terminal of the semiconductor element 3 constituting the conversion circuit 10 is placed on the back or side surface of the case I3. It was built protrudingly.
また、冷媒配管１２の端部である液体注入出口もこのケ
ース１３外へ顕出させここを口金１６とする。Further, a liquid injection port, which is an end of the refrigerant pipe 12, is also exposed to the outside of the case 13, and is used as a cap 16.
キユービクル１内にこのケース１３の案内装置として上
部ガイド１７、下部ガイド１８を設け、これらガイド１
７．１８を介してケース１３をキユービクル外へ出入れ
自在なものとする。このガイド１７．１８としては、ロ
ーラを有する引き出し形式のものなど種々考えられる。An upper guide 17 and a lower guide 18 are provided in the cubicle 1 as guide devices for the case 13, and these guides 1
7. The case 13 can be moved in and out of the cubicle via the tube 18. Various types of guides 17, 18 are conceivable, such as a pull-out type having rollers.
一方、第２図に示すようにキユービクルｌ内に前記接続
用プラグ１４に接続可能な接続用ソケット１５を設け、
この接続用ソケット１５を交流側あるいは直流側の母線
に連結させた。On the other hand, as shown in FIG. 2, a connection socket 15 connectable to the connection plug 14 is provided in the cubicle l,
This connection socket 15 was connected to the AC side or DC side bus bar.
また、前記口金１６はキユービクル１内の配管２０から
分岐する液体ホース６の口金６ａと着脱自在に結合する
ものである。Further, the cap 16 is detachably connected to a cap 6a of a liquid hose 6 branching from a pipe 20 in the cubicle 1.
次に使用法について説明すると、口金１６を外し、上部
ガイド１７、下部ガイド１８にそってケース１３を引き
出すようにすれば、ケース１３は移動し、キユービクル
１外へ取出せる。その際、接続用プラグ１４は接続用ソ
ケット１５から自動的に外れる。Next, how to use it will be described. By removing the base 16 and pulling out the case 13 along the upper guide 17 and lower guide 18, the case 13 can be moved and taken out of the cubicle 1. At that time, the connection plug 14 is automatically removed from the connection socket 15.
このようにケース■３をキユービクル１外へ取出してか
ら、内部の変換回路１０の半導体素子３を交換したりそ
の他の修理、点検を行うことができる。After the case 3 is taken out of the cubicle 1 in this manner, the semiconductor element 3 of the internal conversion circuit 10 can be replaced or other repairs and inspections can be performed.
保守、点検が終えたならば、再度上部ガイド１７、下部
ガイド１８を介してケース１３をキユービクル１内へ戻
せば、接続用プラグ１４は接続用ソケット１５に自動的
に接続されるので、口金１６を液体ホース６に接続すれ
ばよい。When maintenance and inspection are completed, if the case 13 is returned to the cubicle 1 via the upper guide 17 and the lower guide 18, the connection plug 14 is automatically connected to the connection socket 15, so the base 16 can be connected to the liquid hose 6.
以上述べたように本発明の液冷却式半導体変換装置は、
キユービクル内に収容している半導体変換装置が故障し
た際、当該半導体変換装置を速やかに前記キユービクル
から引出し、例えば半導体素子の交換を外部で行うこと
ができるので、故障の復旧時間を大巾に短縮できるもの
であり、大巾な保守性向上が実現する。As described above, the liquid-cooled semiconductor conversion device of the present invention has
When a semiconductor conversion device housed in a cubicle breaks down, the semiconductor conversion device can be immediately pulled out of the cubicle and, for example, the semiconductor element can be replaced outside, which greatly shortens the recovery time from the failure. This will greatly improve maintainability.
さらに、従来と比較してｌキユービクル当たりの半導体
変換装置の収容個数も倍増するものである。Furthermore, the number of semiconductor conversion devices accommodated per cubicle is doubled compared to the conventional case.
第１図は本発明の液冷却式半導体変換装置の１実施例を
示す一部切欠いた斜視図、第２図は接続用プラグ、接続
用ソケット部分の側面図、第３図は本発明の半導体変換
装置を収納したキユービクルの一部切欠いた斜視図、第
４図は従来例を示す一部切欠いた斜視図である。
１・・・キユービクル ２・・・半導体変換装置３・・
・半導体素子 ４・・・冷却体５・・・ケーブル
６・・・液体ホース６ａ・・・口金 ７・・・
端子
１０・・・変換回路 １１・・・保護回路１２・・
・冷媒配管 １３・・・ケース１４・・・接続用プ
ラグ １５・−・接続用ソケット１６・・・口金
１８・・・下部ガイド
２０・・・配管FIG. 1 is a partially cutaway perspective view showing an embodiment of a liquid-cooled semiconductor converter according to the present invention, FIG. 2 is a side view of a connection plug and a connection socket, and FIG. 3 is a semiconductor device according to the present invention. FIG. 4 is a partially cutaway perspective view of a cubicle housing a conversion device, and FIG. 4 is a partially cutaway perspective view showing a conventional example. 1... Cubicle 2... Semiconductor conversion device 3...
・Semiconductor element 4... Cooling body 5... Cable
6... Liquid hose 6a... Cap 7...
Terminal 10... Conversion circuit 11... Protection circuit 12...
・Refrigerant piping 13... Case 14... Connection plug 15... Connection socket 16... Base 18... Lower guide 20... Piping
Claims (1)
スに収め、該ケースをキュービクル内に案内装置を介し
て出入れ自在に収納するとともに、前記半導体変換装置
を構成する半導体素子の主端子に連結される接続用プラ
グをこのケース外側に突設し、また、この接続用プラグ
に接続可能で交流側あるいは直流側の母線に連結される
接続用ソケットをキュービクル内側に設け、ケース外側
に導出する冷却体の液体注入出口はキュービクル内の液
体ホースと着脱自在な口金としたことを特徴とする液冷
却式半導体変換装置。A semiconductor conversion device equipped with a liquid cooling type cooling body is housed in a case, and the case is housed in a cubicle so as to be freely put in and taken out via a guide device, and connected to the main terminals of semiconductor elements constituting the semiconductor conversion device. A connecting plug protruding from the outside of the case is provided, and a connecting socket that can be connected to the connecting plug and connected to the AC side or DC side bus bar is installed inside the cubicle, and the cooling led out to the outside of the case. A liquid-cooled semiconductor conversion device characterized in that the liquid injection outlet of the body is a liquid hose inside the cubicle and a removable cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1210463A JPH0710164B2 (en) | 1989-08-14 | 1989-08-14 | Liquid cooled semiconductor converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1210463A JPH0710164B2 (en) | 1989-08-14 | 1989-08-14 | Liquid cooled semiconductor converter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0374168A true JPH0374168A (en) | 1991-03-28 |
| JPH0710164B2 JPH0710164B2 (en) | 1995-02-01 |
Family
ID=16589752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1210463A Expired - Fee Related JPH0710164B2 (en) | 1989-08-14 | 1989-08-14 | Liquid cooled semiconductor converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710164B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004096832A (en) * | 2002-08-29 | 2004-03-25 | Toshiba Corp | Liquid-cooled power convertor |
| JP2007006584A (en) * | 2005-06-22 | 2007-01-11 | Mitsubishi Electric Corp | Power converter |
| JP2008253056A (en) * | 2007-03-30 | 2008-10-16 | Denso Corp | Power conversion device |
-
1989
- 1989-08-14 JP JP1210463A patent/JPH0710164B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004096832A (en) * | 2002-08-29 | 2004-03-25 | Toshiba Corp | Liquid-cooled power convertor |
| JP2007006584A (en) * | 2005-06-22 | 2007-01-11 | Mitsubishi Electric Corp | Power converter |
| JP2008253056A (en) * | 2007-03-30 | 2008-10-16 | Denso Corp | Power conversion device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710164B2 (en) | 1995-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |