JPH0373466U - - Google Patents

Info

Publication number
JPH0373466U
JPH0373466U JP13436989U JP13436989U JPH0373466U JP H0373466 U JPH0373466 U JP H0373466U JP 13436989 U JP13436989 U JP 13436989U JP 13436989 U JP13436989 U JP 13436989U JP H0373466 U JPH0373466 U JP H0373466U
Authority
JP
Japan
Prior art keywords
semiconductor
temperature compensation
semiconductor element
wiring board
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13436989U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13436989U priority Critical patent/JPH0373466U/ja
Publication of JPH0373466U publication Critical patent/JPH0373466U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP13436989U 1989-11-21 1989-11-21 Pending JPH0373466U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13436989U JPH0373466U (ko) 1989-11-21 1989-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13436989U JPH0373466U (ko) 1989-11-21 1989-11-21

Publications (1)

Publication Number Publication Date
JPH0373466U true JPH0373466U (ko) 1991-07-24

Family

ID=31681709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13436989U Pending JPH0373466U (ko) 1989-11-21 1989-11-21

Country Status (1)

Country Link
JP (1) JPH0373466U (ko)

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