JPH0373597A - Device for making temperature of electronic apparatus uniform - Google Patents

Abstract

PURPOSE:To increase thermal conductivity to a plane direction, to diffuse temperature of high heat generating component having a spot heat generation and to make the temperature of an electronic apparatus uniform by providing a function of a heat pipe in a bottom board for placing the apparatus. CONSTITUTION:A hollow part 5 is formed in a metal bottom board 6 provided with a high heat generating component 4 on the upper surface, and a wick 7 is provided on the upper and lower opposed surfaces 5a, 5b of the part 5. After the part 5 is reduced under pressure, liquid is sealed therein. Then, the liquid is immersed to the wick 7. In this case, the heat generated from the component 4 is transferred to the liquid in the part 5, moved to the low temperature part in the part 5 as evaporating latent heat, condensed to discharge heat. The liquid is again returned through the wick 7 to the high temperature part, and this is repeated. The wick 7 includes, for example, metal gauze, fiber or felt. Thus, the temperature of an electronic apparatus having spot heat generating distribution of high heat can be made uniform.

Description

[Detailed description of the invention] [! l! FIELD OF THE INVENTION The present invention relates to an electronic device temperature uniformity device used for heating electronic devices.

[Prior art 1] Fig. 3 is a partially broken ll1g4 perspective view showing a conventional example A in which temperature is equalized by heat conduction of a bottom base board on which a bottomless cover housing for enclosing an electronic device is mounted. 4 is a vertical sectional view thereof. In the figure, reference numeral 1 denotes a cover housing for an electronic 112, 3 a metal bottom plate, and 4 a heat-generating component that generates spot heat inside the electronic m511. The heat generated by the high heat generation component 4 is transferred to the bottom board 3 that is in contact with it, and is diffused by the heat conduction, lowering the temperature of the high heat generation component 4, and
The temperature of 1 was made uniform.

[Problems to be Solved by the Invention] Incidentally, in a device that generates a small amount of heat, it was originally possible to sufficiently equalize the humidity by heat conduction of the metal plate that constitutes the cover housing 2 of the electronic device 1. However, due to the miniaturization and high output of the components of the electronic device 1, the amount of heat generated increases and the heat generation occurs in spots. I! has no choice but to be thicker, which increases the weight of the electronic device 1! There was a problem.

In this respect, an object of the present invention is to provide a device that equalizes the concentration of a miniaturized, highly heat-generating electronic device by making the cover casing of the electronic device lightweight and increasing heat conduction.

[Means for Solving the Problems] The above-mentioned problems are solved according to the present invention, in which the temperature equalization device for the 61-device device is arranged so that the inside of the bottom board on which the electronic device enclosed in the bottomless cover housing is mounted is opened in a hollow section. The weight is reduced by forming a Ba! By adopting the above configuration means that efficiently transports heat between the low-temperature section and the low-temperature section, 3! be done.

[Function] Since the present invention takes the above-mentioned measures, it has a heat transport function higher than the thermal conductivity of the metal material constituting the bottom board on which the electronic II device is mounted, which is covered by the bottomless cover casing. This makes it possible to equalize the temperature of electronic equipment that generates a lot of heat and has a spot-like heat distribution.

[Example] A first embodiment of the invention will be described with reference to FIG.

The same figure is a partially cutaway perspective view of this embodiment B, in which 4 is a high heat generation component, 5 is a hollow part in a metal bottom plate 6, and 7 is a lining on upper and lower opposing surfaces 5a and 5b of the hollow part 5. This is Wick. After reducing the pressure inside the hollow part 5, when a liquid (not shown) is filled in,
The liquid seeps into the wick 7. Note that the third example showing conventional example A
Identical members in FIGS. 4 through 4 are given the same bow.

The heat generated in the high heat generating component 4 is transferred to the liquid in the hollow part 5, becomes latent heat of vaporization, and moves to a low temperature part in the hollow part 5, where it condenses and releases heat. Then, this liquid passes through the wick 7 again and returns to the high fAti,
Repeat this. Wick 7 is wire mesh, IIH
Or you can use felt.

[Example 2] A second embodiment of the invention will be described with reference to FIG.

This figure is a partially cutaway perspective view of Example C. A large number of small grooves 8 are arranged in parallel throughout the inner surface of the hollow portion 5. In this case as well, W2B functions as the wick 7 as in the first embodiment, and the condensed liquid can be returned to the heat generation source with little resistance.

[Advantageous Effects of the Invention 1] Thus, the present invention provides a heat vibrator function in the bottom board on which electronic devices are mounted, increases thermal conductivity in the in-plane direction, and generates heat in spots. This has the advantage of spreading the temperature of heat-generating components and making the temperature of electronic equipment uniform.

[Brief explanation of drawings]

Figure 1 shows the first part of the electronic one-unit temperature equalization device according to the present invention.
FIG. 2 is a partially cutaway perspective view showing the second embodiment of the same as above; FIG. 3 is a partially cutaway perspective view showing the second embodiment; FIG. equipment'at
! FIG. 4 is a partially cutaway perspective view showing a conventional example for making l uniform, and FIG. 4 is a longitudinal cross-sectional view of the same. A, B, C...Electronic equipment temperature equalization device 1...Electronic equipment! 2... Bottomless cover housing 3.6...
Bottom plate 4...High heat generation parts 5...Hollow part
5a, 5b...Upper and lower relative surfaces Figure 1 Figure 2

Claims (1)

[Claims] 1. In a thermally conductive base board on which high heat generating components of an electronic device enclosed in a bottomless cover casing are directly mounted, the hollow part formed inside is lined with wicks at least on the upper and lower opposing surfaces, or many A temperature uniform device for electronic equipment, which is formed by carving a groove in the hollow part, reducing the pressure in the hollow part, and filling a heat transporting liquid.