JPH0373442U - - Google Patents
Info
- Publication number
- JPH0373442U JPH0373442U JP13577389U JP13577389U JPH0373442U JP H0373442 U JPH0373442 U JP H0373442U JP 13577389 U JP13577389 U JP 13577389U JP 13577389 U JP13577389 U JP 13577389U JP H0373442 U JPH0373442 U JP H0373442U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- semiconductor
- lead frame
- molding machine
- butt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13577389U JPH0373442U (fi) | 1989-11-21 | 1989-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13577389U JPH0373442U (fi) | 1989-11-21 | 1989-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373442U true JPH0373442U (fi) | 1991-07-24 |
Family
ID=31683018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13577389U Pending JPH0373442U (fi) | 1989-11-21 | 1989-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373442U (fi) |
-
1989
- 1989-11-21 JP JP13577389U patent/JPH0373442U/ja active Pending