JPH0371681U - - Google Patents
Info
- Publication number
- JPH0371681U JPH0371681U JP13350189U JP13350189U JPH0371681U JP H0371681 U JPH0371681 U JP H0371681U JP 13350189 U JP13350189 U JP 13350189U JP 13350189 U JP13350189 U JP 13350189U JP H0371681 U JPH0371681 U JP H0371681U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wiring board
- multilayer wiring
- wire bonding
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13350189U JPH0371681U (enExample) | 1989-11-16 | 1989-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13350189U JPH0371681U (enExample) | 1989-11-16 | 1989-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371681U true JPH0371681U (enExample) | 1991-07-19 |
Family
ID=31680903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13350189U Pending JPH0371681U (enExample) | 1989-11-16 | 1989-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371681U (enExample) |
-
1989
- 1989-11-16 JP JP13350189U patent/JPH0371681U/ja active Pending