JPH0373420U - - Google Patents
Info
- Publication number
- JPH0373420U JPH0373420U JP13462289U JP13462289U JPH0373420U JP H0373420 U JPH0373420 U JP H0373420U JP 13462289 U JP13462289 U JP 13462289U JP 13462289 U JP13462289 U JP 13462289U JP H0373420 U JPH0373420 U JP H0373420U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- laminated
- end surface
- films
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第1図は本考案の積層セラミツクのチツプ型コ
ンデンサを示めす図面、第2図はその平面図、第
3図は本考案の他の実施例、第4図は従来例、第
5図はその平面図である。
1……積層セラミツクのチツプ型コンデンサ、
2……セラミツク膜、3……内部電極、4……外
部電極、5……プリント絶縁基板、6……回路パ
ターン、7……別の回路パターン。
Fig. 1 is a drawing showing a multilayer ceramic chip capacitor of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is another embodiment of the present invention, Fig. 4 is a conventional example, and Fig. 5 is the same. FIG. 1... Multilayer ceramic chip capacitor,
2... Ceramic film, 3... Internal electrode, 4... External electrode, 5... Printed insulating board, 6... Circuit pattern, 7... Another circuit pattern.
Claims (1)
後圧着、焼成、外部電極形成を行う積層セラミツ
クコンデンサにおいて、複数個の前記積層セラミ
ツク膜の最下端面或いは最上端面に前記セラミツ
ク膜よりも誘電率の低い誘電体層を添着して一体
構成する積層セラミツクのチツプ型コンデンサ。 In a laminated ceramic capacitor in which ceramic films and internal electrodes are alternately laminated, and then pressure bonded, fired, and external electrodes are formed, the lowermost end surface or the uppermost end surface of the plurality of laminated ceramic films has a dielectric constant lower than that of the ceramic film. A multilayer ceramic chip capacitor that is integrally constructed with a dielectric layer attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13462289U JPH0373420U (en) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13462289U JPH0373420U (en) | 1989-11-20 | 1989-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0373420U true JPH0373420U (en) | 1991-07-24 |
Family
ID=31681947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13462289U Pending JPH0373420U (en) | 1989-11-20 | 1989-11-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0373420U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015065414A (en) * | 2013-08-30 | 2015-04-09 | 太陽誘電株式会社 | Multilayer ceramic capacitor |
JP2018088534A (en) * | 2012-07-20 | 2018-06-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
-
1989
- 1989-11-20 JP JP13462289U patent/JPH0373420U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018088534A (en) * | 2012-07-20 | 2018-06-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
JP2015065414A (en) * | 2013-08-30 | 2015-04-09 | 太陽誘電株式会社 | Multilayer ceramic capacitor |
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