JPH0373423U - - Google Patents
Info
- Publication number
- JPH0373423U JPH0373423U JP13552189U JP13552189U JPH0373423U JP H0373423 U JPH0373423 U JP H0373423U JP 13552189 U JP13552189 U JP 13552189U JP 13552189 U JP13552189 U JP 13552189U JP H0373423 U JPH0373423 U JP H0373423U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- terminals
- internal electrodes
- external
- grounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の３端子一体形積層チツプコン
デンサの斜視図、第２図は一部切断斜視図、第３
図は等価回路図、第４図は本考案の３端子一体形
積層チツプコンデンサの主要製造工程を示す斜視
図、第５図は本考案の３端子形積層チツプコンデ
ンサの使用例を示す斜視図、第６図は従来の貫通
形コンデンサの断面図、第７図は従来の貫通形コ
ンデンサの使用例を示す斜視図である。
１ａ，１ｂ……貫通端子用外部電極、１ｃ……
内部電極、２……接地端子用外部電極、２ｃ……
内部電極、３……磁器誘電体、４……回路基板、
５……シールド板。
Fig. 1 is a perspective view of the three-terminal integrated multilayer chip capacitor of the present invention, Fig. 2 is a partially cutaway perspective view, and Fig.
The figure is an equivalent circuit diagram, FIG. 4 is a perspective view showing the main manufacturing process of the three-terminal integrated multilayer chip capacitor of the present invention, and FIG. 5 is a perspective view showing an example of use of the three-terminal multilayer chip capacitor of the present invention. FIG. 6 is a sectional view of a conventional feedthrough capacitor, and FIG. 7 is a perspective view showing an example of use of the conventional feedthrough capacitor. 1a, 1b...External electrode for through terminal, 1c...
Internal electrode, 2... External electrode for ground terminal, 2c...
internal electrode, 3...porcelain dielectric, 4...circuit board,
5... Shield plate.
Claims (1)
に反対方向の一方の端部から他方の端部まで平行
に一定間隔をおいて形成された複数の貫通端子用
内部電極と、前記内部電極と直角方向に位置する
互いに反対方向の一方の端部から他方の端部まで
平行に形成された接地用内部電極を交互に複数個
配置し、それぞれの端部にて外部電極により複数
個の貫通端子用内部電極および接地端子用内部電
極を接合することにより、複数組の貫通端子用外
部電極を一定間隔をおいて外周表面に設け、さら
に前記複数組の貫通端子用外部電極の間に前記外
部電極と一定間隔を設けて接地用外部電極を外周
表面全面にわたつて設けた３端子一体形積層チツ
プコンデンサ。 A plurality of internal electrodes for through terminals are formed on a plurality of laminated ceramic dielectric sheets in parallel with each other at regular intervals from one end to the other in opposite directions, and a plurality of internal electrodes are formed at right angles to the internal electrodes. A plurality of internal electrodes for grounding are alternately arranged in parallel from one end to the other in opposite directions, and external electrodes are used at each end for multiple through terminals. By joining the internal electrodes and the internal electrodes for grounding terminals, a plurality of sets of external electrodes for through-hole terminals are provided on the outer peripheral surface at regular intervals, and further between the plurality of sets of external electrodes for through-hole terminals, the external electrodes and A three-terminal integrated multilayer chip capacitor with external grounding electrodes placed at regular intervals over the entire outer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13552189U JPH0373423U (en) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13552189U JPH0373423U (en) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373423U true JPH0373423U (en) | 1991-07-24 |
Family
ID=31682788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13552189U Pending JPH0373423U (en) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373423U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080751A (en) * | 2008-09-26 | 2010-04-08 | Tdk Corp | Chip type electronic part |
-
1989
- 1989-11-22 JP JP13552189U patent/JPH0373423U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080751A (en) * | 2008-09-26 | 2010-04-08 | Tdk Corp | Chip type electronic part |
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