JPH0369243U - - Google Patents
Info
- Publication number
- JPH0369243U JPH0369243U JP13230989U JP13230989U JPH0369243U JP H0369243 U JPH0369243 U JP H0369243U JP 13230989 U JP13230989 U JP 13230989U JP 13230989 U JP13230989 U JP 13230989U JP H0369243 U JPH0369243 U JP H0369243U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- circuit board
- hole
- metal
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230989U JPH0369243U (Direct) | 1989-11-13 | 1989-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230989U JPH0369243U (Direct) | 1989-11-13 | 1989-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369243U true JPH0369243U (Direct) | 1991-07-09 |
Family
ID=31679775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13230989U Pending JPH0369243U (Direct) | 1989-11-13 | 1989-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369243U (Direct) |
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1989
- 1989-11-13 JP JP13230989U patent/JPH0369243U/ja active Pending