JPH037404Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a plating DC power supply device used during plating processing.

[Conventional technology]

Conventionally, when plating a large amount of materials to be plated, a large-capacity DC power supply was used to supply power to the plating electrodes in multiple plating tanks. There are times when we have to shift from plating to small-scale plating of a wide variety of products and small quantities. Doing so results in large losses and is extremely uneconomical.

[Problem that the invention attempts to solve]

Therefore, it may be possible to install a new small-capacity DC power supply, but this would require new installation space, and the existing large-capacity DC power supply would be idle, which would be uneconomical. be.

Therefore, the technical problem of this invention is to enable small-scale plating processing to be performed economically using the existing large-capacity DC power supply.

[Means for solving problems]

This invention was made with the above points in mind, and uses a large-capacity DC power supply and a plurality of chopper-type DC power sources using high-frequency switching of switching elements connected in parallel to both output terminals of the DC power supply. The present invention is a DC power supply device for laminating, which includes a DC converter and a plurality of plating tanks each having a plating electrode connected to an output terminal of each converter.

[Effect]

In addition, with this idea, the DC output of a large-capacity DC power supply is distributed to each plating load by each chopper type DC-DC converter, so that small-scale plating can be performed using an existing large-capacity DC power supply. Processing can be done economically.

At this time, since multiple chopper type DC-DC converters are used and the switching elements constituting each converter are subjected to high frequency switching, the loss in each converter can be reduced compared to a DC regulator, etc., and the operating efficiency of the power supply can be improved. can be improved.

〔Example〕

Next, this invention will be explained in detail with reference to drawings showing one embodiment thereof.

First, in Fig. 1, 1 is a large-capacity DC power supply;
21, 22, 23, . . . , 2N are chopper-type first, second, and
3rd,..., Nth DC-DC converters (hereinafter referred to as 1st to Nth converters), 31, 32, 33,..., 3N
These are first, second, third, ..., N-th plating tanks into which the plating metal salt solution is injected, and each of the conversion units 21 to 2
Plating electrodes made of a plating metal and a plating metal immersed in a solution are connected to both output terminals of the N.

Next, in FIG. 2 showing the detailed configuration of each conversion unit 21 to 2N, 1a and 1b are the positive and negative output terminals of the power source 1, and 4 is a first smoothing reactor whose one end is connected to the positive output terminal 1a. , 5 is a first smoothing capacitor whose both ends are connected to the other end of the first reactor 4 and the negative output terminal 1b, and 6 is a first smoothing capacitor whose drain is connected to the positive output terminal 1a and whose gate is connected to a gate control circuit to be described later. A first chopper section consisting of a plurality of FETs 6a, 6b, . . . as switching elements, and a second chopper section 7, each having a drain connected to the positive output terminal 1a and a gate connected to a gate control circuit described later. It is composed of a plurality of FETs 7a, 7b, . . . as elements.

8 is each FET 6a with one end having both tipper portions 6 and 7,
A second smoothing reactor is connected to the sources of 6b, ..., 7a, 7b, ..., a second smoothing capacitor 9 has both ends connected to the other end of the second reactor 8 and the negative output terminal 1b, and 10 is an anode. , a flywheel diode whose cathode is connected to the negative output terminal 1b and one end of the second reactor 8, 11a, 11
12 is inserted between both negative output terminals 1b and 11b to detect the plating current, that is, the load current. a current detector that outputs a detection signal according to the current;
is a gate control circuit to which the detection signal is input, and FETs 6a, 6b,
...and 7a, 7b, ... output a high frequency gate control signal of about 50kHz to the gates of each FET6.
a, . . . , 7a . is configured.

In addition, both chopper parts 6 of each conversion part 21-2N,
It is assumed that the number of FETs 7 is selected depending on the magnitude of the load current.

Then, the output current of the power supply 1 is
When input to N, the output of the power supply 1 is smoothed by the first reactor 4 and first capacitor 5 of each conversion section 21 to 2N, and the output of the power supply 1 is smoothed by the first reactor 4 and first capacitor 5 of each conversion section 21 to 2N. FET6
a, ... and each FET7a of the second chopper section 7,
... are turned on and off alternately as shown in FIG. 3a and b, and each of the first chopper parts 6 in the on state
FET6a,... or each FET of the second chopper section 7
The smoothed output current of the power source 1 flows through the second reactor 8 through the second reactor 8 and the second capacitor 9, and is further smoothed by the second reactor 8 and the second capacitor 9, and the output of the power source 1 is distributed by each converter 21 to 2N. A predetermined load current is supplied to each plating electrode of each plating tank 31 to 3N, and each plating tank 31 to
At 3N, plating processing of the plated object is performed.

At this time, based on the load current detected by the detector 12, the gate control circuit 13 controls the pulse width of both chopper sections 6 and 7, and the load current is controlled to be a constant current at a predetermined value.

In addition, each FET6a of both tipper portions 6 and 7,
By alternately turning on and off FETs 6a, 7a, . . . , even if the switching frequency of each FET 6a, 7a, . . . is increased, loss is prevented from increasing.

Furthermore, each FET 6a of both tipper portions 6, 7,
. . , 7a, . . . may be turned on and off by the same gate control signal from the gate control circuit 13 with shortened off periods, as shown in FIG.

In the above embodiment, a case has been described in which constant current control is performed so that the load current from each conversion unit 21 to 2N to the load is constant. However, even if constant voltage control is performed, or each conversion unit 21 ~2N
This idea can be implemented in the same way even if the output voltage is controlled to vary according to the input voltage of the output voltage.

Further, the configuration of each conversion section 21 to 2N is not limited to the above-mentioned configuration.

[Effect of idea]

As described above, according to the DC power supply device for plating of this invention, using the existing large capacity DC power supply 1,
It is possible to perform small-scale plating processing and is very economical.

Furthermore, since the chopper-type conversion sections 21 to 2N are used by high-frequency switching of FETs, the loss in each conversion section 21 to 2N can be reduced, which is very economical and improves the operating efficiency of the power source 1. be able to.

[Brief explanation of drawings]

The drawing shows one of the DC power supply devices for plating of this invention.
An embodiment is shown in which FIG. 1 is a block diagram, FIG. 2 is a partial detailed wiring diagram, and FIGS. 3a, 3b, and 4 are operation explanatory diagrams, respectively. 1...Large capacity DC power supply, 21~2N...Conversion section,
31~3N...Metting tank, 6,7...Chiyotsupa part.

Claims (1)

[Scope of utility model registration request] A large-capacity DC power supply, a plurality of chopper-type DC-DC converters using high-frequency switching of switching elements connected in parallel to both output terminals of the DC power supply, and plating to the output terminals of each of the converters. A DC power supply device for plating equipped with multiple plating tanks to which electrodes are connected.