JPH0371636U - - Google Patents
Info
- Publication number
- JPH0371636U JPH0371636U JP13325989U JP13325989U JPH0371636U JP H0371636 U JPH0371636 U JP H0371636U JP 13325989 U JP13325989 U JP 13325989U JP 13325989 U JP13325989 U JP 13325989U JP H0371636 U JPH0371636 U JP H0371636U
- Authority
- JP
- Japan
- Prior art keywords
- connection
- pattern layer
- base film
- connection terminal
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000011888 foil Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13325989U JPH0371636U (en, 2012) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13325989U JPH0371636U (en, 2012) | 1989-11-15 | 1989-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371636U true JPH0371636U (en, 2012) | 1991-07-19 |
Family
ID=31680668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13325989U Pending JPH0371636U (en, 2012) | 1989-11-15 | 1989-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371636U (en, 2012) |
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1989
- 1989-11-15 JP JP13325989U patent/JPH0371636U/ja active Pending